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1. 发明授权

US4049471A Technique for stabilizing contact resistance of gold plated electrical contacts 失效
标题翻译：稳定镀金电触点接触电阻的技术
公开(公告)号：US4049471A
公开(公告)日：1977-09-20
申请号：US708553
申请日：1976-07-26
申请人： Donald Eldridge Koontz
发明人： Donald Eldridge Koontz
IPC分类号： H01H1/04 , C23C22/68 , H01H1/02 , C22F1/14
CPC分类号： H01H1/02 , H01H2011/046
摘要： A technique is described for stabilizing gold plated electrical contacts wherein the contacts are treated with an oxidizing agent at elevated temperatures, so resulting in a contact structure which does not evidence resistance drift during subsequent thermal aging. Additionally, the technique may be used to reduce the contact resistance of thermally aged contacts which were not subjected to the foregoing preparative process.
摘要翻译：描述了一种用于稳定镀金电触点的技术，其中在升高的温度下用氧化剂处理触点，从而导致在随后的热老化期间不会阻止电阻漂移的接触结构。此外，该技术可以用于降低未经历上述制备方法的热老化接触的接触电阻。

2. 发明授权

US4093520A Process for gold plating 失效
标题翻译：镀金工艺
公开(公告)号：US4093520A
公开(公告)日：1978-06-06
申请号：US817267
申请日：1977-07-20
申请人： Donald Eldridge Koontz , Uziel Landau
发明人： Donald Eldridge Koontz , Uziel Landau
IPC分类号： C25D5/02 , C25D5/08 , H05K3/24 , C25D5/16
CPC分类号： C25D5/08 , C25D5/02 , H05K3/241
摘要： The invention is a process for rapidly electroplating certain metals such as gold, nickel, tin-nickel and tin-lead alloys on contact fingers for electronic printed wiring boards. Particularly important is uniform distribution of current amongst the fingers so as to produce uniform metal platings with equal thickness. Also of importance is the provision to alter thickness among the individual fingers so as to plate metal where most needed for particular applications. Uniform and rapid plating are achieved by certain circuit designs together with high parallel flow rates of electroplating solution in the electroplating cell. Both electroplating uniformity and provision for selecting thickness for individual fingers permits savings in amounts of metal used without sacrifices in performance. This is particularly important in the case of gold electroplating because of the high cost and increasing use of gold.
摘要翻译：本发明是用于电子印刷线路板的接触指尖上快速电镀某些金属如金，镍，锡镍和锡铅合金的方法。特别重要的是电流在指状物之间的均匀分布，以便产生相等厚度的均匀金属电镀。同样重要的是提供改变各个手指之间的厚度以便对特定应用最需要的金属板。通过某些电路设计以及电镀槽中的电镀溶液的高平行流速来实现均匀和快速电镀。电镀均匀性和用于选择单个手指厚度的设备都允许在不牺牲性能的情况下节省金属的使用量。在金电镀的情况下，这是特别重要的，因为金的成本高和使用的增加。

3. 发明授权

US4001093A Method of electroplating precious metals in localized areas 失效
标题翻译：在本地化地区电镀金属的方法
公开(公告)号：US4001093A
公开(公告)日：1977-01-04
申请号：US602254
申请日：1975-08-06
申请人： Donald Eldridge Koontz , Uziel Landau
发明人： Donald Eldridge Koontz , Uziel Landau
IPC分类号： C25D5/02
CPC分类号： C25D5/02
摘要： A method of electroplating precious metal in localized areas. The deposits obtained are usually nonuniform and limited to only those areas where coating is actually required thus offering considerable economic savings. The method uses shaped anodes approaching the cathodes very closely, high parallel flow rates of electrolyte and high current densities of at least 100 milliamperes per cm..sup.2 in order to electroplate the precious metal quickly. The preferred precious metal is gold. The method is applied to the coating of electronic circuits and components such as connectors and switches.

4. 发明授权

US4071417A Process for decreasing the porosity of gold 失效
标题翻译：降低金孔隙度的方法
公开(公告)号：US4071417A
公开(公告)日：1978-01-31
申请号：US811039
申请日：1977-06-29
申请人： Donald Eldridge Koontz , Peter Kenny Skurkiss
发明人： Donald Eldridge Koontz , Peter Kenny Skurkiss
IPC分类号： C25D5/48 , C25D11/38
CPC分类号： C25D11/38 , C25D5/48
摘要： A process is described for making modified gold platings of low porosity. This process involves first putting down a gold layer and then passivating this layer using an electrochemical chromating procedure. This process permits use of much thinner gold layers than ordinarily used without the danger of corrosion of underlying base metal.
摘要翻译：描述了制备低孔隙率的改性镀金的方法。该过程包括首先放下金层，然后使用电化学镀铬法钝化该层。该方法允许使用比通常使用的更薄的金层，而没有潜在的贱金属的腐蚀危险。

5. 发明授权

US4077852A Selective gold plating 失效
标题翻译：选择性镀金
公开(公告)号：US4077852A
公开(公告)日：1978-03-07
申请号：US766897
申请日：1977-02-09
申请人： Donald Eldridge Koontz , Peter Kenny Skurkiss
发明人： Donald Eldridge Koontz , Peter Kenny Skurkiss
IPC分类号： C25D5/02 , H05K3/24
CPC分类号： H05K3/243 , C25D5/02 , H05K2201/0175
摘要： A process is described for selectively electroplating gold on metallic surfaces containing copper using a chromate film as a plating mask. This procedure permits reduced use of gold without adversely affecting device performance. In addition, chromate films may be patterned with relatively high dimensional resolution and control so as to achieve gold plating patterns useful in electronic and integrated circuits.
摘要翻译：描述了使用铬酸盐膜作为电镀掩模来选择性地将含有铜的金属表面上的电镀金的工艺。该方法允许减少使用金，而不会不利地影响器件性能。此外，铬酸盐膜可以以相对高的尺寸分辨率和控制进行图案化，以实现在电子和集成电路中有用的镀金图案。

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