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1. 发明授权

US06815084B1 Discontinuous high-modulus fiber metal matrix composite for thermal management applications 失效
标题翻译：不连续的高模量纤维金属基复合材料用于热管理应用
公开(公告)号：US06815084B1
公开(公告)日：2004-11-09
申请号：US10405863
申请日：2003-04-01
申请人： Tim Scott , Tamara White , Jianxing Li
发明人： Tim Scott , Tamara White , Jianxing Li
IPC分类号： B32B508
CPC分类号： H01J37/3435 , C22C47/00 , C23C14/3414 , H01L23/06 , H01L23/3733 , H01L23/3736 , H01L2224/16 , H01L2224/73253 , H01L2924/01057 , H01L2924/01079 , H01L2924/04941 , H01L2924/16152 , Y10T428/12007 , Y10T428/12465 , Y10T428/12486 , Y10T428/12528 , Y10T428/249924
摘要： The invention includes the use of a high-modulus fiber metal matrix composite material as a backing plate for physical vapor deposition targets, as a lid for microelectronics packages, as a heat spreader, and as a heat sink. In one implementation, copper-coated carbon fibers are mixed with copper powder. In another implementation, the mixture is consolidated to a carbon fiber metal matrix composite by using a vacuum hot press. The resultant backing plate has a coefficient of thermal expansion of 4.9×10−6/C, thermal conductivity of at least 300 W/mK, density of greater than 99% of theoretical, and the composite material of the backing plate is 30% lighter than Cu while also having higher stiffness than Cu. The high-modulus fiber metal matrix composite backing plate can be used for high power W, Ta, and ceramic PVD targets.
摘要翻译：本发明包括使用高模量纤维金属基复合材料作为物理气相沉积靶的背板，作为微电子封装的盖子，作为散热器，以及作为散热器。在一个实施方案中，将铜包覆的碳纤维与铜粉末混合。在另一个实施方案中，通过使用真空热压机将混合物固结成碳纤维金属基质复合材料。所得的背板的热膨胀系数为4.9×10 -6 /℃，导热率为至少300W / mK，密度大于理论值的99％，背板的复合材料为30％比Cu轻，同时具有比Cu更高的刚度。高模量纤维金属基复合背板可用于大功率W，Ta和陶瓷PVD靶。

2. 发明授权

US06746619B2 Ferroelectric vapor deposition targets 失效
标题翻译：铁电气相沉积靶
公开(公告)号：US06746619B2
公开(公告)日：2004-06-08
申请号：US10422112
申请日：2003-04-23
申请人： Jianxing Li , Tim Scott , Tamara White
发明人： Jianxing Li , Tim Scott , Tamara White
IPC分类号： C04B35001
CPC分类号： C23C14/3414 , C04B35/462 , C23C14/08 , Y10S977/775 , Y10S977/777 , Y10S977/838 , Y10S977/891
摘要： The invention includes a ferroelectric physical vapor deposition target having a predominate grain size of less than or equal to 1.0 micron, and a density of at least 95% of maximum theoretical density. A method of making the target includes hot pressing a prereacted ferroelectric powder predominately including individual prereacted ferroelectric particles having a maximum straight linear dimension of less than or equal to 100 nanometers to form a physical vapor deposition target of desired shape. In one implementation, the prereacted ferroelectric powder is hot pressed at a maximum pressing temperature which is at least 200° C. lower than would be required to produce at least 85% of maximum theoretical density in hot pressing the same powder but having a predominate particle size maximum straight linear dimension of at least 1.0 micron at the same pressure and for the same amount of time.
摘要翻译：本发明包括具有小于或等于1.0微米的主要晶粒尺寸和最大理论密度的至少95％的密度的铁电物理气相沉积靶。制造目标的方法包括热压预先反应的铁电粉末，主要包括具有小于或等于100纳米的最大直线尺寸的单个预反应铁电粒子，以形成所需形状的物理气相沉积靶。在一个实施方案中，将预反应的铁电粉末以最大压制温度进行热压，所述最高压制温度比在相同粉末热挤压但具有主要颗粒的产生至少85％的最大理论密度所需的最低压力温度尺寸最大直线尺寸在相同的压力下和相同的时间量为至少1.0微米。

3. 发明授权

US06596139B2 Discontinuous high-modulus fiber metal matrix composite for physical vapor deposition target backing plates and other thermal management applications 失效
公开(公告)号：US06596139B2
公开(公告)日：2003-07-22
申请号：US09765526
申请日：2001-01-19
申请人： Tim Scott , Tamara White , Jianxing Li
发明人： Tim Scott , Tamara White , Jianxing Li
IPC分类号： C23C1434
CPC分类号： H01J37/3435 , C22C47/00 , C23C14/3414 , H01L23/06 , H01L23/3733 , H01L23/3736 , H01L2224/16 , H01L2224/73253 , H01L2924/01057 , H01L2924/01079 , H01L2924/04941 , H01L2924/16152 , Y10T428/12007 , Y10T428/12465 , Y10T428/12486 , Y10T428/12528 , Y10T428/249924
摘要： The invention includes the use of a high-modulus fiber metal matrix composite material as a backing plate for physical vapor deposition targets, as a lid for microelectronics packages, as a heat spreader, and as a heat sink. In one implementation, copper-coated carbon fibers are mixed with copper powder. In another implementation, the mixture is consolidated to a carbon fiber metal matrix composite by using a vacuum hot press. The resultant backing plate has a coefficient of thermal expansion of 4.9×10−6/C, thermal conductivity of at least 300 W/mK, density of greater than 99% of theoretical, and the composite material of the backing plate is 30% lighter than Cu while also having higher stiffness than Cu. The high-modulus fiber metal matrix composite backing plate can be used for high power W, Ta, and ceramic PVD targets.

4. 发明授权

US06579467B2 Ferroelectric composition, ferroelectric vapor deposition target and method of making a ferroelectric vapor deposition target 失效
公开(公告)号：US06579467B2
公开(公告)日：2003-06-17
申请号：US10143318
申请日：2002-05-08
申请人： Jianxing Li , Tim Scott , Tamara White
发明人： Jianxing Li , Tim Scott , Tamara White
IPC分类号： C04B3501
CPC分类号： C23C14/3414 , C04B35/462 , C23C14/08 , Y10S977/775 , Y10S977/777 , Y10S977/838 , Y10S977/891
摘要： The invention comprises ferroelectric vapor deposition targets and to methods of making ferroelectric vapor deposition targets. In one implementation, a ferroelectric physical vapor deposition target has a predominate grain size of less than or equal to 1.0 micron, and has a density of at least 95% of maximum theoretical density. In one implementation, a method of making a ferroelectric physical vapor deposition target includes positioning a prereacted ferroelectric powder within a hot press cavity. The prereacted ferroelectric powder predominately includes individual prereacted ferroelectric particles having a maximum straight linear dimension of less than or equal to about 100 nanometers. The prereacted ferroelectric powder is hot pressed within the cavity into a physical vapor deposition target of desired shape having a density of at least about 95% of maximum theoretical density and a predominate maximum grain size which is less than or equal to 1.0 micron. In one implementation, the prereacted ferroelectric powder is hot pressed within the cavity into a physical vapor deposition target of desired shape at a maximum pressing temperature which is at least 200° C. lower than would be required to produce a target of a first density of at least 85% of maximum theoretical density in hot pressing the same powder but having a predominate particle size maximum straight linear dimension of at least 1.0 micron at the same pressure and for the same amount of time, and a target density greater than the first density at the lower pressing temperature is achieved.

5. 发明申请

US20050000821A1 Anodes for electroplating operations, and methods of forming materials over semiconductor substrates 审中-公开
标题翻译：用于电镀操作的阳极以及在半导体衬底上形成材料的方法
公开(公告)号：US20050000821A1
公开(公告)日：2005-01-06
申请号：US10495682
申请日：2001-11-16
申请人： Tamara White , Nancy Dean , Martin Weiser , Michael Pinter
发明人： Tamara White , Nancy Dean , Martin Weiser , Michael Pinter
IPC分类号： C25D1/04 , C25D5/12 , C25D7/12 , C25D17/10 , H01L21/288 , H01L21/60
CPC分类号： H01L24/12 , C25D7/123 , C25D17/10 , H01L21/2885 , H01L24/03 , H01L24/05 , H01L24/11 , H01L2224/0401 , H01L2224/05624 , H01L2224/1147 , H01L2224/11901 , H01L2224/13099 , H01L2224/131 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01092 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/19042 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： The invention includes anodes for electroplating, baths. The anodes have a purity of at least 99.9%, and comprise one or more of silver, gold, nickel, chromium, copper or various solder compositions. The anodes can, for example, comprise at least 99.995% copper/phosphorus alloy, by weight; or at least 99.995% nickel and sulfur, by weight. The invention also includes methods of electroplating, materials over semiconductor substrates.
摘要翻译：本发明包括用于电镀，浴槽的阳极。阳极具有至少99.9％的纯度，并且包含银，金，镍，铬，铜或各种焊料组合物中的一种或多种。阳极可以例如包含按重量计至少99.995％的铜/磷合金; 或至少99.995％的镍和硫。本发明还包括电镀方法，半导体衬底上的材料。

6. 发明授权

US06451222B1 Ferroelectric composition, ferroelectric vapor deposition target and method of making a ferroelectric vapor deposition target 失效
公开(公告)号：US06451222B1
公开(公告)日：2002-09-17
申请号：US09465546
申请日：1999-12-16
申请人： Jianxing Li , Tim Scott , Tamara White
发明人： Jianxing Li , Tim Scott , Tamara White
IPC分类号： C04B3501
CPC分类号： C23C14/3414 , C04B35/462 , C23C14/08 , Y10S977/775 , Y10S977/777 , Y10S977/838 , Y10S977/891
摘要： The invention comprises ferroelectric vapor deposition targets and to methods of making ferroelectric vapor deposition targets. In one implementation, a ferroelectric physical vapor deposition target has a predominate grain size of less than or equal to 1.0 micron, and has a density of at least 95% of maximum theoretical density. In one implementation, a method of making a ferroelectric physical vapor deposition target includes positioning a prereacted ferroelectric powder within a hot press cavity. The prereacted ferroelectric powder predominately includes individual prereacted ferroelectric particles having a maximum straight linear dimension of less than or equal to about 100 nanometers. The prereacted ferroelectric powder is hot pressed within the cavity into a physical vapor deposition target of desired shape having a density of at least about 95% of maximum theoretical density and a predominate maximum grain size which is less than or equal to 1.0 micron. In one implementation, the prereacted ferroelectric powder is hot pressed within the cavity into a physical vapor deposition target of desired shape at a maximum pressing temperature which is at least 200° C. lower than would be required to produce a target of a first density of at least 85% of maximum theoretical density in hot pressing the same powder but having a predominate particle size maximum straight linear dimension of at least 1.0 micron at the same pressure and for the same amount of time, and a target density greater than the first density at the lower pressing temperature is achieved.

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