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1. 发明公开

US20240119622A1 OBJECT RECOGNITION METHOD OF THREE-DIMENSIONAL SPACE AND COMPUTING APPARATUS 审中-公开
公开(公告)号：US20240119622A1
公开(公告)日：2024-04-11
申请号：US18454076
申请日：2023-08-23
申请人： Yu-Wei Tu
发明人： Yu-Wei Tu , Chun-Kai Chang
IPC分类号： G06T7/70 , G06T7/90 , G06T17/00 , H04N23/695
CPC分类号： G06T7/70 , G06T7/90 , G06T17/00 , H04N23/695 , G06T2207/10024 , G06V2201/07
摘要： An object recognition method of a three-dimensional (3D) space and a computing apparatus are provided. In the method, multiple sensing points in the 3D space are allocated to multiple areas. The 3D space is established by the sensing points generated by scanning a space. Multiple 2D images of each of the areas are captured. The 2D images of each of the areas are recognized. One or more objects in the 3D space are determined according to a recognized result of the 2D images of the areas. Accordingly, the object in the 3D space may be recognized.

2. 发明申请

US20190299238A1 REWINDING WATERWHEEL, TRANSMISSION GEARBOX OF THE WATERWHEEL, AND IRRIGATION METHOD THEREOF 审中-公开
公开(公告)号：US20190299238A1
公开(公告)日：2019-10-03
申请号：US15989649
申请日：2018-05-25
申请人： Wei TU
发明人： Wei TU
IPC分类号： B05B13/00 , F16H37/02 , B05B3/04
摘要： A rewinding waterwheel includes a secondary body, a main body and guide members. The main body includes a rewinding waterwheel frame, a hub ring shaft and a water pipe wound around the hub ring shaft. The hub ring shaft is installed onto the rewinding waterwheel frame and rotatable. The secondary body includes a waterwheel frame and a sprinkler head mounted onto the waterwheel frame. The water pipe is fixed and communicated to the sprinkler head; the guide member is installed on the ground; the water pipe is in a rolling contact with the outer circumferential surface of the guide member. In a water spray method of the rewinding waterwheel, a traveling path is designed to achieve automatic lawn irrigation by the guide member in contact with the water pipe and to change the irrigation speed by the transmission gearbox to control water volume and save energy.

3. 发明授权

US09508617B2 Test chip, test board and reliability testing method 有权
标题翻译：测试芯片，测试板和可靠性测试方法
公开(公告)号：US09508617B2
公开(公告)日：2016-11-29
申请号：US13411193
申请日：2012-03-02
申请人： Shiang-Ruei Su , Liang-Chen Lin , Chia-Wei Tu
发明人： Shiang-Ruei Su , Liang-Chen Lin , Chia-Wei Tu
IPC分类号： H01L21/66 , G01R31/28
CPC分类号： G01R31/2856 , H01L21/4853 , H01L22/14 , H01L22/34 , H01L24/16 , H01L2224/16157 , H01L2924/0002 , H01L2924/00
摘要： A test board includes a first chip mounting area, a first input area, a second input area, a first output area, and a second output area. The test board also includes a first conductive pattern, a second conductive pattern, a third conductive pattern, and a fourth conductive pattern. The first conductive pattern electrically connects a first pin of the first input area and a first pin of the first chip mounting area. The second conductive pattern electrically connects a first pin of the second input area and a second pin of the first chip mounting area. The third conductive pattern electrically connects a first pin of the first output area and a third pin of the first chip mounting area. The fourth conductive pattern electrically connects a first pin of the second output area and a fourth pin of the first chip mounting area.
摘要翻译：测试板包括第一芯片安装区域，第一输入区域，第二输入区域，第一输出区域和第二输出区域。测试板还包括第一导电图案，第二导电图案，第三导电图案和第四导电图案。第一导电图形电连接第一输入区域的第一引脚和第一芯片安装区域的第一引脚。第二导电图形电连接第二输入区域的第一引脚和第一芯片安装区域的第二引脚。第三导电图形电连接第一输出区域的第一引脚和第一芯片安装区域的第三引脚。第四导电图形电连接第二输出区域的第一引脚和第一芯片安装区域的第四引脚。

4. 发明授权

US09196532B2 Integrated circuit packages and methods for forming the same 有权
标题翻译：集成电路封装及其形成方法
公开(公告)号：US09196532B2
公开(公告)日：2015-11-24
申请号：US13529179
申请日：2012-06-21
申请人： Chia-Wei Tu , Yian-Liang Kuo , Wen-Hsiung Lu , Hsien-Wei Chen , Tsung-Fu Tsai
发明人： Chia-Wei Tu , Yian-Liang Kuo , Wen-Hsiung Lu , Hsien-Wei Chen , Tsung-Fu Tsai
IPC分类号： H01L21/78 , H01L23/522 , H01L23/31 , H01L23/00
CPC分类号： H01L23/3135 , H01L21/78 , H01L23/3107 , H01L23/3157 , H01L23/585 , H01L24/03 , H01L24/05 , H01L24/13 , H01L24/15 , H01L2224/02331 , H01L2224/02377 , H01L2224/0401 , H01L2224/0502 , H01L2224/05022 , H01L2224/05099 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05186 , H01L2224/05548 , H01L2224/05567 , H01L2224/05573 , H01L2224/05582 , H01L2224/05599 , H01L2224/05647 , H01L2224/13022 , H01L2224/13024 , H01L2224/13111 , H01L2224/16225 , H01L2224/94 , H01L2924/00014 , H01L2924/01029 , H01L2924/01047 , H01L2924/14 , H01L2224/03 , H01L2224/05 , H01L2924/04941 , H01L2924/04953 , H01L2224/05552
摘要： A method includes forming an electrical connector over a substrate of a wafer, and molding a polymer layer, with at least a portion of the electrical connector molded in the polymer layer. A first sawing step is performed to form a trench in the polymer layer. After the first sawing step, a second sawing step is performed to saw the wafer into a plurality of dies.
摘要翻译：一种方法包括在晶片的衬底上形成电连接器，并模制聚合物层，至少一部分电连接器模制在聚合物层中。执行第一锯切步骤以在聚合物层中形成沟槽。在第一锯切步骤之后，执行第二锯切步骤以将晶片看成多个模具。

5. 发明申请

US20130127052A1 Methods and Apparatus of Packaging Semiconductor Devices 有权
标题翻译：封装半导体器件的方法和装置
公开(公告)号：US20130127052A1
公开(公告)日：2013-05-23
申请号：US13302551
申请日：2011-11-22
申请人： Chia-Wei Tu , Yian-Liang Kuo , Tsung-Fu Tsai , Ru-Ying Huang , Ming-Song Sheu , Hsien-Wei Chen
发明人： Chia-Wei Tu , Yian-Liang Kuo , Tsung-Fu Tsai , Ru-Ying Huang , Ming-Song Sheu , Hsien-Wei Chen
IPC分类号： H01L23/498 , H01L21/60
CPC分类号： H01L24/13 , H01L23/3114 , H01L23/3171 , H01L23/525 , H01L24/05 , H01L24/11 , H01L2224/02331 , H01L2224/0235 , H01L2224/02375 , H01L2224/0346 , H01L2224/0401 , H01L2224/05548 , H01L2224/0555 , H01L2224/05552 , H01L2224/0558 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/1132 , H01L2224/1146 , H01L2224/13006 , H01L2224/13021 , H01L2224/13024 , H01L2224/13027 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2924/01023 , H01L2924/3512 , H01L2924/00014 , H01L2924/00012
摘要： Methods and apparatuses for wafer level packaging (WLP) semiconductor devices are disclosed. A redistribution layer (RDL) is formed on a first passivation layer in contact with a conductive pad over a surface of a die. The RDL layer is on top of a first region of the first passivation layer. A second passivation layer is formed on the RDL layer with an opening to expose the RDL layer, and over the first passivation layer. An under bump metallization (UBM) layer is formed over the second passivation layer in contact with the exposed RDL layer. A second region of the first passivation layer disjoint from the first region is determined by projecting an outer periphery of a solder ball or other connector onto the surface.
摘要翻译：公开了晶片级封装（WLP）半导体器件的方法和装置。再次分布层（RDL）形成在与导体表面上的导电焊盘接触的第一钝化层上。 RDL层位于第一钝化层的第一区域之上。在具有开口的RDL层上形成第二钝化层以暴露RDL层，并且在第一钝化层上方。在与暴露的RDL层接触的第二钝化层上形成凸块下金属化（UBM）层。通过将焊球或其它连接器的外周突出到表面上来确定与第一区域不相交的第一钝化层的第二区域。

6. 发明申请

US20120231560A1 LIGHT-EMITTING DEVICE HAVING A THINNED STRUCTURE AND THE MANUFACTURING METHOD THEREOF 有权
标题翻译：具有薄壁结构的发光装置及其制造方法
公开(公告)号：US20120231560A1
公开(公告)日：2012-09-13
申请号：US13478698
申请日：2012-05-23
申请人： Min-Hsun Hsieh , Chih-Chiang Lu , Chien-Yuan Wang , Yen-Wen Chen , Jui-Hung Yeh , Shih-Chin Hung , Yu-Wei Tu , Chun-Yi Wu , Wei-Chih Peng
发明人： Min-Hsun Hsieh , Chih-Chiang Lu , Chien-Yuan Wang , Yen-Wen Chen , Jui-Hung Yeh , Shih-Chin Hung , Yu-Wei Tu , Chun-Yi Wu , Wei-Chih Peng
IPC分类号： H01L21/66
CPC分类号： H01L33/0079 , H01L33/382 , H01L33/387 , H01L33/642
摘要： A semiconductor light-emitting device having a thinned structure comprises a thinned structure formed between a semiconductor light-emitting structure and a carrier. The manufacturing method comprises the steps of forming a semiconductor light-emitting structure above a substrate; attaching the semiconductor light-emitting structure to a support; thinning the substrate to form a thinned structure; forming or attaching a carrier to the thinned substrate; and removing the support.
摘要翻译：具有减薄结构的半导体发光器件包括在半导体发光结构和载体之间形成的薄化结构。该制造方法包括以下步骤：在衬底上形成半导体发光结构; 将半导体发光结构附着到支撑体上; 使衬底变薄以形成薄的结构; 将载体形成或附着到薄化的基底上; 并移除支持。

7. 外观设计

USD624022S1 Connector assembly 有权
公开(公告)号：USD624022S1
公开(公告)日：2010-09-21
申请号：US29341595
申请日：2009-08-10
申请人： Ta-Wei Liu , Chih-Wei Tu
设计人： Ta-Wei Liu , Chih-Wei Tu

8. 外观设计

USD615499S1 Plug connector 有权
公开(公告)号：USD615499S1
公开(公告)日：2010-05-11
申请号：US29341596
申请日：2009-08-10
申请人： Ta-Wei Liu , Chih-Wei Tu
设计人： Ta-Wei Liu , Chih-Wei Tu

9. 发明申请

US20080287007A1 CONNECTOR FOR FIRST AND SECOND JOINTS HAVING DIFFERENT PIN QUANTITIES, ELECTRONIC APPARATUS WITH CONNECTOR AND COMBINATION 有权
标题翻译：具有不同引脚数量的第一和第二接头连接器，带连接器和组合的电子设备
公开(公告)号：US20080287007A1
公开(公告)日：2008-11-20
申请号：US12182152
申请日：2008-07-30
申请人： Chih-Wei Tu , Yu-Jing Liao , I-Cheng Chuang
发明人： Chih-Wei Tu , Yu-Jing Liao , I-Cheng Chuang
IPC分类号： H01R13/648
CPC分类号： H01R27/00 , H01R13/6456 , H01R31/06
摘要： A connector and an electronic apparatus and a combination comprising the connector for first and second joints are disclosed. The connector includes a base, a plurality of first pins, and a plurality of second pins. The base has a first and a second connecting surface. The first pins are disposed on the first connecting surface and the quantity of the first pins is the same as the pin quantity of the first joint. In addition, the second pins are disposed on the second connecting surface and the total quantity of the second pins and the first pins is the same as the pin quantity of the second joint. The base may include two convex parts and a concave part. The first connecting surface and the second connecting surface are disposed on surfaces of the two convex parts respectively. The concave part accommodates the two convex parts.
摘要翻译：公开了一种连接器和电子设备以及包括用于第一和第二接头的连接器的组合。连接器包括基座，多个第一引脚和多个第二引脚。基座具有第一和第二连接表面。第一销布置在第一连接表面上，并且第一销的数量与第一接头的销数量相同。此外，第二销布置在第二连接表面上，并且第二销和第一销的总量与第二关节的销量相同。基部可以包括两个凸部和凹部。第一连接表面和第二连接表面分别设置在两个凸部的表面上。凹部容纳两个凸部。

10. 发明申请

US20070154065A1 Apparatus and method for generating a transmit frame 失效
标题翻译：用于产生发送帧的装置和方法
公开(公告)号：US20070154065A1
公开(公告)日：2007-07-05
申请号：US11638833
申请日：2006-12-13
申请人： Wolfgang Kellerer , Eckehard Steinbach , Wei Tu
发明人： Wolfgang Kellerer , Eckehard Steinbach , Wei Tu
IPC分类号： G06K9/00
CPC分类号： H04N21/2662 , H04N19/114 , H04N19/132 , H04N19/147 , H04N19/152 , H04N19/172 , H04N19/19 , H04N19/587 , H04N19/895
摘要： An apparatus for generating a transmit frame from an information signal, the information signal comprising a first information frame and a second information frame, comprises a provider for providing a first reconstruction distortion value indicating a reconstruction distortion when replacing the first information frame by a replacement frame, and for providing a second reconstruction distortion value indicating a reconstruction distortion when replacing the second information frame by a replacement frame, means for introducing either the first information frame or the second information frame into the transmit frame in dependence on the first reconstruction distortion value or in dependence on the second reconstruction value. In accordance with the present invention, a rate-distortion optimized rate reduction can be achieved.
摘要翻译：一种用于从信息信号生成发送帧的装置，所述信息信号包括第一信息帧和第二信息帧，所述信息信号包括提供者，用于在替换帧中的替换帧时，提供指示重建失真的第一重构失真值并且用于当通过替换帧替换第二信息帧时提供指示重建失真的第二重建失真值，用于根据第一重建失真值将第一信息帧或第二信息帧引入发送帧的装置，或者依赖于第二重建值。根据本发明，可以实现速率失真优化的速率降低。

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