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1. 发明授权

US06610191B2 Electro deposition chemistry 失效
公开(公告)号：US06610191B2
公开(公告)日：2003-08-26
申请号：US09992117
申请日：2001-11-13
申请人： Uziel Landau , John J. D'Urso , David B. Rear
发明人： Uziel Landau , John J. D'Urso , David B. Rear
IPC分类号： C25D502
CPC分类号： C25D7/123 , C25D3/38
摘要： The present invention provides plating solutions, particularly metal plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features, e.g., micron scale features and smaller, formed on substrates with none or low supporting electrolyte, i.e., which include no acid, low acid, no base, or no conducting salts, and/or high metal ion, e.g., copper, concentration. Additionally, the plating solutions may contain small amounts of additives which enhance the plated film quality and performance by serving as brighteners, levelers, surfactants, grain refiners, stress reducers, etc.

2. 发明授权

US06350366B1 Electro deposition chemistry 失效
标题翻译：电沉积化学
公开(公告)号：US06350366B1
公开(公告)日：2002-02-26
申请号：US09484616
申请日：2000-01-18
申请人： Uziel Landau , John J. D'Urso , David B. Rear
发明人： Uziel Landau , John J. D'Urso , David B. Rear
IPC分类号： C25D712
CPC分类号： C25D7/123 , C25D3/38
摘要： The present invention provides plating solutions, particularly metal plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features, e.g., micron scale features and smaller, formed on substrates with none or low supporting electrolyte, ie., which include no acid, low acid, no base, or no conducting salts, and/or high metal ion, e.g., copper, concentration. Additionally, the plating solutions may contain small amounts of additives which enhance the plated film quality and performance by serving as brighteners, levelers, surfactants, grain refiners, stress reducers, etc.
摘要翻译：本发明提供了电镀溶液，特别是金属电镀溶液，其设计用于在衬底上提供均匀的涂层，并提供基本上无缺陷的填充小特征，例如微米级特征，并且在没有或低支持电解质的衬底上形成较小的特征。，其不包括酸，低酸，无碱或不导电盐，和/或高金属离子，例如铜，浓度。此外，电镀液可以含有少量添加剂，其通过用作增白剂，整理剂，表面活性剂，晶粒细化剂，减压剂等来增强镀膜质量和性能。

3. 发明授权

US06379522B1 Electrodeposition chemistry for filling of apertures with reflective metal 有权
标题翻译：用反射金属填充孔的电沉积化学
公开(公告)号：US06379522B1
公开(公告)日：2002-04-30
申请号：US09227957
申请日：1999-01-11
申请人： Uziel Landau , John J. D'Urso
发明人： Uziel Landau , John J. D'Urso
IPC分类号： C25D338
CPC分类号： C25D3/38 , C25D7/12
摘要： The present invention provides plating solutions, particularly metal plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features formed on substrates with none or low supporting electrolyte, i.e., which include no acid, low acid, no base, or no conducting salts, and/or high metal ion, e.g., copper, concentration. Defect free filling of features is enhanced by a plating solution containing blends of polyalkylene glycols (“carrier”) and organic divalent sulfur compounds (“accelerator”), wherein the concentration of the carrier ranges from about 10 ppm to about 2000 ppm of the plating solution, and the concentration of the accelerator ranges from about 0.1 ppm to about 1000 ppm of the plating solution. The plating solution may be further improved by adding 2-amino-5-methyl-1,3,4-thiadiazole which is used at concentrations from 0 ppm to about 20 ppm of the plating solution.
摘要翻译：本发明提供电镀溶液，特别是金属电镀溶液，其设计用于在基底上提供均匀的涂层，并且提供基本上无缺陷的填充形成在具有无或低的支持电解质的基底上的小特征，即不包括酸，低酸，无碱，或不含导电盐，和/或高金属离子，例如铜，浓度。通过含有聚亚烷基二醇（“载体”）和有机二价硫化合物（“促进剂”）的共混物的电镀液增强了特征的无缺陷填充，其中载体的浓度范围为约10ppm至约2000ppm的电镀溶液，并且加速器的浓度范围为电镀液的约0.1ppm至约1000ppm。通过加入2-氨基-5-甲基-1,3,4-噻二唑可以进一步改善电镀溶液，其浓度为电镀液的0ppm至约20ppm。

4. 发明授权

US6113771A Electro deposition chemistry 失效
公开(公告)号：US6113771A
公开(公告)日：2000-09-05
申请号：US114865
申请日：1998-07-13
申请人： Uziel Landau , John J. D'Urso , David B. Rear
发明人： Uziel Landau , John J. D'Urso , David B. Rear
IPC分类号： C25D3/38 , C25D5/00 , C25D5/54 , C25D7/12 , C25D5/02
CPC分类号： C25D7/123 , C25D3/38
摘要： The present invention provides plating solutions, particularly metal plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features, e.g., micron scale features and smaller, formed on substrates with none or low supporting electrolyte, i.e., which include no acid, low acid, no base, or no conducting salts, and/or high metal ion, e.g., copper, concentration. Additionally, the plating solutions may contain small amounts of additives which enhance the plated film quality and performance by serving as brighteners, levelers, surfactants, grain refiners, stress reducers, etc.

5. 发明授权

US06596151B2 Electrodeposition chemistry for filling of apertures with reflective metal 有权
公开(公告)号：US06596151B2
公开(公告)日：2003-07-22
申请号：US09935530
申请日：2001-08-20
申请人： Uziel Landau , John J. D'Urso
发明人： Uziel Landau , John J. D'Urso
IPC分类号： C25D338
CPC分类号： C25D3/38 , C25D7/12
摘要： The present invention provides plating solutions, particularly copper plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features formed on substrates with none or low supporting electrolyte, i.e., which include no acid, low acid, no base, or no conducting salts, and/or high metal ion, e.g., copper, concentration. Defect free filling of features is enhanced by a plating solution containing blends of polyethers (“carrier”) and organic divalent sulfur compounds (“accelerator”), wherein the concentration of the carrier ranges from about 0.1 ppm to about 2500 ppm of the plating solution, and the concentration of the accelerator ranges from about 0.05 ppm to about 1000 ppm of the plating solution. The plating solution is further improved by adding an organic nitrogen compound at a concentration from about 0.01 ppm to about 1000 ppm to improve the filling of vias on a resistive substrate. The organic nitrogen is preferably a substituted thiadiazole, which is used at concentrations from 0.1 ppm to about 50 ppm of the plating solution, or a quartenary nitrogen compound, which is used at concentrations from about 0.01 ppm to about 500 ppm.

6. 发明授权

US06544399B1 Electrodeposition chemistry for filling apertures with reflective metal 有权
标题翻译：用反射金属填充孔的电沉积化学
公开(公告)号：US06544399B1
公开(公告)日：2003-04-08
申请号：US09263653
申请日：1999-03-05
申请人： Uziel Landau , John J. D'Urso
发明人： Uziel Landau , John J. D'Urso
IPC分类号： C25D338
CPC分类号： C25D3/38 , C25D7/12
摘要： The present invention provides plating solutions, particularly copper plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features formed on substrates with none or low supporting electrolyte, i.e., which include no acid, low acid, no base, or no conducting salts, and/or high metal ion, e.g., copper, concentration. Defect free filling of features is enhanced by a plating solution containing blends of polyethers (“carrier”) and organic divalent sulfur compounds (“accelerator”), wherein the concentration of the carrier ranges from about 0.1 ppm to about 2500 ppm of the plating solution, and the concentration of the accelerator ranges from about 0.05 ppm to about 1000 ppm of the plating solution. The plating solution is further improved by adding an organic nitrogen compound at a concentration from about 0.01 ppm to about 1000 ppm to improve the filling of vias on a resistive substrate. The organic nitrogen is preferably a substituted thiadiazole, which is used at concentrations from 0.1 ppm to about 50 ppm of the plating solution, or a quartenary nitrogen compound, which is used at concentrations from about 0.01 ppm to about 500 ppm.
摘要翻译：本发明提供了电镀溶液，特别是镀铜溶液，其设计用于在基底上提供均匀的涂层，并且提供基本上无缺陷的填充形成在基底上的小的特征，其中没有或低的支持电解质，即不包括酸，低酸，无碱，或不含导电盐，和/或高金属离子，例如铜，浓度。通过含有聚醚（“载体”）和有机二价硫化合物（“促进剂”）的共混物的电镀溶液增强了特征的无缺陷填充，其中载体的浓度范围为约0.1ppm至约2500ppm的电镀液，并且加速器的浓度范围为电镀液的约0.05ppm至约1000ppm。通过添加浓度为约0.01ppm至约1000ppm的有机氮化合物来进一步改善电镀溶液，以改善电阻基板上的通孔的填充。有机氮优选为以浓度为约0.01ppm至约500ppm使用的电镀溶液的浓度为0.1ppm至约50ppm或季铵氮化合物的取代噻二唑。

7. 发明授权

US09110280B2 Viewable surface having unnoticeable smudges 有权
标题翻译：可视表面有不明显的污迹
公开(公告)号：US09110280B2
公开(公告)日：2015-08-18
申请号：US13355626
申请日：2012-01-23
申请人： Papu D. Maniar , Yi Wei , Kenneth A. Dean , John J. D'Urso
发明人： Papu D. Maniar , Yi Wei , Kenneth A. Dean , John J. D'Urso
IPC分类号： H05K5/00 , H05K7/00 , G02B27/00 , G02F1/1335
CPC分类号： G02B27/0006 , G02F1/133504 , Y10T428/24364 , Y10T428/24802
摘要： A device (110, 151, 200) with a viewable surface (201) including a plurality of transparent pedestals (210) having a reflective material (406) disposed on its sides (408) make smudges forming thereon unnoticeable by taking advantage of optical characteristics including contrast and the user's visual acuity. The pedestals (210) generally have a width (412) of less than 50 microns, a height (414) equal to twice the width (412), and a spacing (416) between adjacent pedestals (210) equal to the width (412). The device (110, 151, 200) may be an electronic device, and more particularly a portable electronic device such as a cell phone.
摘要翻译：具有包括设置在其侧面（408）上的反射材料（406）的多个透明基座（210）的可视表面（201）的装置（110,151,200）通过利用光学特性使其上形成的污迹不明显包括对比度和用户的视力。基座（210）通常具有小于50微米的宽度（412），等于宽度（412）的两倍的高度（414）和等于宽度（412）的相邻基座（210）之间的间隔（416））。设备（110,151,200）可以是电子设备，更具体地，便携式电子设备，例如蜂窝电话。

8. 发明申请

US20080118815A1 Method for forming a micro fuel cell 审中-公开
标题翻译：微型燃料电池的形成方法
公开(公告)号：US20080118815A1
公开(公告)日：2008-05-22
申请号：US11604035
申请日：2006-11-20
申请人： John J. D'Urso , Chowdary R. Koripella
发明人： John J. D'Urso , Chowdary R. Koripella
IPC分类号： H01M4/86 , B01J19/08 , H01M8/02
CPC分类号： H01M8/1097 , H01M8/0232 , H01M8/1004 , H01M8/1023 , H01M8/1041 , H01M8/1048 , H01M2300/0045 , Y10T29/49108
摘要： A method is provided for fabricating a fuel cell wherein corrosion of metal diffusion layers or catalysts supports is avoided. The method comprises forming first and second electrical conductors (22, 42) accessible at a surface of a substrate (12). The substrate (12) is etched to provide a channel (34, 36), and a multi-metal layer (82) is deposited on the surface of the substrate (12). At least one metal is etched from the multi-metal layer (82) forming a porous metal layer therefrom. A portion of the porous metal layer is etched resulting in an anode portion (89) aligned with the channel (34, 36) and coupled to the first electrical conductor (22), and a cathode portion (90) coupled to the second electrical conductor (42) and separated from the anode portion by a cavity (91). A first bi-continuous material (97) is formed over the porous metal layer (82) within at least one of the anode (89) and oxidant (90) portions. An electrocatalyst (94) is formed over the bi-continous material (97), the cavity (91) is filled with an electrolyte; and the center anode portion (89) and the cavity (91) are covered with a capping layer (98).
摘要翻译：提供了一种用于制造燃料电池的方法，其中避免了金属扩散层或催化剂载体的腐蚀。该方法包括形成可在衬底（12）的表面处接近的第一和第二电导体（22,42）。蚀刻衬底（12）以提供通道（34,36），并且在衬底（12）的表面上沉积多金属层（82）。从多金属层（82）蚀刻至少一种金属，从而形成多孔金属层。多孔金属层的一部分被蚀刻，导致阳极部分（89）与沟道（34,36）对齐并且耦合到第一电导体（22），并且阴极部分（90）耦合到第二电导体（42），并且通过空腔（91）与阳极部分分离。第一双连续材料（97）在阳极（89）和氧化剂（90）部分中的至少一个内形成在多孔金属层（82）上。在双连续材料（97）上形成电催化剂（94），空腔（91）填充有电解质; 并且中心阳极部分（89）和空腔（91）被覆盖层（98）覆盖。

9. 发明申请

US20090123699A1 VIEWABLE SURFACE HAVING UNNOTICEABLE SMUDGES 审中-公开
标题翻译：具有可观察性的模拟表面
公开(公告)号：US20090123699A1
公开(公告)日：2009-05-14
申请号：US11937830
申请日：2007-11-09
申请人： Papu D. Maniar , Yi Wei , Kenneth A. Dean , John J. D'Urso
发明人： Papu D. Maniar , Yi Wei , Kenneth A. Dean , John J. D'Urso
IPC分类号： B32B3/00 , G03G7/00
CPC分类号： G02B27/0006 , G02F1/133504 , Y10T428/24364 , Y10T428/24802
摘要： A device (110, 151, 200) with a viewable surface (201) including a plurality of transparent pedestals (210) having a reflective material (406) disposed on its sides (408) make smudges forming thereon unnoticeable by taking advantage of optical characteristics including contrast and the user's visual acuity. The pedestals (210) generally have a width (412) of less than 50 microns, a height (414) equal to twice the width (412), and a spacing (416) between adjacent pedestals (210) equal to the width (412). The device (110, 151, 200) may be an electronic device, and more particularly a portable electronic device such as a cell phone.
摘要翻译：具有包括设置在其侧面（408）上的反射材料（406）的多个透明基座（210）的可视表面（201）的装置（110,151,200）通过利用光学特性使其上形成的污迹不明显包括对比度和用户的视力。基座（210）通常具有小于50微米的宽度（412），等于宽度（412）的两倍的高度（414）和等于宽度（412）的相邻基座（210）之间的间隔（416））。设备（110,151,200）可以是电子设备，更具体地，便携式电子设备，例如蜂窝电话。

10. 发明申请

US20080236632A1 SMUDGE REMOVAL FROM ELECTRONIC DEVICE DISPLAYS 有权
标题翻译：从电子设备显示屏去除电源
公开(公告)号：US20080236632A1
公开(公告)日：2008-10-02
申请号：US11693445
申请日：2007-03-29
申请人： John J. D'Urso , Steven M. Smith , Steven A. Voight , Steve X. Dai
发明人： John J. D'Urso , Steven M. Smith , Steven A. Voight , Steve X. Dai
IPC分类号： B08B7/02 , H05K5/03
CPC分类号： B08B7/02 , B08B7/028
摘要： An apparatus and method is provided for removing smudges (506, 706, 806, 906) including oils and dust from portable electronic displays. The apparatus comprises a display device (110, 150, 500, 700, 800, 900, 1000) positioned within a housing (102, 104, 808), comprising a transparent cover (302, 502, 702, 802, 902, 1002) having a surface (508, 908) viewable through an opening in the housing (102, 104, 808) and a susceptibility to receiving contaminants (506, 706, 806, 906). A vibration device (504, 704, 804, 904, 1004) is positioned against the transparent cover (302, 502, 702, 802, 902, 1002) to provide motion (510) in a direction parallel to the surface, thereby causing the contaminants to move (708) across the surface (508, 908). The contaminants (506, 706, 806, 906) may then be hidden by the housing (102, 104, 808) or ejected by a motion (912) perpendicular to the surface by another vibrating device (911). Electronic circuitry (505) is provided for activating the vibration device (504, 704, 804, 904, 1004) either during normal operation of the electronic device or as selected by the user.
摘要翻译：提供了一种用于从便携式电子显示器去除包括油和灰尘的污迹（506,706,806,906）的设备和方法。该装置包括位于壳体（102,104,808）内的显示装置（110,150,500,700,800,900,1000），包括透明盖（302,502,702,802,902,1002）具有通过壳体（102,104,808）中的开口可视的表面（508,908）和对接收污染物（506,706,806,906）的敏感性。振动装置（504,704,804,904,1004）抵靠透明盖（302,502,702,802,902,1002）定位，以在平行于表面的方向上提供运动（510），从而使污染物移动（708）穿过表面（508,908）。然后污染物（506,706,806,906）可以由壳体（102,104,808）隐藏或者被垂直于表面的另一个振动装置（911）的运动（912）排出。电子电路（505）被提供用于在电子设备的正常操作期间或由用户选择的情况下启动振动装置（504,704,804,904,1004）。

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