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1. 发明授权

US08399381B2 Condensed heterocyclic sulfonyl urea compound, a herbicide containing the same, and a method for weed control using the same 有权
标题翻译：缩合杂环磺酰脲化合物，含有它们的除草剂，以及使用其的杂草控制方法
公开(公告)号：US08399381B2
公开(公告)日：2013-03-19
申请号：US12659165
申请日：2010-02-26
申请人： Yasushi Tanaka , Yukari Kajiwara , Makoto Noguchi , Takeshi Kajiwara , Takanori Tabuchi
发明人： Yasushi Tanaka , Yukari Kajiwara , Makoto Noguchi , Takeshi Kajiwara , Takanori Tabuchi
IPC分类号： A01N43/54 , A01N47/36 , C07D487/00 , C07D403/00 , C07D239/02
CPC分类号： C07D471/04 , A01N47/36 , C07D487/04 , C07D513/04
摘要： The present invention provides a compound represented by the formula: wherein Q represents a fused heterocyclic group, X and Y are the same or different and each represent an optionally halogenated lower alkyl group, an optionally halogenated lower alkoxy group, etc., or a salt thereof, as well as a herbicide comprising the compound or a salt thereof, which exhibits a significant effect for control of sulfonylurea herbicide-resistant weeds in paddy fields and can reduce the number of active ingredients in a combined preparation and a method of controlling sulfonylurea herbicide-resistant weeds which comprises using the same.
摘要翻译：本发明提供由下式表示的化合物：其中Q表示稠合杂环基，X和Y相同或不同，表示任选卤代的低级烷基，任选卤代的低级烷氧基等，或盐以及含有该化合物或其盐的除草剂，其对稻田中磺酰脲类除草剂抗性杂草的控制具有显着的效果，并且可以减少组合制剂中活性成分的数量和控制磺酰脲类除草剂的方法包括使用它们的抗性杂草。

2. 发明授权

US07816526B2 Condensed heterocyclic sulfonyl urea compound, a herbicide containing the same, and a method for weed control using the same 有权
标题翻译：缩合杂环磺酰脲化合物，含有它们的除草剂，以及使用其的杂草控制方法
公开(公告)号：US07816526B2
公开(公告)日：2010-10-19
申请号：US10498805
申请日：2003-01-15
申请人： Yasushi Tanaka , Yukari Kajiwara , Makoto Noguchi , Takeshi Kajiwara , Takanori Tabuchi
发明人： Yasushi Tanaka , Yukari Kajiwara , Makoto Noguchi , Takeshi Kajiwara , Takanori Tabuchi
IPC分类号： C07D487/00 , C07D403/00 , C07D239/02 , A01N47/36 , A01N43/54
CPC分类号： C07D471/04 , A01N47/36 , C07D487/04 , C07D513/04
摘要： The present invention provides a compound represented by the formula: wherein Q represents a fused heterocyclic group, X and Y are the same or different and each represent an optionally halogenated lower alkyl group, an optionally halogenated lower alkoxy group, etc., or a salt thereof, as well as a herbicide comprising the compound or a salt thereof, which exhibits a significant effect for control of sulfonylurea herbicide-resistant weeds in paddy fields and can reduce the number of active ingredients in a combined preparation and a method of controlling sulfonylurea herbicide-resistant weeds which comprises using the same.
摘要翻译：本发明提供由下式表示的化合物：其中Q表示稠合杂环基，X和Y相同或不同，表示任选卤代的低级烷基，任选卤代的低级烷氧基等，或盐以及含有该化合物或其盐的除草剂，其对稻田中磺酰脲类除草剂抗性杂草的控制具有显着的效果，并且可以减少组合制剂中活性成分的数量和控制磺酰脲类除草剂的方法包括使用它们的抗性杂草。

3. 发明授权

US07307165B2 Process for producting imidazo[1,2-b]pyridazine derivative 有权
标题翻译：制备咪唑并[1,2-b]哒嗪衍生物的方法
公开(公告)号：US07307165B2
公开(公告)日：2007-12-11
申请号：US10522798
申请日：2003-07-16
申请人： Takanori Tabuchi , Tetsuhiro Yamamoto , Takeshi Kajiwara
发明人： Takanori Tabuchi , Tetsuhiro Yamamoto , Takeshi Kajiwara
IPC分类号： C07D487/04
CPC分类号： C07D471/04 , A01N47/36 , C07D487/04 , C07D513/04
摘要： A process for easily and inexpensively producing an imidazo[1,2-b]pyridazin-3-ylsulfonamide derivative which has a substituent bonded to the 6-position carbon atom and is represented by the formula (II): (wherein R represents lower alkyl, lower cycloalkyl optionally substituted by lower alkyl, lower alkenyl, or lower alkynyl), the process comprising reacting an imidazo[1,2-b]pyridazine compound represented by the formula (I): (wherein X represents halogeno or lower alkyl optionally substituted by halogeno; Y represents hydrogen or SO2N═CH—NR1R2; and Z represents halogeno or OSO2R3) with an organometallic compound in the presence of a transition metal catalyst. The derivative is useful as an intermediate for herbicides.
摘要翻译：一种容易且廉价地制备具有与6位碳原子键合的取代基并由式（II）表示的咪唑并[1,2-b]哒嗪-3-基磺酰胺衍生物的方法：（其中R表示低级烷基，低级烷基，低级烯基或低级炔基取代的低级环烷基），该方法包括使由式（I）表示的咪唑并[1,2-b]哒嗪化合物：其中X表示任选取代的卤代或低级烷基通过卤代; Y表示氢或SO 2 N-CH-NR 1 R 2，Z表示卤代或OSO 2， / SO 3 R 3）与有机金属化合物在过渡金属催化剂存在下反应。该衍生物可用作除草剂的中间体。

4. 发明授权

US06988312B2 Method for producing multilayer circuit board for semiconductor device 有权
标题翻译：半导体装置用多层电路板的制造方法
公开(公告)号：US06988312B2
公开(公告)日：2006-01-24
申请号：US10451850
申请日：2002-10-29
申请人： Jyunichi Nakamura , Shunichiro Matsumoto , Tadashi Kodaira , Hironari Aratani , Takanori Tabuchi , Takeshi Chino , Kiyotaka Shimada
发明人： Jyunichi Nakamura , Shunichiro Matsumoto , Tadashi Kodaira , Hironari Aratani , Takanori Tabuchi , Takeshi Chino , Kiyotaka Shimada
IPC分类号： H05K3/26
CPC分类号： H05K3/4682 , H01L21/4857 , H01L23/3128 , H01L23/36 , H01L23/4334 , H01L2224/16 , H01L2924/00014 , H01L2924/01078 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H05K3/0097 , H05K3/205 , H05K3/3473 , H05K3/4007 , H05K3/4644 , H05K2201/0367 , H05K2203/0152 , H05K2203/0376 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/49142 , Y10T29/49144 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , H01L2224/0401
摘要： The invention relates a method for producing a multilayer circuit board (50) for a semiconductor device, comprising using a composite metal sheet (14) in which two metal sheets are combined, forming, on each side of the composite metal sheet, pads for connecting to a semiconductor element, the pads being made of a metal material which is substantially not etched by an etchant for the metal sheet, and an insulating layer having openings exposing the pads, forming, on the insulating layer, a wiring line layer (26) connected to the pads and having pads for connecting to another wiring line layer to be subsequently formed, subsequently fabricating a multilayer circuit board body (20) by necessary numbers of insulating layers and wiring line layers alternately formed, forming, on the outermost insulating layer of the multilayer circuit board body, an insulating layer provided with through-holes exposing pads for external connecting terminals, which are located on the outermost insulating layer, then dividing the composite metal sheet, to yield intermediates (34) each provided on one side of the metal sheet with the multilayer circuit board body, and etching the metal sheet at an area at which a semiconductor element is to be mounted to remove the material of the metal sheet at that area, to thereby form a frame (10) surrounding the area for the mounting of the semiconductor element.
摘要翻译：本发明涉及一种用于半导体器件的多层电路板（50）的制造方法，其特征在于，使用复合金属片（14），其中组合有两个金属片，在复合金属片的每一侧上形成用于连接的焊盘对于半导体元件，所述焊盘由金属材料制成，所述金属材料基本上不被所述金属板的蚀刻剂蚀刻，以及具有暴露所述焊盘的开口的绝缘层，在所述绝缘层上形成布线层（26）连接到焊盘并具有用于连接到随后形成的另一布线层的焊盘，随后通过必要数量的交替形成的绝缘层和布线层来制造多层电路板主体（20），在绝缘层的最外层多层电路板主体，设置有位于最外侧绝缘体上的用于外部连接端子的通孔露出焊盘的绝缘层然后分割复合金属板，得到各自设置在金属板的一侧上的多层电路板体的中间体（34），并在要安装半导体元件的区域上蚀刻金属片在该区域移除金属片的材料，从而形成围绕用于安装半导体元件的区域的框架（10）。

5. 发明申请

US20050087860A1 Multilayered substrate for semiconductor device 有权
标题翻译：用于半导体器件的多层衬底
公开(公告)号：US20050087860A1
公开(公告)日：2005-04-28
申请号：US10995384
申请日：2004-11-24
申请人： Jyunichi Nakamura , Tadashi Kodaira , Shunichiro Matsumoto , Hironari Aratani , Takanori Tabuchi , Takeshi Chino
发明人： Jyunichi Nakamura , Tadashi Kodaira , Shunichiro Matsumoto , Hironari Aratani , Takanori Tabuchi , Takeshi Chino
IPC分类号： H01L23/12 , H01L23/06 , H01L23/08 , H01L23/498 , H01L23/52 , H05K1/02 , H05K3/00 , H05K3/20 , H05K3/34 , H05K3/46 , H01L23/48
CPC分类号： H05K3/0061 , H01L23/49822 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/01078 , H01L2924/15311 , H05K1/0271 , H05K3/205 , H05K3/3457 , H05K3/4644 , H05K2201/09472 , H05K2201/0969 , H05K2201/2009 , H05K2203/1536
摘要： A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connection terminals, the face for mounting a semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for mounting a semiconductor element thereon and the face for external connection terminals of the multilayered substrate body.
摘要翻译：一种用于半导体器件的多层衬底，其具有由多组导体层和绝缘层形成的多层衬底本体，并且具有用于安装半导体元件的面和用于外部连接端子的另一面，用于安装的面半导体器件设置有衬底，衬底通过该焊盘连接到要安装在其上的半导体元件，并且用于外部连接端子的面设置有衬底，衬底通过该衬垫连接到外部电路，其中加强板是分别连接到用于在其上安装半导体元件的面和多层基板主体的外部连接端子的表面。

6. 发明申请

US20050032650A1 Fused heterocyclic sulfonylurea compound herbicide containing the same and method of controlling weed with the same 有权
标题翻译：含有相同杂交磺酰脲的杂环磺酰脲类除草剂和与之相同的杂草控制方法
公开(公告)号：US20050032650A1
公开(公告)日：2005-02-10
申请号：US10498805
申请日：2003-01-15
申请人： Yasushi Tanaka , Yukari Kajiwara , Makoto Noguchi , Takeshi Kajiwara , Takanori Tabuchi
发明人： Yasushi Tanaka , Yukari Kajiwara , Makoto Noguchi , Takeshi Kajiwara , Takanori Tabuchi
IPC分类号： A01N47/36 , C07D471/04 , C07D487/04 , C07D513/04
CPC分类号： C07D471/04 , A01N47/36 , C07D487/04 , C07D513/04
摘要： The present invention provides a compound represented by the formula: wherein Q represents a fused heterocyclic group, X and Y are the same or different and each represent an optionally halogenated lower alkyl group, an optionally halogenated lower alkoxy group, etc., or a salt thereof, as well as a herbicide comprising the compound or a salt thereof, which exhibits a significant effect for control of sulfonylurea herbicide-resistant weeds in paddy fields and can reduce the number of active ingredients in a combined preparation and a method of controlling sulfonylurea herbicide-resistant weeds which comprises using the same.
摘要翻译：本发明提供由下式表示的化合物：其中Q表示稠合杂环基，X和Y相同或不同，表示任选卤代的低级烷基，任选卤代的低级烷氧基等，或盐以及含有该化合物或其盐的除草剂，其对稻田中磺酰脲类除草剂抗性杂草的控制具有显着的效果，并且可以减少组合制剂中活性成分的数量和控制磺酰脲类除草剂的方法包括使用它们的抗性杂草。

7. 发明授权

US07196426B2 Multilayered substrate for semiconductor device 有权
公开(公告)号：US07196426B2
公开(公告)日：2007-03-27
申请号：US10995384
申请日：2004-11-24
申请人： Jyunichi Nakamura , Tadashi Kodaira , Shunichiro Matsumoto , Hironari Aratani , Takanori Tabuchi , Takeshi Chino
发明人： Jyunichi Nakamura , Tadashi Kodaira , Shunichiro Matsumoto , Hironari Aratani , Takanori Tabuchi , Takeshi Chino
IPC分类号： H01L23/48 , H01L23/498 , H05K3/00 , H05K3/34 , H05K1/02
CPC分类号： H05K3/0061 , H01L23/49822 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/01078 , H01L2924/15311 , H05K1/0271 , H05K3/205 , H05K3/3457 , H05K3/4644 , H05K2201/09472 , H05K2201/0969 , H05K2201/2009 , H05K2203/1536
摘要： A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connection terminals, the face for mounting a semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for mounting a semiconductor element thereon and the face for external connection terminals of the multilayered substrate body.

8. 发明申请

US20100160163A1 Fused heterocyclic sulfonylurea compound, herbicide containing the same, and method for controlling weed with the same 有权
标题翻译：稠合杂环磺酰脲化合物，含有其的除草剂，以及用于控制杂草的方法
公开(公告)号：US20100160163A1
公开(公告)日：2010-06-24
申请号：US12659165
申请日：2010-02-26
申请人： Yasushi Tanaka , Yukari Kajiwara , Makoto Noguchi , Takeshi Kajiwara , Takanori Tabuchi
发明人： Yasushi Tanaka , Yukari Kajiwara , Makoto Noguchi , Takeshi Kajiwara , Takanori Tabuchi
IPC分类号： A01N47/36 , C07D487/04 , A01P13/00
CPC分类号： C07D471/04 , A01N47/36 , C07D487/04 , C07D513/04
摘要： The present invention provides a compound represented by the formula: wherein Q represents a fused heterocyclic group, X and Y are the same or different and each represent an optionally halogenated lower alkyl group, an optionally halogenated lower alkoxy group, etc., or a salt thereof, as well as a herbicide comprising the compound or a salt thereof, which exhibits a significant effect for control of sulfonylurea herbicide-resistant weeds in paddy fields and can reduce the number of active ingredients in a combined preparation and a method of controlling sulfonylurea herbicide-resistant weeds which comprises using the same.
摘要翻译：本发明提供由下式表示的化合物：其中Q表示稠合杂环基，X和Y相同或不同，表示任选卤代的低级烷基，任选卤代的低级烷氧基等，或盐以及含有该化合物或其盐的除草剂，其对稻田中磺酰脲类除草剂抗性杂草的控制具有显着的效果，并且可以减少组合制剂中活性成分的数量和控制磺酰脲类除草剂的方法包括使用它们的抗性杂草。

9. 发明授权

US07164198B2 Multilayered substrate for semiconductor device 有权
标题翻译：用于半导体器件的多层衬底
公开(公告)号：US07164198B2
公开(公告)日：2007-01-16
申请号：US10649745
申请日：2003-08-28
申请人： Jyunichi Nakamura , Tadashi Kodaira , Shunichiro Matsumoto , Hironari Aratani , Takanori Tabuchi , Takeshi Chino
发明人： Jyunichi Nakamura , Tadashi Kodaira , Shunichiro Matsumoto , Hironari Aratani , Takanori Tabuchi , Takeshi Chino
IPC分类号： H01L23/48 , H05K3/46 , H05K3/34 , H05K1/00 , H10L23/12
CPC分类号： H05K3/0061 , H01L23/49822 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/01078 , H01L2924/15311 , H05K1/0271 , H05K3/205 , H05K3/3457 , H05K3/4644 , H05K2201/09472 , H05K2201/0969 , H05K2201/2009 , H05K2203/1536
摘要： A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connection terminals, the face for mounting a semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for mounting a semiconductor element thereon and the face for external connection terminals of the multilayered substrate body.
摘要翻译：一种用于半导体器件的多层衬底，其具有由多组导体层和绝缘层形成的多层衬底本体，并且具有用于安装半导体元件的面和用于外部连接端子的另一面，用于安装的面半导体器件设置有衬底，衬底通过该焊盘连接到要安装在其上的半导体元件，并且用于外部连接端子的面设置有衬底，衬底通过该衬垫连接到外部电路，其中加强板是分别连接到用于在其上安装半导体元件的面和多层基板主体的外部连接端子的表面。

10. 发明授权

US06759739B2 Multilayered substrate for semiconductor device 有权
标题翻译：用于半导体器件的多层衬底
公开(公告)号：US06759739B2
公开(公告)日：2004-07-06
申请号：US10281163
申请日：2002-10-28
申请人： Jyunichi Nakamura , Tadashi Kodaira , Shunichiro Matsumoto , Hironari Aratani , Takanori Tabuchi , Takeshi Chino
发明人： Jyunichi Nakamura , Tadashi Kodaira , Shunichiro Matsumoto , Hironari Aratani , Takanori Tabuchi , Takeshi Chino
IPC分类号： H01L2312
CPC分类号： H05K3/0061 , H01L23/49822 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/01078 , H01L2924/15311 , H05K1/0271 , H05K3/205 , H05K3/3457 , H05K3/4644 , H05K2201/09472 , H05K2201/0969 , H05K2201/2009 , H05K2203/1536
摘要： A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connection terminals, the face for mounting a semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for mounting a semiconductor element thereon and the face for external connection terminals of the multilayered substrate body.
摘要翻译：一种用于半导体器件的多层衬底，其具有由多组导体层和绝缘层形成的多层衬底本体，并且具有用于安装半导体元件的面和用于外部连接端子的另一面，用于安装的面半导体器件设置有衬底，衬底通过该焊盘连接到要安装在其上的半导体元件，并且用于外部连接端子的面设置有衬底，衬底通过该衬垫连接到外部电路，其中加强板是分别连接到用于在其上安装半导体元件的面和多层基板主体的外部连接端子的表面。

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