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1. 发明授权

US08702247B2 Projection-type image display device and projection-type image display system 有权
公开(公告)号：US08702247B2
公开(公告)日：2014-04-22
申请号：US11862784
申请日：2007-09-27
申请人： Ryuhei Amano , Takashi Miwa , Yoshihiro Yokote
发明人： Ryuhei Amano , Takashi Miwa , Yoshihiro Yokote
IPC分类号： G03B21/28 , G03B21/22 , G03B21/14 , G02B5/08
CPC分类号： G03B21/10 , G03B21/28 , H04N9/3141
摘要： A projection-type image display device includes an image light generator configured to generate image light, a projection optics configured to project the image light onto a screen. The projection optics includes a reflection mirror configured to reflect the image light toward the screen, the image light outputted from the image light generator. A projection-type image display device includes a protective cover provided on an optical path of the image light reflected by the reflection mirror. The protective cover has a transmissive region transmitting the image light reflected by the reflection mirror.

2. 发明申请

US20100330742A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US20100330742A1
公开(公告)日：2010-12-30
申请号：US12793923
申请日：2010-06-04
申请人： Michiaki Sugiyama , Takashi Miwa , Toshikazu Ishikawa , Tatsuya Hirai
发明人： Michiaki Sugiyama , Takashi Miwa , Toshikazu Ishikawa , Tatsuya Hirai
IPC分类号： H01L21/60
CPC分类号： H01L23/49833 , H01L24/16 , H01L24/48 , H01L24/97 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L25/18 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/97 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15153 , H01L2924/1517 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2224/81 , H01L2924/00 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/0555 , H01L2224/0556
摘要： A first conductive member made of metal is provided over a first wiring substrate, which is a mounting substrate in the lower tier, a through hole is provided in a second wiring substrate, which is a mounting substrate in the upper tier, at a position corresponding to the first conductive member in a plan view, and a wiring is exposed at the sidewall of the through hole. The first conductive member is inserted into the through hole on the corresponding first wiring substrate side and the first wiring substrate and the second wiring substrate are electrically coupled by filling the through hole with a second conductive member. an electrode pad that is electrically coupled to the second conductive member and over which a semiconductor member in the upper tier is mounted is formed on the main surface side of the second wiring substrate.
摘要翻译：金属制的第一导电部件设置在第一布线基板上，第一布线基板是下层中的安装基板，通孔设置在第二布线基板中，第二布线基板是上层中的安装基板，在平面图中的第一导电构件，并且布线在通孔的侧壁处露出。将第一导电构件插入对应的第一布线基板侧的通孔中，并且通过用第二导电构件填充通孔来电耦合第一布线基板和第二布线基板。在第二布线基板的主表面侧形成有电耦合到第二导电构件并且在其上安装上层中的半导体构件的电极焊盘。

3. 发明申请

US20100183480A1 OZONE DETECTING DEVICE 有权
标题翻译：臭氧检测装置
公开(公告)号：US20100183480A1
公开(公告)日：2010-07-22
申请号：US12440214
申请日：2007-10-02
申请人： Yasuko Maruo , Takashi Miwa , Jiro Nakamura , Tatsuya Kunioka
发明人： Yasuko Maruo , Takashi Miwa , Jiro Nakamura , Tatsuya Kunioka
IPC分类号： G01J1/48
CPC分类号： G01N31/225 , G01N21/783 , Y10T436/206664
摘要： An aqueous solution is formed by dissolving a dye made of alizarin and a humectant made of glycerin, and alkalized by dissolving a base (alkaline substance), thereby preparing a detector solution (101) in which the content of the humectant is about 20 wt %. An impregnated carrier (104) impregnated with the detector solution (101) is formed by dipping for 30 sec a sheet-like carrier (103) made of cellulose filter paper in the detector solution (101) so that the carrier (103) is impregnated with the detector solution (101). The impregnated carrier (104) is pulled up from the detector solution (101), and dried in dry nitrogen by evaporating a solvent such as water contained in the impregnated carrier (104), thereby forming an ozone detecting device (105).
摘要翻译：通过将由茜素制成的染料和由甘油制成的湿润剂溶解并通过溶解碱（碱性物质）碱化而形成水溶液，由此制备其中保湿剂的含量为约20重量％的检测剂溶液（101）。浸渍有检测器溶液（101）的浸渍载体（104）通过在检测器溶液（101）中浸渍30秒的由纤维素滤纸制成的片状载体（103）形成，使载体（103）浸渍与检测器溶液（101）。将浸渍的载体（104）从检测器溶液（101）中拉出，并通过蒸发包含在浸渍载体（104）中的水的溶剂在干燥氮气中干燥，从而形成臭氧检测装置（105）。

4. 发明申请

US20100182575A1 PROJECTION-TYPE IMAGE DISPLAY DEVICE AND PROJECTION-TYPE IMAGE DISPLAY SYSTEM 有权
标题翻译：投影型图像显示装置和投影型图像显示系统
公开(公告)号：US20100182575A1
公开(公告)日：2010-07-22
申请号：US12707787
申请日：2010-02-18
申请人： Ryuhei Amano , Takashi Miwa , Yoshihiro Yokote
发明人： Ryuhei Amano , Takashi Miwa , Yoshihiro Yokote
IPC分类号： G03B21/28
CPC分类号： G03B21/10 , G03B21/28 , H04N9/3141
摘要： A projection-type image display device includes an image light generator configured to generate image light, a projection optics configured to project the image light onto a screen. The projection optics includes a s reflection mirror configured to reflect the image light toward the screen, the image light outputted from the image light generator. A projection-type image display device includes a protective cover provided on an optical path of the image light reflected by the reflection mirror. The protective cover has a transmissive region transmitting the image light reflected by the reflection mirror.
摘要翻译：投影型图像显示装置包括被配置为生成图像光的图像光发生器，被配置为将图像光投射到屏幕上的投影光学元件。投影光学元件包括被配置为将图像光朝向屏幕反射的反射镜，即从图像光发生器输出的图像光。投影型图像显示装置包括设置在由反射镜反射的图像光的光路上的保护盖。保护罩具有透射由透镜反射的图像光的透射区域。

5. 发明授权

US07656019B2 Semiconductor device and a manufacturing method of the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07656019B2
公开(公告)日：2010-02-02
申请号：US11520816
申请日：2006-09-14
申请人： Yasumi Tsutsumi , Takashi Miwa
发明人： Yasumi Tsutsumi , Takashi Miwa
IPC分类号： H01L23/495
CPC分类号： H01L24/49 , H01L23/49838 , H01L23/544 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L25/0652 , H01L2223/54486 , H01L2224/05553 , H01L2224/05554 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/4809 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48228 , H01L2224/48233 , H01L2224/48465 , H01L2224/48599 , H01L2224/49171 , H01L2224/49175 , H01L2224/49431 , H01L2224/49433 , H01L2224/73265 , H01L2224/85 , H01L2225/0651 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device is disclosed wherein first wiring lines in a first row extend respectively from first connecting portions toward one side of a semiconductor chip, while second wiring lines extend respectively from second connecting portions toward the side opposite to the one side of the semiconductor chip. The reduction in size of the semiconductor device can be attained.
摘要翻译：公开了一种半导体器件，其中第一行中的第一布线分别从第一连接部分向半导体芯片的一侧延伸，而第二布线分别从第二连接部分延伸到与半导体芯片的一侧相对的一侧。可以实现半导体器件的尺寸减小。

6. 发明申请

US20080218706A1 Projection display device 有权
标题翻译：投影显示设备
公开(公告)号：US20080218706A1
公开(公告)日：2008-09-11
申请号：US12073292
申请日：2008-03-04
申请人： Takaharu Adachi , Shinichi Okuno , Ryuhei Amano , Takashi Ikeda , Takashi Miwa
发明人： Takaharu Adachi , Shinichi Okuno , Ryuhei Amano , Takashi Ikeda , Takashi Miwa
IPC分类号： G03B21/28
CPC分类号： G03B21/28
摘要： A projection display device comprises a projection lens section to which light modulated by a light modulating element is entered, a mirror section for reflecting the light emitted from the projection lens section to reflect to the projection lens section side and directing the light to a projection plane, and an operation section for displacing a lens in the projection lens section. The operation section is disposed in a region in which the operation section does not hinder an optical path of the light that has been passed through a projection port provided in a main body cabinet.
摘要翻译：投影显示装置包括投影透镜部分，由光调制元件调制的光进入该投影透镜部分，用于反射从投影透镜部分发射的光以反射到投影透镜部分侧并将光引导到投影平面的反射镜部分以及用于移动投影透镜部中的透镜的操作部。操作部设置在操作部不妨碍通过设置在主体机壳中的突出口的光的光路的区域。

7. 发明申请

US20060180943A1 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US20060180943A1
公开(公告)日：2006-08-17
申请号：US11401284
申请日：2006-04-11
申请人： Takashi Miwa , Yasumi Tsutsumi , Masahiro Ichitani , Takanori Hashizume , Masamichi Sato , Naozumi Morino , Atsushi Nakamura , Saneaki Tamaki , Ikuo Kudo
发明人： Takashi Miwa , Yasumi Tsutsumi , Masahiro Ichitani , Takanori Hashizume , Masamichi Sato , Naozumi Morino , Atsushi Nakamura , Saneaki Tamaki , Ikuo Kudo
IPC分类号： H01L23/52 , H01L23/48
CPC分类号： H01L25/0657 , H01L23/5386 , H01L25/18 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2225/0651 , H01L2225/06527 , H01L2225/06541 , H01L2225/06555 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/00014 , H01L2924/00
摘要： The present invention provides a semiconductor device having a stacked structure which realizes the miniaturization of a contour size and the reduction of thickness. The present invention also provides a semiconductor device which realizes high performance and high reliability in addition to the miniaturization of the contour size. The semiconductor device uses a package substrate on which bonding leads which are formed respectively corresponding to bonding pads for address and data which are distributed to opposing first and second sides of a memory chip and address terminals and data terminals which are connected to the bonding leads are formed. The semiconductor device further includes an address output circuit and a data input/output circuit which are also served for memory access and a signal processing circuit having a data processing function. A semiconductor chip in which bonding pads which are connected to the bonding leads corresponding to the address terminals of the package substrate and bonding pads which are connected to the bonding leads corresponding to the data terminals of the package substrate are distributed to two sides out of four sides and the above-mentioned memory chip are mounted on the package substrate in a stacked structure.
摘要翻译：本发明提供一种具有层叠结构的半导体器件，其实现了轮廓尺寸的小型化和厚度的减小。本发明还提供了除了轮廓尺寸的小型化之外还实现高性能和高可靠性的半导体器件。半导体装置使用封装基板，在该封装基板上分别对应于分配给存储芯片的相对的第一和第二侧的地址和数据的接合焊盘形成的接合引线以及连接到接合引线的地址端子和数据端子形成。半导体器件还包括还用于存储器访问的地址输出电路和数据输入/输出电路以及具有数据处理功能的信号处理电路。一种半导体芯片，其中连接到与封装基板的地址端子相对应的接合引线的接合焊盘和连接到与封装基板的数据端子对应的接合引线的接合焊盘分配到四个侧面和上述存储芯片以堆叠结构安装在封装基板上。

8. 发明授权

US07061785B2 Stacked large-scale integrated circuit (LSI) semiconductor device with miniaturization and thinning of package 失效
标题翻译：堆叠大型集成电路（LSI）半导体器件，封装小型化和薄型化
公开(公告)号：US07061785B2
公开(公告)日：2006-06-13
申请号：US10606891
申请日：2003-06-27
申请人： Takashi Miwa , Yasumi Tsutsumi , Masahiro Ichitani , Takanori Hashizume , Masamichi Sato , Naozumi Morino , Atsushi Nakamura , Saneaki Tamaki , Ikuo Kudo
发明人： Takashi Miwa , Yasumi Tsutsumi , Masahiro Ichitani , Takanori Hashizume , Masamichi Sato , Naozumi Morino , Atsushi Nakamura , Saneaki Tamaki , Ikuo Kudo
IPC分类号： G11C5/06
CPC分类号： H01L25/0657 , H01L23/5386 , H01L25/18 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2225/0651 , H01L2225/06527 , H01L2225/06541 , H01L2225/06555 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor device uses a package substrate on which bonding leads are formed respectively corresponding to bonding pads for address and data which are distributed to opposing first and second sides of a memory chip and address terminals and data terminals which are connected to the bonding leads. The semiconductor device further includes an address output circuit and a data input/output circuit which also serves for memory access and a signal processing circuit having a data processing function. A semiconductor chip having bonding pads connected to the bonding leads corresponding to the address terminals of the package substrate and bonding pads connected to the bonding leads corresponding to the data terminals of the package substrate and distributed to two sides out of four sides and the above-mentioned memory chip are mounted on the package substrate in a stacked structure.
摘要翻译：半导体器件使用分别对应于分配到存储器芯片的相对的第一和第二侧的地址和数据的接合焊盘以及连接到接合引线的地址端子和数据端子分别形成有接合引线的封装基板。半导体器件还包括地址输出电路和用于存储器访问的数据输入/输出电路和具有数据处理功能的信号处理电路。一种半导体芯片，其具有连接到与封装基板的地址端子对应的接合引线的接合焊盘以及连接到与封装基板的数据端子相对应的接合引线的接合焊盘，并且分布在四边的两侧，上述存储芯片以堆叠结构安装在封装基板上。

9. 发明申请

US20060082732A1 Projection type video display apparatus 有权
公开(公告)号：US20060082732A1
公开(公告)日：2006-04-20
申请号：US11248607
申请日：2005-10-13
申请人： Takashi Miwa , Takashi Ikeda
发明人： Takashi Miwa , Takashi Ikeda
IPC分类号： G02F1/1335 , G03B21/00
CPC分类号： H04N9/3141 , H04N9/3144
摘要： There is provided a heat conductive portion for conducting heat generated by an LED light source to cooling liquid at a rear side of each LED light source. Each heat conductive portion is connected one another with a pipe, and the cooling liquid flowing in the pipe is sequentially circulated through each heat conductive portion. A heat generation amount of an LED light source for red light is the smallest, the heat generation amount of an LED light source for green light is the largest, and the heat generation amount of an LED light source for blue light is the middle of the two. The cooling liquid cooled by passing through a radiation fin is firstly supplied to the heat conductive portion for the LED light source for red light, secondly supplied to the heat conductive portion for the LED light source for blue light, and lastly supplied to the heat conductive portion for the LED light source for green light. The cooling liquid discharged from a pump is supplied to the heat conductive portion for the heat conductive portion for the LED light source for green light. Then, the cooling liquid from this heat conductive portion passes through the pipe to be supplied to the radiation fin (radiator).

10. 发明授权

US4654559A Flat color cathode-ray tube 失效
标题翻译：平面彩色阴极射线管
公开(公告)号：US4654559A
公开(公告)日：1987-03-31
申请号：US776270
申请日：1985-09-16
申请人： Katsuhiro Hinotani , Hajime Hayama , Shunichi Kishimoto , Takashi Miwa , Yasuo Funazo , Kazuhiro Kouno
发明人： Katsuhiro Hinotani , Hajime Hayama , Shunichi Kishimoto , Takashi Miwa , Yasuo Funazo , Kazuhiro Kouno
IPC分类号： H01J31/20 , H01J29/32 , H01J29/34 , H01J31/12 , H04N9/24 , H01J29/86
CPC分类号： H01J29/327 , H01J29/325 , H04N9/24 , H01J2231/121
摘要： A flat color CRT wherein a single beam emitted from an electron gun scans the inner surface of a tube wall and which includes a phosphor screen formed on the walls inner surface. The phosphor screen comprises a nonluminescent substance and phosphor index stripes with the substance interposed between the stripes. Red, green, blue primary phosphor color stripes have a sufficient thickness and are arranged repeatedly on the nonluminescent substance at a spacing in a definite relation to the phosphor index stripes.
摘要翻译：一种扁平彩色CRT，其中从电子枪发射的单个光束扫描管壁的内表面，并且其包括形成在壁内表面上的荧光屏。荧光屏包括非发光物质和荧光体指数条纹，物质插入条纹之间。红色，绿色，蓝色的初级荧光体彩色条纹具有足够的厚度，并以与荧光体指数条纹有关的间隔重复地布置在非发光物质上。

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