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    • 1. 发明授权
    • Flow coater with a temperature controller
    • 流动涂布机配有温度控制器
    • US6027567A
    • 2000-02-22
    • US725817
    • 1996-10-07
    • Kenzo Suzuki
    • Kenzo Suzuki
    • B05C5/00H05K3/00
    • H05K3/0091B05C5/001B05C5/004B05C5/005H05K2203/1509H05K2203/159Y10S118/04
    • In a flow coater for applying coating liquid to a plate member such as a printed board by a curtain flow method, a heat exchanger unit of a temperature controller is arranged in a collection tray which is arranged below a coating liquid supplying head across a conveyance path for the plate member. This heat exchanger unit has a coil-shaped structure. The coating liquid is caused to flow down curtainly from the head to come in contact with the heat exchanger unit in which the heat exchange is carried out. Since a small amount of coating liquid comes in contact with the heat exchanger unit, an excellent efficiency of the heat exchange can be obtained, and hence it is possible to cope speedily and accurately with temperature changes. In addition, since after the coating liquid has flowed down from the head, the coating liquid flows naturally down in the tray while contacting the heat exchanger unit, there is no need of providing a special drive apparatus therefor.
    • 在通过帘式流动法将涂布液涂布在印刷电路板等构件上的流动涂布机中,将温度控制器的热交换器单元设置在收纳盘中,所述收集盘布置在涂布液供给头的下方,穿过输送路 对于板材。 该热交换器单元具有线圈状结构。 使涂布液从头部向下流动,与进行热交换的热交换器单元接触。 由于少量涂布液体与热交换器单元接触,所以可以获得优异的热交换效率,因此可以随温度变化快速且准确地应对。 此外,由于涂布液从头部向下流动,因此在与热交换器单元接触的同时,涂布液在托盘内自然流动,不需要设置特殊的驱动装置。
    • 2. 发明授权
    • Socket for IC and method for manufacturing IC
    • IC插座和IC制造方法
    • US06174174B1
    • 2001-01-16
    • US09380766
    • 1999-09-28
    • Kenzo SuzukiToshimasa HiroikeHiroshi NaganoHisataka IzawaYasuo MaruShigeo Ikeda
    • Kenzo SuzukiToshimasa HiroikeHiroshi NaganoHisataka IzawaYasuo MaruShigeo Ikeda
    • H01R1200
    • H01R13/2421G01R1/0483H01R33/765Y10S439/931
    • A socket for an IC used in electrically connecting the IC to a test device for testing electrical properties of the IC. The socket for an IC includes a printed circuit board on one surface of which a plurality of contact electrodes are arranged at the same pitch as an arraying pitch of external electrodes for the IC and on the opposite surface of which are arranged a plurality of terminal electrodes connected to the contact electrodes, an anisotropic electrically conductive adhesive arranged on the contact electrodes of the printed circuit board, a base block arranged on the one surface of the printed circuit board and having an opening for setting the IC, with the opening facing the anisotropic electrically conductive adhesive. The socket for an IC also includes a plurality of coil-shaped contacts arranged in the opening, one ends of which are positioned above the contact electrodes via the anisotropic electrically conductive adhesive and the other ends of which are protruded from the opening. The contact electrodes and the coil-shaped contacts facing each other via the anisotropic electrically conductive adhesive are mechanically and electrically connected to each other via the anisotropic electrically conductive adhesive.
    • 用于将IC电连接到用于测试IC的电性能的测试装置的IC的插座。 用于IC的插座包括印刷电路板,其一个表面上以与IC的外部电极的阵列间距相同的间距布置多个接触电极,并且其相对表面上布置有多个端子电极 连接到接触电极,布置在印刷电路板的接触电极上的各向异性导电粘合剂,布置在印刷电路板的一个表面上并具有用于设置IC的开口的基座,其开口面向各向异性 导电胶。 用于IC的插座还包括布置在开口中的多个线圈状触点,其一端经由各向异性导电粘合剂位于接触电极的上方,并且其另一端从开口突出。 通过各向异性导电粘合剂彼此面对的接触电极和线圈状接触器通过各向异性导电粘合剂彼此机械地和电连接。