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1. 发明授权

US06797888B2 Junction flexible wiring circuit board 有权
标题翻译：接线柔性布线电路板
公开(公告)号：US06797888B2
公开(公告)日：2004-09-28
申请号：US10053555
申请日：2002-01-24
申请人： Tadao Ookawa , Yasuhito Ohwaki , Toshihiko Omote
发明人： Tadao Ookawa , Yasuhito Ohwaki , Toshihiko Omote
IPC分类号： H05K103
CPC分类号： G11B5/4853 , H05K1/0218 , H05K3/361
摘要： In a junction flexible wiring circuit board used for performing junction between a suspension board for mounting a magnetic head of a hard disk drive thereon and a control circuit board for operating the magnetic head, a metal layer is formed on at least one of a surface of an electrically insulating base layer and a surface of an electrically insulating cover layer.
摘要翻译：在用于在其上安装硬盘驱动器的磁头的悬挂板和用于操作磁头的控制电路板之间的连接处的接合柔性布线电路板中，金属层形成在至少一个电绝缘基层和电绝缘覆盖层的表面。

2. 发明授权

US06399899B1 Suspension board with circuit 有权
标题翻译：悬挂板带电路
公开(公告)号：US06399899B1
公开(公告)日：2002-06-04
申请号：US09712980
申请日：2000-11-16
申请人： Tadao Ohkawa , Yasuhito Ohwaki , Shigenori Morita , Toshihiko Omote
发明人： Tadao Ohkawa , Yasuhito Ohwaki , Shigenori Morita , Toshihiko Omote
IPC分类号： H01R1204
CPC分类号： H05K1/0271 , G11B5/486 , H01R4/023 , H01R13/58 , H01R2201/06 , H05K1/056 , H05K3/243 , H05K3/28 , H05K3/361 , H05K3/388 , H05K2201/0154 , H05K2201/0394
摘要： To provide a suspension board with circuit that enables its terminals to be bonded to the other terminals with sufficient strength with simple structure, to ensure sufficient bonding reliability, the suspension board with circuit 11 includes a suspension board 12, a base layer 13 formed on the suspension board 12, and a conductive layer 14 formed on the base layer 13 and a cover layer 18 with which the conductive layer 14 is covered, wherein external connection terminals 17 to be bonded to terminals 28 of a read/write board 29 are formed without the suspension board 12 and/or the base layer 13 being formed.
摘要翻译：为了提供具有使得其端子能够以足够的结构结合到其它端子的电路的悬挂板，为了确保足够的接合可靠性，具有电路11的悬挂板包括悬挂板12，形成在基板13上的基底层13 悬垂基板12和形成在基底层13上的导电层14和覆盖导电层14的覆盖层18，其中形成与读/写板29的端子28接合的外部连接端子17不形成形成悬挂板12和/或基层13。

3. 发明授权

US6100582A Circuit substrate, circuit-formed suspension substrate, and production method thereof 失效
标题翻译：电路基板，电路形成悬浮基板及其制造方法
公开(公告)号：US6100582A
公开(公告)日：2000-08-08
申请号：US35871
申请日：1998-03-06
申请人： Toshihiko Omote , Yasuhito Funada
发明人： Toshihiko Omote , Yasuhito Funada
IPC分类号： C08G69/26 , C08G73/10 , G03F7/004 , G03F7/038 , G11B3/00 , G11B5/48 , G11B5/60 , G11B21/00 , G11B21/02 , G11B21/16 , G11B21/18 , G11B25/04 , H05K1/03 , H05K1/05 , H05K3/46 , H01L23/04
CPC分类号： C08G73/1025 , C08G73/1039 , C08G73/1042 , G03F7/0387 , G11B21/00 , G11B5/486 , H05K1/056 , G03F7/0045 , Y10T428/24917
摘要： A circuit substrate having an insulating layer comprising a polyimide resin on a metal foil substrate, wherein the polyimide resin is a polyimide resin obtained by the reaction of(A) aromatic diamines comprising(a) p-phenylene diamine and(b) 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl.(B) 3,4,3',4'-biphenyltetracarboxylic acid dianhydride.The circuit-formed substrate has a desired circuit comprising a conductive layer on the circuit substrate.The polyimide resin has a coefficient of thermal linear expansion close to that of the metal foil, and hence breakage does not occur on the resin layer, the resin layer does not separate, and warping does not occur.
摘要翻译： 1.一种电路基板，具有在金属箔基板上具有聚酰亚胺树脂的绝缘层，其中，所述聚酰亚胺树脂是通过（A）芳族二胺与（a）对苯二胺和（b）2,2 '（双（三氟甲基）-4,4'-二氨基联苯。（B）3,4,3'，4'-联苯四羧酸二酐。电路形成的衬底具有包括在电路衬底上的导电层的所需电路。聚酰亚胺树脂的热线膨胀系数接近于金属箔，因此在树脂层上不会发生断裂，树脂层不分离，翘曲不发生。

4. 发明授权

US08252237B2 Substance detection sensor 有权
标题翻译：物质检测传感器
公开(公告)号：US08252237B2
公开(公告)日：2012-08-28
申请号：US12448853
申请日：2007-10-16
申请人： Toshiki Naito , Hiroshi Yamazaki , Toshihiko Omote
发明人： Toshiki Naito , Hiroshi Yamazaki , Toshihiko Omote
IPC分类号： G01N15/06 , G01N33/00 , G01N33/48
CPC分类号： G01N27/12 , G01N27/126
摘要： A substance detection sensor comprises an insulation layer (2) having flexibility, two electrodes (3A, 3B) so disposed on the insulation layer as to be opposite to each other at a space therebetween and connected to an electric resistance detector, and a conductive layer (4) which is so formed on the insulation layer as to span the two electrodes and to be electrically connected to the two electrodes. The swelling ratio of the conductive layer (4) is changed according to the type and/or the quantity of a specific substance.
摘要翻译：物质检测传感器包括具有柔性的绝缘层（2），两个电极（3A，3B），它们设置在绝缘层上，在它们之间的空间处彼此相对并连接到电阻检测器，以及导电层（4），其形成在绝缘层上以跨越两个电极并与两个电极电连接。导电层（4）的溶胀比根据特定物质的种类和/或数量而改变。

5. 发明申请

US20050230790A1 Tape carrier for TAB 有权
标题翻译： TAB的磁带架
公开(公告)号：US20050230790A1
公开(公告)日：2005-10-20
申请号：US10680112
申请日：2003-10-08
申请人： Toshiki Naito , Hiroshi Yamazaki , Toshihiko Omote
发明人： Toshiki Naito , Hiroshi Yamazaki , Toshihiko Omote
IPC分类号： H01L21/60 , H01L23/12 , H01L23/495 , H01L23/498 , H01L23/50 , H01R43/00 , H05K1/00 , H05K3/00
CPC分类号： H01L23/49572 , H01L23/4985 , H01L2924/0002 , H05K1/0393 , H05K3/0097 , H05K2201/2009 , H05K2203/1545 , Y10T428/24777 , H01L2924/00
摘要： Electric conductor patterns having inner leads arranged at a pitch of not larger than 60 μm are formed on a front surface of an insulating layer of a tape carrier for TAB. A reinforcing layer of stainless steel foil is formed on a rear surface of the insulating layer so as to be extend along a lengthwise direction at opposite side edge portions in a widthwise direction of the insulating layer. Accordingly, both dimensional accuracy and positional accuracy can be improved at the time of carrying the tape carrier for TAB or at the time of mounting and bonding electronic parts though the insulating layer can be formed so as to be thin.
摘要翻译：在TAB的带状载体的绝缘层的前表面上形成具有以不大于60μm的间距布置的内部引线的电导体图案。在绝缘层的后表面上形成不锈钢箔的加强层，以沿着绝缘层的宽度方向的相对侧边缘部分的长度方向延伸。因此，在携带用于TAB的带载体时或在安装和接合电子部件时，可以提高尺寸精度和位置精度，尽管绝缘层可以形成为薄。

6. 发明授权

US5665523A Heat-resistant negative photoresist composition, photosensitive substrate, and process for forming negative pattern 失效
标题翻译：耐热性负性光致抗蚀剂组合物，感光性基材，以及形成负型图案的方法
公开(公告)号：US5665523A
公开(公告)日：1997-09-09
申请号：US751555
申请日：1996-11-18
申请人： Toshihiko Omote , Hirofumi Fujii
发明人： Toshihiko Omote , Hirofumi Fujii
IPC分类号： G03F7/004 , G03F7/038 , G03F7/38 , H01L21/027 , G03F7/34
CPC分类号： G03F7/0387 , G03F7/0045 , Y10S430/107 , Y10S430/121
摘要： A photoresist composition which can form a negative pattern with good heat resistance upon irradiation with actinic rays can be prepared by adding a 4-(2'-nitrophenyl)-1-alkyl (or alkoxyl)-4-dihydropyridine as a photosensitive compound which shows basicity by the irradiation with actinic rays to a resin component comprising a polyimide precursor having a specific structure.
摘要翻译：可以通过加入4-（2'-硝基苯基）-1-烷基（或烷氧基）-4-二氢吡啶作为光敏化合物，可以制备能够在用光化射线照射时形成具有良好耐热性的阴图案的光致抗蚀剂组合物，其显示通过用光化射线照射到包含具有特定结构的聚酰亚胺前体的树脂组分的碱度。

7. 发明授权

US5053314A Positively photosensitive polyimide composition 失效
标题翻译：最新的光敏聚酰亚胺组合物
公开(公告)号：US5053314A
公开(公告)日：1991-10-01
申请号：US462243
申请日：1990-01-09
申请人： Tsuguo Yamaoka , Amane Mochizuki , Kazumasa Igarashi , Toshihiko Omote
发明人： Tsuguo Yamaoka , Amane Mochizuki , Kazumasa Igarashi , Toshihiko Omote
IPC分类号： G03F7/039
CPC分类号： G03F7/039
摘要： A positively photosensitive polyimide composition is disclosed, which composition comprises polyimide having repeating unit represented by formula (I): ##STR1## wherein Ar.sup.1 represents a tetravalent aromatic hydrocarbon group; Ar.sup.2 represents a divalent aromatic hydrocarbon group having an acyloxy group at the ortho-position and/or the meta-position of the aromatic ring; Ar.sup.3 represents a divalent aromatic hydrocarbon group; and the subunit having an amount ratio of m in the repeating unit is present in an amount of at least 20% by weight based on the polyimide. The composition exhibits high photosensitivity in reproduction of a fine pattern and excellent dimensional stability.

8. 发明授权

US07205482B2 Tape carrier for TAB 有权
标题翻译： TAB的磁带架
公开(公告)号：US07205482B2
公开(公告)日：2007-04-17
申请号：US10680112
申请日：2003-10-08
申请人： Toshiki Naito , Hiroshi Yamazaki , Toshihiko Omote
发明人： Toshiki Naito , Hiroshi Yamazaki , Toshihiko Omote
IPC分类号： H05K1/03
CPC分类号： H01L23/49572 , H01L23/4985 , H01L2924/0002 , H05K1/0393 , H05K3/0097 , H05K2201/2009 , H05K2203/1545 , Y10T428/24777 , H01L2924/00
摘要： Electric conductor patterns having inner leads arranged at a pitch of not larger than 60 μm are formed on a front surface of an insulating layer of a tape carrier for TAB. A reinforcing layer of stainless steel foil is formed on a rear surface of the insulating layer so as to be extend along a lengthwise direction at opposite side edge portions in a widthwise direction of the insulating layer. Accordingly, both dimensional accuracy and positional accuracy can be improved at the time of carrying the tape carrier for TAB or at the time of mounting and bonding electronic parts though the insulating layer can be formed so as to be thin.
摘要翻译：在TAB的带状载体的绝缘层的前表面上形成具有以不大于60μm的间距布置的内部引线的电导体图案。在绝缘层的后表面上形成不锈钢箔的加强层，以沿着绝缘层的宽度方向的相对侧边缘部分的长度方向延伸。因此，在携带用于TAB的带载体时或在安装和接合电子部件时，可以提高尺寸精度和位置精度，尽管绝缘层可以形成为薄。

9. 发明授权

US06428658B1 Method for manufacturing magnetic head suspensions and method for inspecting metal substrates for magnetic head suspensions 有权
标题翻译：磁头悬架的制造方法以及磁头悬挂用金属基板的检查方法
公开(公告)号：US06428658B1
公开(公告)日：2002-08-06
申请号：US09669430
申请日：2000-09-25
申请人： Takeshi Asano , Atsushi Tanaka , Yasuhisa Toujou , Toshihiko Omote
发明人： Takeshi Asano , Atsushi Tanaka , Yasuhisa Toujou , Toshihiko Omote
IPC分类号： C23C1400
CPC分类号： G11B5/484
摘要： A plurality of test pieces are taken from a long-sized substrate made of stainless steel, where the test pieces are arranged in parallel to the width direction TD of the substrate in a region near the forward end of the substrate. A variation among the curvatures of the test pieces is then measured. A substrate where the variation in the curvature is 0.002 [1/mm] or smaller is selected as a substrate used in manufacture of magnetic head suspensions. While the selected substrate is transported in its length direction, an insulating layer and a conductor layer are stacked on the substrate to form a plurality of magnetic head suspensions.
摘要翻译：从不锈钢制的长尺寸基板上取出多个测试片，在基板的前端附近的区域，试片平行于基板的宽度方向TD排列。然后测量试件的曲率之间的变化。选择曲率变化为0.002 [1 / mm]以下的基板作为用于制造磁头悬架的基板。当所选择的衬底在其长度方向上传送时，绝缘层和导体层被堆叠在衬底上以形成多个磁头悬架。

10. 发明授权

US06380493B1 Circuit board 有权
标题翻译：电路板
公开(公告)号：US06380493B1
公开(公告)日：2002-04-30
申请号：US09695904
申请日：2000-10-26
申请人： Shigenori Morita , Yasuhito Ohwaki , Tadao Ohkawa , Toshihiko Omote
发明人： Shigenori Morita , Yasuhito Ohwaki , Tadao Ohkawa , Toshihiko Omote
IPC分类号： H05K302
CPC分类号： G11B5/486 , H05K1/024 , H05K1/056 , H05K3/0023 , H05K3/28 , H05K2201/0154 , H05K2203/0597
摘要： To provide a circuit board, having a circuit pattern of adequate high-frequency characteristics, for transmitting high-frequency electric signals at high speed, a circuit board, including a base layer formed of insulating material and a conductive layer formed on the base layer in the form of a specified circuit pattern, is so constructed that an air layer is made to lie between lines of wire of the circuit pattern or is so constructed that the lines of wire are covered with the cover layer but land portions of the base layer extending between the lines of wire are not covered with the cover layer. This construction of the invention enables dielectric constant between the lines of wire to be reduced and, as a result of this, the capacitance between the lines of wire can be reduced to provide improved high-frequency characteristics of the circuit pattern.
摘要翻译：为了提供具有足够的高频特性的电路图形用于高速传输高频电信号的电路板，包括由绝缘材料形成的基底层和形成在基底层上的导电层的电路板指定电路图案的形式被构造成使得空气层位于电路图案的线之间，或者被构造成使得线的线被覆盖层覆盖，但是基底层的接地部分延伸线之间的线不被覆盖层覆盖。本发明的这种结构能够使线路线之间的介电常数降低，并且因此可减少线路之间的电容，从而提供改进的电路图案的高频特性。

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