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1. 发明授权

US08749443B2 Wireless terminal device 有权
标题翻译：无线终端设备
公开(公告)号：US08749443B2
公开(公告)日：2014-06-10
申请号：US13142122
申请日：2009-12-25
申请人： Takanori Hashizume
发明人： Takanori Hashizume
IPC分类号： H01Q1/52
CPC分类号： H01Q21/28 , H01Q1/243 , H04M1/0216 , H04M2250/10
摘要： A first conduction part (12) coated with a conductive paint is formed on a back housing (1CAR) to be attached to one housing of a portable telephone unit at a position near a hinge mechanism (9) which connects the one housing to the other housing of the portable telephone unit. A GPS antenna is disposed on the hinge mechanism (9) side inside the other housing. The first conduction part (12) is in contact with a conductive connection terminal (21). A condenser element (22C) and a coil element (22L) are connected in parallel between the connection terminal (21) and a reference potential line (10G) of a first circuit board (10) disposed inside the aforementioned one housing.
摘要翻译：涂覆有导电涂料的第一导电部分（12）形成在后壳体（1CAR）上，以在靠近铰链机构（9）的位置附接到便携式电话单元的一个壳体，所述铰链机构（9）将一个壳体连接到另一壳体便携式电话机的外壳。 GPS天线设置在另一壳体内的铰链机构（9）侧。第一导电部分（12）与导电连接端子（21）接触。电容器元件（22C）和线圈元件（22L）并联连接在设置在上述一个壳体内部的第一电路板（10）的连接端子（21）和基准电位线（10G）之间。

2. 发明授权

US07286386B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US07286386B2
公开(公告)日：2007-10-23
申请号：US11401284
申请日：2006-04-11
申请人： Takashi Miwa , Yasumi Tsutsumi , Masahiro Ichitani , Takanori Hashizume , Masamichi Sato , Naozumi Morino , Atsushi Nakamura , Saneaki Tamaki , Ikuo Kudo
发明人： Takashi Miwa , Yasumi Tsutsumi , Masahiro Ichitani , Takanori Hashizume , Masamichi Sato , Naozumi Morino , Atsushi Nakamura , Saneaki Tamaki , Ikuo Kudo
IPC分类号： G11C5/06 , H01L23/48
CPC分类号： H01L25/0657 , H01L23/5386 , H01L25/18 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2225/0651 , H01L2225/06527 , H01L2225/06541 , H01L2225/06555 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor device uses a package substrate on which bonding leads are formed respectively corresponding to bonding pads for address and data which are distributed to opposing first and second sides of a memory chip and address terminals and data terminals which are connected to the bonding leads. The semiconductor device further includes an address output circuit and a data input/output circuit which also serves for memory access and a signal processing circuit having a data processing function. A semiconductor chip having bonding pads connected to the bonding leads corresponding to the address terminals of the package substrate and bonding pads connected to the bonding leads corresponding to the data terminals of the package substrate and distributed to two sides out of four sides and the above-mentioned memory chip are mounted on the package substrate in a stacked structure. Bonding leads arranged along at least one side of the substrate may include bonding leads of rectangular configuration having longer sides disposed at acute angles with respect to the side of the substrate.
摘要翻译：半导体器件使用分别对应于分配到存储器芯片的相对的第一和第二侧的地址和数据的接合焊盘以及连接到接合引线的地址端子和数据端子分别形成有接合引线的封装基板。半导体器件还包括地址输出电路和用于存储器访问的数据输入/输出电路和具有数据处理功能的信号处理电路。一种半导体芯片，其具有连接到与封装基板的地址端子对应的接合引线的接合焊盘以及连接到与封装基板的数据端子相对应的接合引线的接合焊盘，并且分布在四边的两侧，上述存储芯片以堆叠结构安装在封装基板上。沿着衬底的至少一侧布置的接合引线可以包括具有相对于衬底的侧面以锐角设置的长边的矩形构造的接合引线。

3. 发明授权

US06723583B2 Method of manufacturing a semiconductor device using a mold 有权
标题翻译：使用模具制造半导体器件的方法
公开(公告)号：US06723583B2
公开(公告)日：2004-04-20
申请号：US10453606
申请日：2003-06-04
申请人： Noriyuki Takahashi , Masayuki Suzuki , Kouji Tsuchiya , Takao Matsuura , Takanori Hashizume , Masahiro Ichitani , Kazunari Suzuki , Takafumi Nishita , Kenichi Imura , Takashi Miwa
发明人： Noriyuki Takahashi , Masayuki Suzuki , Kouji Tsuchiya , Takao Matsuura , Takanori Hashizume , Masahiro Ichitani , Kazunari Suzuki , Takafumi Nishita , Kenichi Imura , Takashi Miwa
IPC分类号： H01L2144
CPC分类号： H01L23/564 , H01L21/561 , H01L21/565 , H01L23/3128 , H01L23/49816 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2223/5442 , H01L2223/54473 , H01L2224/16 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2224/92 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/07802 , H01L2924/0781 , H01L2924/14 , H01L2924/1433 , H01L2924/15151 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , H01L2924/30105 , H01L2924/351 , H01L2224/83 , H01L2224/85 , H01L2924/00014 , H01L2224/92247 , H01L2924/00 , H01L2924/00012
摘要： The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.
摘要翻译：将其上安装有多个半导体芯片的带状基板的背面真空吸附到模具的下半模，并且在该状态下，多个半导体芯片同时用树脂密封以形成密封构件。此后，带状基板和密封构件从模具中释放并切割成多个半导体器件。由此获得的半导体器件的安装可靠性得到改善。

4. 发明申请

US20130053099A1 HUMAN BODY DETECTING SYSTEM 有权
标题翻译：人体检测系统
公开(公告)号：US20130053099A1
公开(公告)日：2013-02-28
申请号：US13593146
申请日：2012-08-23
申请人： Toshihisa NABATA , Akira KOYAMA , Takanori HASHIZUME , Akinori KANAI
发明人： Toshihisa NABATA , Akira KOYAMA , Takanori HASHIZUME , Akinori KANAI
IPC分类号： G01K13/04
CPC分类号： G01J5/025 , G01J5/0025 , G01J5/026 , G01J5/0265 , G01J5/028 , G01J5/047 , G01J5/0846 , G01J5/0893 , G01J5/34 , G01J2005/068
摘要： According to an aspect, a human body detecting system includes a mobile communication device, a stand, and a false detection reducing unit. The mobile communication device includes a communication unit for performing communication. The stand includes a human sensor for detecting a human body based on an ambient temperature distribution, and a storage unit for storing detection information of the human sensor. The false detection reducing unit is configured to perform false detection reducing processing on at least either one of the detection information of the human sensor and operation of the human sensor.
摘要翻译：根据一个方面，一种人体检测系统包括移动通信装置，支架和假检测减少单元。移动通信设备包括用于执行通信的通信单元。支架包括用于基于环境温度分布检测人体的人体传感器，以及用于存储人体传感器的检测信息的存储单元。假检测减少单元被配置为对人体传感器的检测信息和人体传感器的操作中的至少一个进行错误检测减少处理。

5. 发明申请

US20060046680A1 Wireless communication apparatus 失效
公开(公告)号：US20060046680A1
公开(公告)日：2006-03-02
申请号：US11215022
申请日：2005-08-30
申请人： Takanori Hashizume , Harunobu Seita
发明人： Takanori Hashizume , Harunobu Seita
IPC分类号： H04B1/10
CPC分类号： H01Q1/38 , H01Q1/243 , H01Q1/362 , H04M1/0214 , H04M1/0218 , H04M1/0245 , H04M2250/16
摘要： An wireless communication apparatus having a first case and a second case connected on each end to be able to open and close. The first case has an antenna element in an end opposite to the connected end, the second case has a first display unit displaying an image on a facing surface facing the first case in a closed state, a first drive unit driving the first display unit, a second display unit displaying an image on a back surface which is behind the facing surface, a second drive unit driving the second display unit, a frame which is provided between the first display unit and the second display unit and touched a back of the first display unit. The frame, the first drive unit and the second drive unit are arranged without overlapping the antenna element in the closed state, the second display unit is layered on the frame to overlap the second display unit and the antenna element in the closed state.

6. 发明申请

US20050127535A1 Method of manufacturing a semiconductor device and a semiconductor device 有权
标题翻译：制造半导体器件和半导体器件的方法
公开(公告)号：US20050127535A1
公开(公告)日：2005-06-16
申请号：US11047660
申请日：2005-02-02
申请人： Noriyuki Takahashi , Masayuki Suzuki , Kouji Tsuchiya , Takao Matsuura , Takanori Hashizume , Masahiro Ichitani , Kazunari Suzuki , Takafumi Nishita , Kenichi Imura , Takashi Miwa
发明人： Noriyuki Takahashi , Masayuki Suzuki , Kouji Tsuchiya , Takao Matsuura , Takanori Hashizume , Masahiro Ichitani , Kazunari Suzuki , Takafumi Nishita , Kenichi Imura , Takashi Miwa
IPC分类号： B29C45/14 , H01L21/56 , H01L23/00 , H01L23/12 , H01L23/31 , H01L23/498 , H01L23/28
CPC分类号： H01L23/564 , H01L21/561 , H01L21/565 , H01L23/3128 , H01L23/49816 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2223/5442 , H01L2223/54473 , H01L2224/16 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2224/92 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/07802 , H01L2924/0781 , H01L2924/14 , H01L2924/1433 , H01L2924/15151 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , H01L2924/30105 , H01L2924/351 , H01L2224/83 , H01L2224/85 , H01L2924/00014 , H01L2224/92247 , H01L2924/00 , H01L2924/00012
摘要： The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.
摘要翻译：将其上安装有多个半导体芯片的带状基板的背面真空吸附到模具的下半模，并且在该状态下，多个半导体芯片同时用树脂密封以形成密封构件。此后，带状基板和密封构件从模具中释放并切割成多个半导体器件。由此获得的半导体器件的安装可靠性得到改善。

7. 发明授权

US06872597B2 Method of manufacturing a semiconductor device and a semiconductor device 有权
公开(公告)号：US06872597B2
公开(公告)日：2005-03-29
申请号：US10784276
申请日：2004-02-24
申请人： Noriyuki Takahashi , Masayuki Suzuki , Kouji Tsuchiya , Takao Matsuura , Takanori Hashizume , Masahiro Ichitani , Kazunari Suzuki , Takafumi Nishita , Kenichi Imura , Takashi Miwa
发明人： Noriyuki Takahashi , Masayuki Suzuki , Kouji Tsuchiya , Takao Matsuura , Takanori Hashizume , Masahiro Ichitani , Kazunari Suzuki , Takafumi Nishita , Kenichi Imura , Takashi Miwa
IPC分类号： B29C45/14 , H01L21/56 , H01L23/00 , H01L23/12 , H01L23/31 , H01L23/498 , H01L21/44
CPC分类号： H01L23/564 , H01L21/561 , H01L21/565 , H01L23/3128 , H01L23/49816 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2223/5442 , H01L2223/54473 , H01L2224/16 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2224/92 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/07802 , H01L2924/0781 , H01L2924/14 , H01L2924/1433 , H01L2924/15151 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , H01L2924/30105 , H01L2924/351 , H01L2224/83 , H01L2224/85 , H01L2924/00014 , H01L2224/92247 , H01L2924/00 , H01L2924/00012
摘要： The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.

8. 发明授权

US06596561B2 Method of manufacturing a semiconductor device using reinforcing patterns for ensuring mechanical strength during manufacture 有权
标题翻译：使用加强图案制造半导体器件的方法，用于确保制造期间的机械强度
公开(公告)号：US06596561B2
公开(公告)日：2003-07-22
申请号：US09987532
申请日：2001-11-15
申请人： Noriyuki Takahashi , Masayuki Suzuki , Kouji Tsuchiya , Takao Matsuura , Takanori Hashizume , Masahiro Ichitani , Kazunari Suzuki , Takafumi Nishita , Kenichi Imura , Takashi Miwa
发明人： Noriyuki Takahashi , Masayuki Suzuki , Kouji Tsuchiya , Takao Matsuura , Takanori Hashizume , Masahiro Ichitani , Kazunari Suzuki , Takafumi Nishita , Kenichi Imura , Takashi Miwa
IPC分类号： H01L2144
CPC分类号： H01L23/564 , H01L21/561 , H01L21/565 , H01L23/3128 , H01L23/49816 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2223/5442 , H01L2223/54473 , H01L2224/16 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2224/92 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/07802 , H01L2924/0781 , H01L2924/14 , H01L2924/1433 , H01L2924/15151 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , H01L2924/30105 , H01L2924/351 , H01L2224/83 , H01L2224/85 , H01L2924/00014 , H01L2224/92247 , H01L2924/00 , H01L2924/00012
摘要： The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.
摘要翻译：将其上安装有多个半导体芯片的带状基板的背面真空吸附到模具的下半模，并且在该状态下，多个半导体芯片同时用树脂密封以形成密封构件。此后，带状基板和密封构件从模具中释放并切割成多个半导体器件。由此获得的半导体器件的安装可靠性得到改善。

9. 发明授权

US09377361B2 Human body detecting system 有权
标题翻译：人体检测系统
公开(公告)号：US09377361B2
公开(公告)日：2016-06-28
申请号：US13593146
申请日：2012-08-23
申请人： Toshihisa Nabata , Akira Koyama , Takanori Hashizume , Akinori Kanai
发明人： Toshihisa Nabata , Akira Koyama , Takanori Hashizume , Akinori Kanai
IPC分类号： G01J5/06 , G01J5/02 , G01J5/04 , G01J5/34 , G01J5/08 , G01J5/00
CPC分类号： G01J5/025 , G01J5/0025 , G01J5/026 , G01J5/0265 , G01J5/028 , G01J5/047 , G01J5/0846 , G01J5/0893 , G01J5/34 , G01J2005/068
摘要： According to an aspect, a human body detecting system includes a mobile communication device, a stand, and a false detection reducing unit. The mobile communication device includes a communication unit for performing communication. The stand includes a human sensor for detecting a human body based on an ambient temperature distribution, and a storage unit for storing detection information of the human sensor. The false detection reducing unit is configured to perform false detection reducing processing on at least either one of the detection information of the human sensor and operation of the human sensor.
摘要翻译：根据一个方面，一种人体检测系统包括移动通信装置，支架和假检测减少单元。移动通信设备包括用于执行通信的通信单元。支架包括用于基于环境温度分布检测人体的人体传感器，以及用于存储人体传感器的检测信息的存储单元。假检测减少单元被配置为对人体传感器的检测信息和人体传感器的操作中的至少一个进行错误检测减少处理。

10. 发明申请

US20110260942A1 WIRELESS TERMINAL DEVICE 有权
标题翻译：无线终端设备
公开(公告)号：US20110260942A1
公开(公告)日：2011-10-27
申请号：US13142122
申请日：2009-12-25
申请人： Takanori Hashizume
发明人： Takanori Hashizume
IPC分类号： H01Q21/30
CPC分类号： H01Q21/28 , H01Q1/243 , H04M1/0216 , H04M2250/10
摘要： A first conduction part (12) coated with a conductive paint is formed on a back housing (1CAR) to be attached to one housing of a portable telephone unit at a position near a hinge mechanism (9) which connects the one housing to the other housing of the portable telephone unit. A GPS antenna is disposed on the hinge mechanism (9) side inside the other housing. The first conduction part (12) is in contact with a conductive connection terminal (21). A condenser element (22C) and a coil element (22L) are connected in parallel between the connection terminal (21) and a reference potential line (10G) of a first circuit board (10) disposed inside the aforementioned one housing.
摘要翻译：涂覆有导电涂料的第一导电部分（12）形成在后壳体（1CAR）上，以在靠近铰链机构（9）的位置附接到便携式电话单元的一个壳体，所述铰链机构（9）将一个壳体连接到另一壳体便携式电话机的外壳。 GPS天线设置在另一壳体内的铰链机构（9）侧。第一导电部分（12）与导电连接端子（21）接触。电容器元件（22C）和线圈元件（22L）并联连接在设置在上述一个壳体内部的第一电路板（10）的连接端子（21）和基准电位线（10G）之间。

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