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1. 发明授权

US5989934A Process for manufacturing a semiconductor device having a logic circuit and a plurality of input/output amplifier circuits 失效
标题翻译：具有逻辑电路和多个输入/输出放大器电路的半导体器件的制造方法
公开(公告)号：US5989934A
公开(公告)日：1999-11-23
申请号：US315619
申请日：1994-09-30
申请人： Tomoki Nishino , Masashi Takeda
发明人： Tomoki Nishino , Masashi Takeda
IPC分类号： H01L21/822 , H01L21/60 , H01L23/485 , H01L23/528 , H01L27/04
CPC分类号： H01L24/50 , H01L23/528 , H01L24/05 , H01L24/06 , H01L24/48 , H01L24/86 , H01L2224/02166 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L24/45 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/1433 , H01L2924/20753
摘要： A process for manufacturing a semiconductor device wherein the number of input/output terminals can be selectively increased while using input/output amplifier circuit functional portions having the same circuit configuration, by using both ball bonding and TAB bonding techniques. Every two (4A, 4B) of the electrodes on the semiconductor device correspond to each one set of input/output amplifier circuits formed by three ones (6A, 6B, 6C) of the input/output amplifier circuits. The spacing S.sub.1 between the two electrodes (4A, 4B) corresponding to one set of input/output amplifier circuits is substantially equal to the spacing S.sub.2 between the electrode 4B and the adjacent electrode 4C of one adjacent set of input/output amplifier circuits and also to the spacing S.sub.3 between the electrode 4A and the adjacent electrode 4D of the other adjacent set of input/output amplifier circuits.
摘要翻译：一种用于制造半导体器件的方法，其中通过使用球接合和TAB接合技术，可以选择性地增加输入/输出端子的数量，同时使用具有相同电路配置的输入/输出放大器电路功能部分。半导体器件上的每两个电极（4A，4B）对应于由输入/输出放大器电路的三个（6A，6B，6C）形成的每组输入/输出放大器电路。对应于一组输入/输出放大器电路的两个电极（4A，4B）之间的间隔S1基本上等于一组相邻输入/输出放大器电路的电极4B和相邻电极4C之间的间隔S2，相对于另一相邻输入/输出放大器电路组的电极4A和相邻电极4D之间的间隔S3。

2. 发明授权

US5343075A Composite stacked semiconductor device with contact plates 失效
标题翻译：具有接触板的复合叠层半导体器件
公开(公告)号：US5343075A
公开(公告)日：1994-08-30
申请号：US901846
申请日：1992-06-22
申请人： Tomoki Nishino
发明人： Tomoki Nishino
IPC分类号： H01L23/50 , H01L23/31 , H01L25/10 , H01L25/11 , H01L25/18 , H05K1/14 , H05K1/18 , H01L23/02
CPC分类号： H05K1/145 , H01L23/3107 , H01L25/105 , H01L2225/1029 , H01L2225/1064 , H01L2225/1094 , H01L2924/0002 , H01L2924/3011 , H05K2201/10515 , H05K2201/10681
摘要： A composite semiconductor device comprises a multilayer wiring board, a plurality of resin-sealed semiconductor devices having external leads projecting from the opposite sides thereof and stacked one on another, on a multilayer wiring board, and contact plates provided with wiring lines on the inner surfaces thereof and disposed close to the opposite sides of the resin-sealed semiconductor devices, respectively, with the wiring lines in electrical contact with the external leads of the resin-sealed semiconductor devices, respectively. Since the resin-sealed semiconductor devices are stacked, the degree of integration of the resin-sealed semiconductor devices is multiplied by the number of the resin-sealed semiconductor devices so stacked. Since the resin-sealed semiconductor devices are electrically interconnected by the wiring lines of the contact plates, the multilayer wiring board need not be provided with any wiring for electrically interconnecting the resin-sealed semiconductor devices.
摘要翻译：复合半导体器件包括多层布线板，多层树脂密封半导体器件，其具有从其相对侧突出并且彼此堆叠的外部引线在多层布线板上，以及在内表面上设置布线的接触板并且分别靠近树脂密封半导体器件的相对侧设置，其中布线分别与树脂密封半导体器件的外部引线电接触。由于树脂密封半导体器件堆叠，所以树脂密封半导体器件的集成度乘以如此堆叠的树脂密封半导体器件的数量。由于树脂密封半导体器件通过接触板的布线电互连，所以多层布线板不需要设置用于电连接树脂密封半导体器件的布线。

3. 发明授权

US5331201A Semiconductor device having inner lead arrangement with enhanced stability 失效
标题翻译：具有内部引线装置的半导体器件具有增强的稳定性
公开(公告)号：US5331201A
公开(公告)日：1994-07-19
申请号：US995060
申请日：1992-12-22
申请人： Tomoki Nishino
发明人： Tomoki Nishino
IPC分类号： H01L21/60 , H01L23/28 , H01L23/495 , H01L23/50 , H01L23/48 , H01L29/44 , H01L29/52 , H01L29/60
CPC分类号： H01L24/06 , H01L23/4951 , H01L2224/04042 , H01L2224/05554 , H01L2224/06136 , H01L2224/32014 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L24/48 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/181
摘要： A resin-sealed semiconductor device comprising a semiconductor chip having pad electrodes formed on a circuit forming surface in the interior of the main surface and inner leads cemented to the semiconductor chip through an insulator for electric insulation such that ends of the inner leads reach the edge of the circuit forming surface of the semiconductor chip, wherein common conductors, which are connected with at least one of power supplying inner leads and/or grounding inner leads, and at least one of the inner leads are coupled on the semiconductor chip, and wherein the configuration of the common conductors and the inner leads coupled together is virtually L-shaped, T-shaped, -shaped, or cross-shaped.
摘要翻译：一种树脂密封半导体器件，包括：半导体芯片，其具有形成在主表面内部的电路形成表面上的焊盘电极;以及内部引线，其通过用于电绝缘的绝缘体胶合到半导体芯片，使得内部引线的端部到达边缘所述半导体芯片的电路形成表面的至少一个与所述供电内部引线和/或接地内部引线中的至少一个以及所述内部引线中的至少一个相连接的公共导体耦合在所述半导体芯片上，并且其中共同导体和连接在一起的内部引线的构造实际上是L形，T形，形状或十字形。

4. 发明授权

US5233130A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US5233130A
公开(公告)日：1993-08-03
申请号：US950658
申请日：1992-09-23
申请人： Tomoki Nishino
发明人： Tomoki Nishino
IPC分类号： H01L23/29 , H01L23/16 , H01L23/20 , H01L23/31 , H01L23/552
CPC分类号： H01L23/552 , H01L23/16 , H01L23/20 , H01L23/315 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49175 , H01L2224/73265 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/14 , H01L2924/181 , H01L2924/3025
摘要： A semiconductor device such as a semiconductor memory has a semiconductor chip bonded to an upper surface of a lead frame die pad, a polyimide film bonded to the upper surface of the semiconductor chip, and a quartz plate having a recess defined in a lower surface thereof, the quartz plate being bonded to an upper surface of the polyimide film with the recess being positioned over the integrated circuit of the semiconductor chip. The recess provides a gap between the polyimide film and the quartz plate for absorbing compressive stresses applied to the semiconductor device. The polyimide film, rather than the quartz plate, may have the recess. A plurality of leads are connected to the electrodes of the semiconductor chip by connecting wires. The lead frame, the semiconductor chip, the polyimide film, the quartz plate, the leads, and the connecting wires are sealed in a resin case. The semiconductor device may additionally have a light-shielding film disposed on the quartz plate for preventing external light from being applied to the semiconductor chip.
摘要翻译：诸如半导体存储器的半导体器件具有接合到引线框芯片焊盘的上表面的半导体芯片，接合到半导体芯片的上表面的聚酰亚胺膜，以及在其下表面中限定有凹部的石英板所述石英板被接合到所述聚酰亚胺膜的上表面，所述凹部位于所述半导体芯片的集成电路上。该凹部在聚酰亚胺膜和石英板之间提供了用于吸收施加到半导体器件的压应力的间隙。聚酰亚胺膜，而不是石英板，可以具有凹槽。多个引线通过连接线连接到半导体芯片的电极。引线框架，半导体芯片，聚酰亚胺膜，石英板，引线和连接线被密封在树脂壳体中。半导体器件还可以具有设置在石英板上的遮光膜，以防止外部光被施加到半导体芯片。

5. 发明授权

US5510654A Semiconductor device and method of fabricating same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US5510654A
公开(公告)日：1996-04-23
申请号：US460643
申请日：1995-06-02
申请人： Tomoki Nishino , Masashi Takeda
发明人： Tomoki Nishino , Masashi Takeda
IPC分类号： H01L21/822 , H01L21/60 , H01L23/485 , H01L23/528 , H01L27/04 , H01L23/48
CPC分类号： H01L24/50 , H01L23/528 , H01L24/05 , H01L24/06 , H01L24/48 , H01L24/86 , H01L2224/02166 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L24/45 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/1433 , H01L2924/20753
摘要： A semiconductor device having any arbitrary size. The number of input/output terminals can be easily and selectively increased while using input/output amplifier circuit functional portions having the same circuit configuration, by using both ball bonding and TAB bonding techniques. Every two (4A, 4B) of the electrodes on the semiconductor device correspond to each one set of input/output amplifier circuits formed by three ones (6A, 6B, 6C) of the input/output amplifier circuits. The spacing S.sub.1 between the two electrodes (4A, 4B) corresponding to one set of input/output amplifier circuits is substantially equal to the spacing S.sub.2 between the electrode 4B and the adjacent electrode 4C of one adjacent set of input/output amplifier circuits and also to the spacing S.sub.3 between the electrode 4A and the adjacent electrode 4D of the other adjacent set of input/output amplifier circuits.
摘要翻译：具有任意尺寸的半导体器件。使用具有相同电路结构的输入/输出放大器电路功能部分，通过使用滚珠接合和TAB接合技术，可以容易且有选择地增加输入/输出端子的数量。半导体器件上的每两个电极（4A，4B）对应于由输入/输出放大器电路的三个（6A，6B，6C）形成的每组输入/输出放大器电路。对应于一组输入/输出放大器电路的两个电极（4A，4B）之间的间隔S1基本上等于一组相邻输入/输出放大器电路的电极4B和相邻电极4C之间的间隔S2，相对于另一相邻输入/输出放大器电路组的电极4A和相邻电极4D之间的间隔S3。

6. 发明授权

US6143500A Nucleic acids and methods for detecting pathogenic xanthomonas campestris using the same 失效
标题翻译：核酸和检测病原性黄单孢菌的方法
公开(公告)号：US6143500A
公开(公告)日：2000-11-07
申请号：US148801
申请日：1998-09-04
申请人： Tomoki Nishino
发明人： Tomoki Nishino
IPC分类号： G01N33/566 , C12N15/09 , C12Q1/68 , G01N33/569 , C07H21/04
CPC分类号： C12Q1/689
摘要： The present invention is drawn to nucleic acid fragments specific to Xanthomonas campestris pathogenic to plants belonging to the family Gramineae, as well as methods for detecting the pathogenic Xanthomonas campestris using the same. The nucleic acid fragment of the invention has a nucleotide sequence which is at least 15 consecutive nucleotides of the nucleotide sequence shown in SEQ ID NO:1 or in the complementary chain thereof, or has no less than 15 nucleotides and hybridizes with the nucleic acid having the sequence shown in SEQ ID NO:1 or with the complementary chain thereof under stringent conditions.
摘要翻译：本发明涉及对属于禾本科植物的植物致病的野油菜黄单胞菌属特异性的核酸片段，以及使用该植物检测致病性黄单孢杆菌的方法。本发明的核酸片段具有核苷酸序列，其为SEQ ID NO：1所示核苷酸序列或其互补链中至少15个连续核苷酸，或不少于15个核苷酸，并与具有在严格条件下，SEQ ID NO：1所示的序列或其互补链。

7. 发明授权

US5559079A Herbicidal composition for the control of annual bluegrass comprising xanthomonas campestris and sulfonylurea herbicides 失效
标题翻译：用于控制包含野油菜黄单胞菌和磺酰脲除草剂的年生草的除草组合物
公开(公告)号：US5559079A
公开(公告)日：1996-09-24
申请号：US365421
申请日：1994-12-28
申请人： Seiko Imaizumi , Masao Yamada , Tomoki Nishino
发明人： Seiko Imaizumi , Masao Yamada , Tomoki Nishino
IPC分类号： A01N47/38 , A01N63/00 , A01N43/50 , A01N43/54 , A01N43/56
CPC分类号： A01N63/00
摘要： The present invention relates to a herbicidal composition for the control of annual bluegrass, comprising a microorganism having an ability to control annual bluegrass and belonging to the genus Xanthomonas, and a sulfonylurea compound. The composition of the present invention shows excellent herbicidal activity against annual bluegrass and broad-leaved weeds, and is extremely useful as a herbicide for turf.
摘要翻译：本发明涉及一种用于防治一年生禾本草的除草组合物，其含有具有控制一年生草本属于黄单胞菌属的能力的微生物和一种磺酰脲类化合物。本发明的组合物对一年生草坪和阔叶杂草显示出优异的除草活性，并且作为草坪除草剂是非常有用的。

8. 发明申请

US20060289236A1 METHOD AND APPARATUS FOR CONTROLLING A MOTOR-DRIVEN OIL PUMP 审中-公开
标题翻译：用于控制电动油泵的方法和装置
公开(公告)号：US20060289236A1
公开(公告)日：2006-12-28
申请号：US11422396
申请日：2006-06-06
申请人： Tomoki Nishino
发明人： Tomoki Nishino
IPC分类号： F01M9/00
CPC分类号： F01L1/02 , F01L1/022 , F01M2001/0215 , F01M2005/026
摘要： The present invention is a method and apparatus for controlling driving of the electric oil pump. The method includes the steps of deciding whether a predetermined time has elapsed after oil supply to the hydraulic chain tensioner has stopped, deciding whether an engine start prediction signal is inputted to a controller, and driving the electric oil pump to supply oil to the hydraulic tensioner when the engine start prediction signal is inputted. The present invention insures that oil pressure is maintained in the chamber of the hydraulic tensioner before cranking of the engine, thereby preventing oscillation of the chain and tensioner piston at the time of engine start up.
摘要翻译：本发明是用于控制电动油泵的驱动的方法和装置。该方法包括以下步骤：确定在向液压链条张紧器供油之后是否已经经过了预定时间，确定发动机起动预测信号是否被输入到控制器，以及驱动电动油泵向液压张紧器供油当输入发动机起动预测信号时。本发明确保在发动机起动之前在液压张紧器的腔室内保持油压，从而防止发动机起动时链条和张紧器活塞的振动。

9. 发明授权

US5897193A Semiconductor wafer 失效
标题翻译：半导体晶圆
公开(公告)号：US5897193A
公开(公告)日：1999-04-27
申请号：US910763
申请日：1992-07-08
申请人： Tomoki Nishino
发明人： Tomoki Nishino
IPC分类号： G01R31/26 , G01R31/28 , H01L21/66 , H01L23/50 , H01L23/525 , H01L23/52
CPC分类号： G01R31/2884 , G01R31/2856 , H01L23/50 , H01L23/5256 , H01L2924/0002
摘要： A semiconductor wafer is arranged so that a burn-in test, which is performed to remove latent defects, can be conducted while the semiconductor chips are still on the semiconductor wafer. Sets of pad electrodes necessary for the burn-in test of the semiconductor chips are provided on each of the semiconductor wafers and are connected to external pad electrodes formed at a peripheral portion of the semiconductor wafer, by way of metal film wiring lines. High resistance polycrystalline silicone thin film wiring line portions which acts as fuses, and low resistance polycrystalline silicon wiring line portions which are cleanly cut upon dicing, are provided at a suitable intermediate location in the metal thin filming lines.
摘要翻译：半导体晶片被布置成使得可以在半导体芯片仍然在半导体晶片上的同时进行用于去除潜在缺陷的老化测试。在半导体晶片的每一个上设置用于半导体芯片的老化测试所需的焊盘电极组，并且通过金属膜布线与形成在半导体晶片的周边部分的外部焊盘电极连接。作为保险丝的高电阻多晶硅薄膜布线部分和在切割时干净地切割的低电阻多晶硅布线部分设置在金属薄膜生产线的合适的中间位置。

10. 发明授权

US5289349A Integrated circuit card 失效
标题翻译：集成电路卡
公开(公告)号：US5289349A
公开(公告)日：1994-02-22
申请号：US868475
申请日：1992-04-14
申请人： Tomoki Nishino
发明人： Tomoki Nishino
IPC分类号： B42D15/10 , G06K19/077 , H01L23/28 , H01L23/538 , H05K7/06
CPC分类号： H01L23/5388 , H01L2924/0002
摘要： Disclosed is an IC card comprising a plurality of semiconductor IC chips and a plurality of lead wires acting as the terminals for connectin,o the electrodes of the semiconductor IC chips to the outside. The semiconductor IC chips and the lead wires are integrally sealed in a plastic board. This construction provides a significantly thin IC card of high reliability at low cost.
摘要翻译：公开了一种IC卡，其包括多个半导体IC芯片和用作连接端子的多个引线，即半导体IC芯片的电极到外部。半导体IC芯片和引线被一体地密封在塑料板中。这种结构以低成本提供了高可靠性的显着薄的IC卡。

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