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    • 2. 发明授权
    • Transceiver with fault tolerant driver
    • 收发器具有容错驱动
    • US07948275B2
    • 2011-05-24
    • US11971682
    • 2008-01-09
    • Todd Randazzo
    • Todd Randazzo
    • H03B1/00
    • H04L25/0278
    • A fault tolerant driver circuit includes a data output driver that receives an enable input and that includes a transistor formed on an isolation well. A well bias circuit provides a first well bias to the isolation well. The well bias circuit includes voltage-controlled impedances that are controlled by a voltage of the data output line, the enable input and a supply voltage. The voltage-controlled impedances connect the first well bias alternatively to: a common conductor through a first impedance when the supply voltage is ON and the enable input is ON; and a second impedance when the supply voltage is on and enable is OFF.
    • 容错驱动器电路包括接收使能输入并且包括形成在隔离阱上的晶体管的数据输出驱动器。 阱偏置电路为隔离阱提供了第一阱偏置。 阱偏置电路包括由数据输出线的电压,使能输入和电源电压控制的电压控制阻抗。 当电源电压为ON并且使能输入为ON时,电压控制阻抗交替地将第一阱偏压连接到:通过第一阻抗的公共导体; 并且当电源电压接通并使能时为第二阻抗。
    • 8. 发明申请
    • Analog capacitor in dual damascene process
    • 双镶嵌工艺中的模拟电容器
    • US20050042818A1
    • 2005-02-24
    • US10959868
    • 2004-10-06
    • Todd RandazzoKenneth FuchsJohn de Walker
    • Todd RandazzoKenneth FuchsJohn de Walker
    • H01L23/522H01L21/8234
    • H01L21/76807H01L23/5223H01L2924/0002H01L2924/00
    • A process for forming a capacitive structure that includes an upper layer having a first capacitor electrode section therein. A capacitor dielectric layer is formed adjacent the upper layer. The capacitor dielectric layer covers the first capacitor electrode section. A second capacitor electrode layer is formed adjacent the capacitor dielectric layer. The second capacitor electrode layer includes a second capacitor electrode section that at least partially covers the first capacitor electrode section, and which has an edge portion that extends beyond the underlying first capacitor electrode section. The capacitor dielectric layer being disposed between the first capacitor electrode section and the second capacitor electrode section. An upper dielectric layer is formed adjacent the second capacitor electrode section. Portions of the upper dielectric layer and the second capacitor electrode section are selectively removed to form a first via cavity that extends through the upper dielectric layer and the edge portion of the second capacitor electrode section. This exposes the edge portion of the second capacitor electrode section within the first via cavity. The first via cavity is filled with a via metal, which makes electrical connection with the edge portion of the second capacitor electrode section that is exposed within the first via cavity.
    • 一种用于形成电容结构的方法,其包括其中具有第一电容器电极部分的上层。 在上层附近形成电容器电介质层。 电容器电介质层覆盖第一电容器电极部分。 在电容器电介质层附近形成第二电容器电极层。 第二电容器电极层包括至少部分地覆盖第一电容器电极部分并且具有延伸超过下面的第一电容器电极部分的边缘部分的第二电容器电极部分。 电容器电介质层设置在第一电容电极部分和第二电容器电极部分之间。 在第二电容器电极部分附近形成上介电层。 选择性地去除上电介质层和第二电容器电极部分的部分以形成延伸穿过上电介质层和第二电容器电极部分的边缘部分的第一通孔。 这使第二电容电极部分的边缘部分暴露在第一通孔腔内。 第一通孔腔填充有通孔金属,其与第一电容器电极部分的暴露在第一通孔腔内的边缘部分电连接。