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1. 发明授权

US06174174B1 Socket for IC and method for manufacturing IC 失效
标题翻译： IC插座和IC制造方法
公开(公告)号：US06174174B1
公开(公告)日：2001-01-16
申请号：US09380766
申请日：1999-09-28
申请人： Kenzo Suzuki , Toshimasa Hiroike , Hiroshi Nagano , Hisataka Izawa , Yasuo Maru , Shigeo Ikeda
发明人： Kenzo Suzuki , Toshimasa Hiroike , Hiroshi Nagano , Hisataka Izawa , Yasuo Maru , Shigeo Ikeda
IPC分类号： H01R1200
CPC分类号： H01R13/2421 , G01R1/0483 , H01R33/765 , Y10S439/931
摘要： A socket for an IC used in electrically connecting the IC to a test device for testing electrical properties of the IC. The socket for an IC includes a printed circuit board on one surface of which a plurality of contact electrodes are arranged at the same pitch as an arraying pitch of external electrodes for the IC and on the opposite surface of which are arranged a plurality of terminal electrodes connected to the contact electrodes, an anisotropic electrically conductive adhesive arranged on the contact electrodes of the printed circuit board, a base block arranged on the one surface of the printed circuit board and having an opening for setting the IC, with the opening facing the anisotropic electrically conductive adhesive. The socket for an IC also includes a plurality of coil-shaped contacts arranged in the opening, one ends of which are positioned above the contact electrodes via the anisotropic electrically conductive adhesive and the other ends of which are protruded from the opening. The contact electrodes and the coil-shaped contacts facing each other via the anisotropic electrically conductive adhesive are mechanically and electrically connected to each other via the anisotropic electrically conductive adhesive.
摘要翻译：用于将IC电连接到用于测试IC的电性能的测试装置的IC的插座。用于IC的插座包括印刷电路板，其一个表面上以与IC的外部电极的阵列间距相同的间距布置多个接触电极，并且其相对表面上布置有多个端子电极连接到接触电极，布置在印刷电路板的接触电极上的各向异性导电粘合剂，布置在印刷电路板的一个表面上并具有用于设置IC的开口的基座，其开口面向各向异性导电胶。用于IC的插座还包括布置在开口中的多个线圈状触点，其一端经由各向异性导电粘合剂位于接触电极的上方，并且其另一端从开口突出。通过各向异性导电粘合剂彼此面对的接触电极和线圈状接触器通过各向异性导电粘合剂彼此机械地和电连接。

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