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1. 再颁专利

USRE40218E1 Electro-chemical deposition system and method of electroplating on substrates 失效
标题翻译：电化学沉积系统和电镀在基片上的方法
公开(公告)号：USRE40218E1
公开(公告)日：2008-04-08
申请号：US10622001
申请日：2003-07-17
申请人： Uziel Landau
发明人： Uziel Landau
IPC分类号： C25D5/00
CPC分类号： C25D17/001 , C25D3/38 , C25D7/123
摘要： The invention provides an apparatus and a method for achieving reliable, consistent metal electroplating or electrochemical deposition onto semiconductor substrates. More particularly, the invention provides uniform and void-free deposition of metal onto metal seeded semiconductor substrates having sub-micron, high aspect ratio features. The invention provides an electrochemical deposition cell comprising a substrate holder, a cathode electrically contacting a substrate plating surface, an electrolyte container having an electrolyte inlet, an electrolyte outlet and an opening adapted to receive a substrate plating surface and an anode electrically connect to an electrolyte. Preferably, a vibrator is attached to the substrate holder to vibrate the substrate in at least one direction, and an auxiliary electrode is disposed adjacent the electrolyte outlet to provide uniform deposition across the substrate surface. Preferably, a periodic reverse current is applied during the plating period to provide a void-free metal layer within high aspect ratio features on the substrate.
摘要翻译：本发明提供了一种用于在半导体衬底上实现可靠，一致的金属电镀或电化学沉积的装置和方法。更具体地，本发明提供均匀且无空隙的金属沉积到具有亚微米，高纵横比特征的金属种子半导体衬底上。本发明提供了一种电化学沉积池，其包括基板保持器，与基板电镀表面电接触的阴极，具有电解质入口的电解质容器，电解液出口和适于接收基板电镀表面的开口和阳极电连接到电解质。优选地，将振动器附接到基板保持器以在至少一个方向上振动基板，并且辅助电极设置在电解液出口附近以提供穿过基板表面的均匀沉积。优选地，在电镀周期期间施加周期性反向电流，以在衬底上的高纵横比特征内提供无空隙的金属层。

2. 发明授权

US06596151B2 Electrodeposition chemistry for filling of apertures with reflective metal 有权
公开(公告)号：US06596151B2
公开(公告)日：2003-07-22
申请号：US09935530
申请日：2001-08-20
申请人： Uziel Landau , John J. D'Urso
发明人： Uziel Landau , John J. D'Urso
IPC分类号： C25D338
CPC分类号： C25D3/38 , C25D7/12
摘要： The present invention provides plating solutions, particularly copper plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features formed on substrates with none or low supporting electrolyte, i.e., which include no acid, low acid, no base, or no conducting salts, and/or high metal ion, e.g., copper, concentration. Defect free filling of features is enhanced by a plating solution containing blends of polyethers (“carrier”) and organic divalent sulfur compounds (“accelerator”), wherein the concentration of the carrier ranges from about 0.1 ppm to about 2500 ppm of the plating solution, and the concentration of the accelerator ranges from about 0.05 ppm to about 1000 ppm of the plating solution. The plating solution is further improved by adding an organic nitrogen compound at a concentration from about 0.01 ppm to about 1000 ppm to improve the filling of vias on a resistive substrate. The organic nitrogen is preferably a substituted thiadiazole, which is used at concentrations from 0.1 ppm to about 50 ppm of the plating solution, or a quartenary nitrogen compound, which is used at concentrations from about 0.01 ppm to about 500 ppm.

3. 发明授权

US06544399B1 Electrodeposition chemistry for filling apertures with reflective metal 有权
标题翻译：用反射金属填充孔的电沉积化学
公开(公告)号：US06544399B1
公开(公告)日：2003-04-08
申请号：US09263653
申请日：1999-03-05
申请人： Uziel Landau , John J. D'Urso
发明人： Uziel Landau , John J. D'Urso
IPC分类号： C25D338
CPC分类号： C25D3/38 , C25D7/12
摘要： The present invention provides plating solutions, particularly copper plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features formed on substrates with none or low supporting electrolyte, i.e., which include no acid, low acid, no base, or no conducting salts, and/or high metal ion, e.g., copper, concentration. Defect free filling of features is enhanced by a plating solution containing blends of polyethers (“carrier”) and organic divalent sulfur compounds (“accelerator”), wherein the concentration of the carrier ranges from about 0.1 ppm to about 2500 ppm of the plating solution, and the concentration of the accelerator ranges from about 0.05 ppm to about 1000 ppm of the plating solution. The plating solution is further improved by adding an organic nitrogen compound at a concentration from about 0.01 ppm to about 1000 ppm to improve the filling of vias on a resistive substrate. The organic nitrogen is preferably a substituted thiadiazole, which is used at concentrations from 0.1 ppm to about 50 ppm of the plating solution, or a quartenary nitrogen compound, which is used at concentrations from about 0.01 ppm to about 500 ppm.
摘要翻译：本发明提供了电镀溶液，特别是镀铜溶液，其设计用于在基底上提供均匀的涂层，并且提供基本上无缺陷的填充形成在基底上的小的特征，其中没有或低的支持电解质，即不包括酸，低酸，无碱，或不含导电盐，和/或高金属离子，例如铜，浓度。通过含有聚醚（“载体”）和有机二价硫化合物（“促进剂”）的共混物的电镀溶液增强了特征的无缺陷填充，其中载体的浓度范围为约0.1ppm至约2500ppm的电镀液，并且加速器的浓度范围为电镀液的约0.05ppm至约1000ppm。通过添加浓度为约0.01ppm至约1000ppm的有机氮化合物来进一步改善电镀溶液，以改善电阻基板上的通孔的填充。有机氮优选为以浓度为约0.01ppm至约500ppm使用的电镀溶液的浓度为0.1ppm至约50ppm或季铵氮化合物的取代噻二唑。

4. 发明授权

US06610191B2 Electro deposition chemistry 失效
公开(公告)号：US06610191B2
公开(公告)日：2003-08-26
申请号：US09992117
申请日：2001-11-13
申请人： Uziel Landau , John J. D'Urso , David B. Rear
发明人： Uziel Landau , John J. D'Urso , David B. Rear
IPC分类号： C25D502
CPC分类号： C25D7/123 , C25D3/38
摘要： The present invention provides plating solutions, particularly metal plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features, e.g., micron scale features and smaller, formed on substrates with none or low supporting electrolyte, i.e., which include no acid, low acid, no base, or no conducting salts, and/or high metal ion, e.g., copper, concentration. Additionally, the plating solutions may contain small amounts of additives which enhance the plated film quality and performance by serving as brighteners, levelers, surfactants, grain refiners, stress reducers, etc.

5. 发明授权

US6077413A Method of making a radioactive stent 失效
标题翻译：制作放射性支架的方法
公开(公告)号：US6077413A
公开(公告)日：2000-06-20
申请号：US19908
申请日：1998-02-06
申请人： Urs Hafeli , Uziel Landau , Matt C. Warburton
发明人： Urs Hafeli , Uziel Landau , Matt C. Warburton
IPC分类号： A61K51/12 , A61L31/08 , A61L31/18 , A61N5/10 , C23C28/02 , C25D3/54 , C25D7/00 , C25D5/10 , A61M36/14 , C23C28/00 , A61L5/103
CPC分类号： C25D3/54 , A61K51/1272 , A61L31/082 , A61L31/16 , A61N5/1002 , C23C28/023 , C25D7/00 , A61L2300/44 , A61L2420/08
摘要： A method for preparing a radioactive, implantable, medical device is provided. The method involves depositing a layer of a radioactive metal that emits beta particles and that has a half-life of between 2 hours and 7 days and a maximum beta energy of between 0.7 and 2.3 MeV onto a metallic surface of the device. In one embodiment, the radioactive metal and a carrier metal are electroplated onto the metallic surface. In another embodiment, a second metallic layer comprising a barrier metal is electroplated onto the radioactive metal layer. A medical device having a metallic surface with a radioactive metallic coating thereon is provided. In one embodiment, the coating comprises a radioactive layer comprising a radioactive metal that emits beta-particles and that has a half-life of between 2 hours and 7 days and an energy level of from about 0.7 MeV to 2.3 MeV and a carrier metal. In another embodiment, the coating further comprises a second layer deposited on the radioactive layer. The second layer comprises a biocompatible metal. A system for applying the radioactive coating to the medical device is also provided The system comprises a package and a sterile electroplating cell contained within the package. The electroplating cell comprises a wall defining a chamber and an electrode attached to the inside wall of the cell or embedded in the inside wall of the cell, so that at least a portion of the electrode is in communication with the chamber. The system further comprises a conductive fastener for electrically connecting the metallic medical device to the power supply and positioning the device within the chamber.
摘要翻译：提供了一种制备放射性，可植入的医疗装置的方法。该方法包括沉积发射β粒子的放射性金属层，其具有2小时至7天的半衰期和0.7至2.3MeV的最大β能量至该器件的金属表面上。在一个实施例中，将放射性金属和载体金属电镀在金属表面上。在另一个实施例中，将包含阻挡金属的第二金属层电镀在放射性金属层上。提供具有金属表面的医疗器械，其上具有放射性金属涂层。在一个实施方案中，涂层包含放射性层，其包含放射性金属，其发射β-粒子，并且具有2小时至7天的半衰期和约0.7MeV至2.3MeV的能级和载体金属。在另一个实施例中，涂层还包括沉积在放射性层上的第二层。第二层包括生物相容性金属。还提供了将放射性涂层施加到医疗装置的系统。该系统包括包装内的包装和无菌电镀电池。电镀单元包括限定室的壁和连接到电池的内壁或嵌入电池的内壁中的电极，使得电极的至少一部分与室连通。该系统还包括用于将金属医疗装置电连接到电源并将装置定位在腔室内的导电紧固件。

6. 发明授权

US4093520A Process for gold plating 失效
标题翻译：镀金工艺
公开(公告)号：US4093520A
公开(公告)日：1978-06-06
申请号：US817267
申请日：1977-07-20
申请人： Donald Eldridge Koontz , Uziel Landau
发明人： Donald Eldridge Koontz , Uziel Landau
IPC分类号： C25D5/02 , C25D5/08 , H05K3/24 , C25D5/16
CPC分类号： C25D5/08 , C25D5/02 , H05K3/241
摘要： The invention is a process for rapidly electroplating certain metals such as gold, nickel, tin-nickel and tin-lead alloys on contact fingers for electronic printed wiring boards. Particularly important is uniform distribution of current amongst the fingers so as to produce uniform metal platings with equal thickness. Also of importance is the provision to alter thickness among the individual fingers so as to plate metal where most needed for particular applications. Uniform and rapid plating are achieved by certain circuit designs together with high parallel flow rates of electroplating solution in the electroplating cell. Both electroplating uniformity and provision for selecting thickness for individual fingers permits savings in amounts of metal used without sacrifices in performance. This is particularly important in the case of gold electroplating because of the high cost and increasing use of gold.
摘要翻译：本发明是用于电子印刷线路板的接触指尖上快速电镀某些金属如金，镍，锡镍和锡铅合金的方法。特别重要的是电流在指状物之间的均匀分布，以便产生相等厚度的均匀金属电镀。同样重要的是提供改变各个手指之间的厚度以便对特定应用最需要的金属板。通过某些电路设计以及电镀槽中的电镀溶液的高平行流速来实现均匀和快速电镀。电镀均匀性和用于选择单个手指厚度的设备都允许在不牺牲性能的情况下节省金属的使用量。在金电镀的情况下，这是特别重要的，因为金的成本高和使用的增加。

7. 发明授权

US4001093A Method of electroplating precious metals in localized areas 失效
标题翻译：在本地化地区电镀金属的方法
公开(公告)号：US4001093A
公开(公告)日：1977-01-04
申请号：US602254
申请日：1975-08-06
申请人： Donald Eldridge Koontz , Uziel Landau
发明人： Donald Eldridge Koontz , Uziel Landau
IPC分类号： C25D5/02
CPC分类号： C25D5/02
摘要： A method of electroplating precious metal in localized areas. The deposits obtained are usually nonuniform and limited to only those areas where coating is actually required thus offering considerable economic savings. The method uses shaped anodes approaching the cathodes very closely, high parallel flow rates of electrolyte and high current densities of at least 100 milliamperes per cm..sup.2 in order to electroplate the precious metal quickly. The preferred precious metal is gold. The method is applied to the coating of electronic circuits and components such as connectors and switches.

8. 发明授权

US06884333B2 Electrochemical system for analyzing performance and properties of electrolytic solutions 失效
标题翻译：用于分析电解液性能和性能的电化学系统
公开(公告)号：US06884333B2
公开(公告)日：2005-04-26
申请号：US10900007
申请日：2004-07-27
申请人： Uziel Landau
发明人： Uziel Landau
IPC分类号： C25D21/12 , G01N27/26
CPC分类号： C25D21/12
摘要： The invention relates to the analysis of the performance and properties of electrochemical processes, and specifically, to electrolytic solutions and electrode processes. The invention discloses a device and a method for obtaining qualitative and quantitative information for the kinetics of the electrode reactions, the transport processes, the thermodynamic properties of the electrochemical processes taking place in the cell. When a deposition reaction takes place, the device provides also valuable information about the relationship between the current density and deposit properties including but not limited to the deposit color, luster, and other aspects of its appearance. The device disclosed herein typically is comprised of a multiplicity of cathodic or anodic regions where one or more electrochemical reactions take place simultaneously, but at a different rate. From the precisely measured segmental currents one can obtain among other process properties: (1) An accurate relationship between the deposit appearance and the current density. This relationship can be used for process diagnostics, troubleshooting, control of concentrations, pH, and additives and contaminants and for optimizing the operating conditions, including the voltage, current, and circulation rate. (2) Quantitative determination of important process parameters including but not limited to, kinetics (e.g., exchange current density, cathodic and anodic transfer coefficients), transport (e.g. conductivity), and thermodynamics (e.g., standard potential). A particularly attractive application of the process is for the quantitative and qualitative processes of alloys plating and for the determination of the relationship between the current efficiency and the applied current density.
摘要翻译：本发明涉及电化学过程的性能和性质的分析，特别涉及电解溶液和电极工艺。本发明公开了一种用于获得电极反应的动力学，运输过程，在电池中发生的电化学过程的热力学性质的定性和定量信息的装置和方法。当沉积反应发生时，该装置还提供关于电流密度和沉积性质之间的关系的有价值的信息，包括但不限于沉积颜色，光泽和其外观的其它方面。本文公开的装置通常包括多个阴极或阳极区域，其中一个或多个电化学反应同时发生，但是以不同的速率进行。从精确测量的分段电流可以获得其他工艺特性：（1）沉积外观与电流密度之间的准确关系。这种关系可用于过程诊断，故障排除，浓度控制，pH，添加剂和污染物以及优化操作条件，包括电压，电流和循环速率。（2）重要工艺参数的定量测定，包括但不限于动力学（例如，交换电流密度，阴极和阳极转移系数），运输（例如电导率）和热力学（例如，标准电位）。该方法的特别有吸引力的应用是合金电镀的定量和定性过程以及电流效率与施加的电流密度之间的关系的确定。

9. 发明授权

US06350366B1 Electro deposition chemistry 失效
标题翻译：电沉积化学
公开(公告)号：US06350366B1
公开(公告)日：2002-02-26
申请号：US09484616
申请日：2000-01-18
申请人： Uziel Landau , John J. D'Urso , David B. Rear
发明人： Uziel Landau , John J. D'Urso , David B. Rear
IPC分类号： C25D712
CPC分类号： C25D7/123 , C25D3/38
摘要： The present invention provides plating solutions, particularly metal plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features, e.g., micron scale features and smaller, formed on substrates with none or low supporting electrolyte, ie., which include no acid, low acid, no base, or no conducting salts, and/or high metal ion, e.g., copper, concentration. Additionally, the plating solutions may contain small amounts of additives which enhance the plated film quality and performance by serving as brighteners, levelers, surfactants, grain refiners, stress reducers, etc.
摘要翻译：本发明提供了电镀溶液，特别是金属电镀溶液，其设计用于在衬底上提供均匀的涂层，并提供基本上无缺陷的填充小特征，例如微米级特征，并且在没有或低支持电解质的衬底上形成较小的特征。，其不包括酸，低酸，无碱或不导电盐，和/或高金属离子，例如铜，浓度。此外，电镀液可以含有少量添加剂，其通过用作增白剂，整理剂，表面活性剂，晶粒细化剂，减压剂等来增强镀膜质量和性能。

10. 发明授权

US4361641A Electrolytic surface modulation 失效
标题翻译：电解表面调制
公开(公告)号：US4361641A
公开(公告)日：1982-11-30
申请号：US320142
申请日：1981-11-10
申请人： John C. Angus , Kathleen M. Tomaswick , Uziel Landau
发明人： John C. Angus , Kathleen M. Tomaswick , Uziel Landau
IPC分类号： G03F7/00 , G03C5/00
CPC分类号： G03F7/00
摘要： The surface of an electrically conductive substrate is electrolytically modulated to a predetermined profile by subjecting the surface to electrodeposition or electrodissolution through ionically conductive body portions of an ionic conductance resist which masks the surface. The rate of passage of ionic species to or from any given point along the masked surface is controlled by the trans-resist ionic conductance or resistance at that point. The predetermined surface profile is generated by providing the resist with a trans-resist ionic conductance or resistance profile which patterns the predetermined surface profile.
摘要翻译：通过使表面经由掩蔽表面的离子导电抗蚀剂的离子导电体部分进行电沉积或电解，将导电基底的表面电解调制成预定的轮廓。沿着掩模的表面离子物质到任何给定点的通过速率由该抗转移离子电导或此时的电阻控制。通过为抗蚀剂提供图案化预定表面轮廓的抗反射离子电导或电阻分布来产生预定的表面轮廓。

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