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1. 发明授权

US07706149B2 Micro-electro-mechanical-system package and method for manufacturing the same 有权
标题翻译：微机电系统封装及其制造方法
公开(公告)号：US07706149B2
公开(公告)日：2010-04-27
申请号：US12126043
申请日：2008-05-23
申请人： Hsueh An Yang , Meng Jen Wang , Wei Chung Wang , Ming Chiang Lee , Wei Pin Huang , Feng Chen Cheng
发明人： Hsueh An Yang , Meng Jen Wang , Wei Chung Wang , Ming Chiang Lee , Wei Pin Huang , Feng Chen Cheng
IPC分类号： H05K1/11
CPC分类号： B81C1/0023 , B81B2201/0257 , H01L2224/48091 , H01L2224/48227 , H01L2924/1461 , H01L2924/3025 , Y10T29/49162 , H01L2924/00014 , H01L2924/00
摘要： A MEMS package includes a first board, a second board and a laminate material. The first board includes a lower metallic trace, a metallic diaphragm and a through opening. The lower metallic trace is located on the lower surface of the first board, and the metallic diaphragm is disposed on the lower metallic trace. The second board includes an upper metallic trace and a metallic electrode. The upper metallic trace is located on the upper surface of the second board, the metallic electrode is disposed on the upper metallic trace, and the metallic electrode is corresponding to the metallic diaphragm. The laminate material is disposed between the lower and upper metallic traces, and includes a hollow portion for accommodating the metallic electrode and metallic diaphragm, wherein a sensing unit is formed by the metallic electrode, the hollow portion and the metallic diaphragm, and is corresponding to the through opening.
摘要翻译： MEMS封装包括第一板，第二板和层压材料。第一板包括下金属痕迹，金属隔膜和通孔。下部金属轨迹位于第一板的下表面上，并且金属隔膜设置在下部金属轨迹上。第二板包括上金属痕迹和金属电极。上金属轨迹位于第二板的上表面上，金属电极设置在上金属轨迹上，金属电极对应于金属隔膜。层压材料设置在下金属轨迹和上金属迹线之间，并且包括用于容纳金属电极和金属隔膜的中空部分，其中感测单元由金属电极，中空部分和金属隔膜形成，并且对应于通过开口。

2. 发明申请

US20080100719A1 Electronic device 审中-公开
标题翻译：电子设备
公开(公告)号：US20080100719A1
公开(公告)日：2008-05-01
申请号：US11657103
申请日：2007-01-24
申请人： Wei-Pin Huang
发明人： Wei-Pin Huang
IPC分类号： H04N5/232
CPC分类号： H04N5/2252 , H04M1/0264 , H04M1/035 , H04M1/271 , H04M1/72533 , H04M2250/52 , H04N7/142 , H04N2007/145
摘要： An electronic device includes a host, a microphone module, a first camera module, a second camera module, a driving module and a control module. The microphone module is connected to the host. The first camera module and the second camera module are respectively disposed at two opposite sides of the host. The driving module disposed in the host drives the first camera module or the second camera module to turn. The control module disposed in the host is connected to the microphone module, the first camera module, the second camera module and the driving m
摘要翻译：电子设备包括主机，麦克风模块，第一相机模块，第二相机模块，驱动模块和控制模块。麦克风模块连接到主机。第一相机模块和第二相机模块分别设置在主机的两个相对侧。设置在主机中的驱动模块驱动第一相机模块或第二相机模块转动。设置在主机中的控制模块连接到麦克风模块，第一相机模块，第二相机模块和驱动m

3. 发明申请

US20090046436A1 MICRO-ELECTRO-MECHANICAL-SYSTEM PACKAGE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：微电子机械系统包装及其制造方法
公开(公告)号：US20090046436A1
公开(公告)日：2009-02-19
申请号：US12126043
申请日：2008-05-23
申请人： Hsueh An YANG , Meng Jen WANG , Wei Chung WANG , Ming Chiang LEE , Wei Pin HUANG , Feng Chen CHENG
发明人： Hsueh An YANG , Meng Jen WANG , Wei Chung WANG , Ming Chiang LEE , Wei Pin HUANG , Feng Chen CHENG
IPC分类号： H05K1/00 , H05K3/10
CPC分类号： B81C1/0023 , B81B2201/0257 , H01L2224/48091 , H01L2224/48227 , H01L2924/1461 , H01L2924/3025 , Y10T29/49162 , H01L2924/00014 , H01L2924/00
摘要： A MEMS package includes a first board, a second board and a laminate material. The first board includes a lower metallic trace, a metallic diaphragm and a through opening. The lower metallic trace is located on the lower surface of the first board, and the metallic diaphragm is disposed on the lower metallic trace. The second board includes an upper metallic trace and a metallic electrode. The upper metallic trace is located on the upper surface of the second board, the metallic electrode is disposed on the upper metallic trace, and the metallic electrode is corresponding to the metallic diaphragm. The laminate material is disposed between the lower and upper metallic traces, and includes a hollow portion for accommodating the metallic electrode and metallic diaphragm, wherein a sensing unit is formed by the metallic electrode, the hollow portion and the metallic diaphragm, and is corresponding to the through opening.
摘要翻译： MEMS封装包括第一板，第二板和层压材料。第一板包括下金属痕迹，金属隔膜和通孔。下部金属轨迹位于第一板的下表面上，并且金属隔膜设置在下部金属轨迹上。第二板包括上金属痕迹和金属电极。上金属轨迹位于第二板的上表面上，金属电极设置在上金属轨迹上，金属电极对应于金属隔膜。层压材料设置在下金属轨迹和上金属迹线之间，并且包括用于容纳金属电极和金属隔膜的中空部分，其中感测单元由金属电极，中空部分和金属隔膜形成，并且对应于通过开口。

4. 发明申请

US20080078578A1 Transmission system and integrated transmission cable thereof 审中-公开
标题翻译：传输系统及其集成传输电缆
公开(公告)号：US20080078578A1
公开(公告)日：2008-04-03
申请号：US11902028
申请日：2007-09-18
申请人： Yu-Jen Wang , Wei-Pin Huang
发明人： Yu-Jen Wang , Wei-Pin Huang
IPC分类号： H01R4/00
CPC分类号： H01R31/005 , H01B11/125 , H01R24/62
摘要： An integrated transmission cable includes a multi-core cable, a universal serial bus (USB) connector, a network connector and a common connector. The multi-core cable has a first core group and a second core group. The USB connector is electrically connected with a first end of the first core group. The network connector is electrically connected with a first end of the second core group. The common connector is electrically connected with second ends of the first core group and the second core group. A transmission system is also disclosed.
摘要翻译：集成传输电缆包括多芯电缆，通用串行总线（USB）连接器，网络连接器和公共连接器。多芯电缆具有第一核心组和第二核心组。 USB连接器与第一核心组的第一端电连接。网络连接器与第二核心组的第一端电连接。公共连接器与第一芯组和第二芯组的第二端电连接。还公开了传输系统。

5. 发明授权

US07251576B2 System and method for testing CMOS image sensor 有权
标题翻译： CMOS图像传感器的系统和方法
公开(公告)号：US07251576B2
公开(公告)日：2007-07-31
申请号：US11200040
申请日：2005-08-10
申请人： Heng-Lung Su , Wei-Pin Huang , Chang-Shuo Lee
发明人： Heng-Lung Su , Wei-Pin Huang , Chang-Shuo Lee
IPC分类号： G01R31/00 , G06F19/00
CPC分类号： G01R31/2641
摘要： A system and method for testing CMOS image sensors includes a test supporter, a light source controller, an interface card and an image processor. The test supporter supports a CMOS image sensor under test. The light source controller provides a test light to the CMOS image sensor under test. The interface card includes a signal processor and an output port. The signal processor receives a testing data from the CMOS image sensor under test and processes corresponding output data to the output port according to a predetermined output mode. The image processor determines the output mode, and has an input port corresponding to the output port for receiving the output data from the interface card. The image processor determines whether the CMOS image sensor under test is good or not. Therefore, the system can utilize image processors manufactured by various test system manufacturers so as to broaden compatibility.
摘要翻译：用于测试CMOS图像传感器的系统和方法包括测试支持者，光源控制器，接口卡和图像处理器。测试支持者支持正在测试的CMOS图像传感器。光源控制器为测试中的CMOS图像传感器提供测试光。接口卡包括信号处理器和输出端口。信号处理器从测试的CMOS图像传感器接收测试数据，并根据预定的输出模式将相应的输出数据处理到输出端口。图像处理器确定输出模式，并且具有对应于输出端口的输入端口，用于从接口卡接收输出数据。图像处理器确定被测的CMOS图像传感器是否良好。因此，该系统可以利用由各种测试系统制造商制造的图像处理器，以扩大兼容性。

6. 发明申请

US20060036391A1 System and method for testing CMOS image sensor 有权
标题翻译： CMOS图像传感器的系统和方法
公开(公告)号：US20060036391A1
公开(公告)日：2006-02-16
申请号：US11200040
申请日：2005-08-10
申请人： Heng-Lung Su , Wei-Pin Huang , Chang-Shuo Lee
发明人： Heng-Lung Su , Wei-Pin Huang , Chang-Shuo Lee
IPC分类号： G01R27/28
CPC分类号： G01R31/2641
摘要： The invention relates to a system and method for testing CMOS image sensor. The system for testing CMOS image sensor comprises: a test supporter, a light source controller, an interface card and an image processor. The test supporter is used to support a CMOS image sensor under test. The light source controller provides a test light to the CMOS image sensor under test. The interface card comprises a signal processor and an output port. The signal processor is used for receiving a testing data from the CMOS image sensor under test and for processing corresponding output data to the output port according to a predetermined output mode. The image processor determines the output mode, and has an input port corresponding to the output port so as to receive the output data from the interface card. The image processor is used to determine whether the CMOS image sensor under test is good or not. Therefore, the system of the invention can utilize the image processor manufactured from various test system manufacturers so as to broaden the compatibility of the element of the system of the invention.
摘要翻译：本发明涉及一种用于测试CMOS图像传感器的系统和方法。用于测试CMOS图像传感器的系统包括：测试支持者，光源控制器，接口卡和图像处理器。测试支持者用于支持正在测试的CMOS图像传感器。光源控制器为测试中的CMOS图像传感器提供测试光。接口卡包括信号处理器和输出端口。信号处理器用于从被测CMOS文件传感器接收测试数据，并根据预定的输出模式处理相应的输出数据到输出端口。图像处理器确定输出模式，并且具有与输出端口相对应的输入端口，以便从接口卡接收输出数据。图像处理器用于确定被测CMOS图像传感器是否良好。因此，本发明的系统可以利用由各种测试系统制造商制造的图像处理器，以扩大本发明的系统的元件的兼容性。

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