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1. 发明授权

US09148631B2 Defect inspection method and device therefor 有权
标题翻译：缺陷检查方法及其设备
公开(公告)号：US09148631B2
公开(公告)日：2015-09-29
申请号：US13881378
申请日：2011-10-26
申请人： Makoto Ono , Takafumi Chida , Takehiro Hirai , Masakazu Kanezawa
发明人： Makoto Ono , Takafumi Chida , Takehiro Hirai , Masakazu Kanezawa
IPC分类号： H04N7/18 , H01J37/28 , G01N23/225
CPC分类号： H04N7/18 , G01N23/2251 , G01N2223/3301 , G01N2223/418 , G01N2223/611 , H01J37/28 , H01J2237/21 , H01J2237/2811 , H01J2237/2815 , H01J2237/2817
摘要： In imaging a sample using an electron microscope, in order to reduce a time for focusing, a scanning range of a Z coordinate is reduced to complete focusing by obtaining SEM images such that: for a first predetermined number of portions, focal positions of an electron beam in obtaining each SEM image are moved in a predetermined range; then, a curved surface shape of the surface of the sample is estimated by using information relating to the focal positions of the electron beam in the first predetermined number of portions; after the images are taken, the range in which the focal positions of the electron beam are moved for scanning the electron beam on the surface of the sample is made to be narrower than the predetermined range by using the curved surface information estimated, thereby performing scanning to take the images of the sample.
摘要翻译：在使用电子显微镜对样品进行成像时，为了减少聚焦时间，通过获得SEM图像来减小Z坐标的扫描范围以完成聚焦，使得：对于第一预定数量的部分，电子的焦点位置获得每个SEM图像的光束在预定范围内移动; 然后，通过使用与第一预定数量的电子束的焦点位置有关的信息来估计样品表面的曲面形状; 在拍摄图像之后，通过使用估计的曲面信息使电子束的焦点位置移动以扫描样品表面上的电子束的范围比预定范围窄，从而执行扫描拍摄样品的图像。

2. 发明申请

US20130235182A1 DEFECT INSPECTION METHOD AND DEVICE THEREFOR 有权
标题翻译：缺陷检查方法及其设备
公开(公告)号：US20130235182A1
公开(公告)日：2013-09-12
申请号：US13881378
申请日：2011-10-26
申请人： Makoto Ono , Takafumi Chida , Takehiro Hirai , Masakazu Kanezawa
发明人： Makoto Ono , Takafumi Chida , Takehiro Hirai , Masakazu Kanezawa
IPC分类号： H04N7/18
CPC分类号： H04N7/18 , G01N23/2251 , G01N2223/3301 , G01N2223/418 , G01N2223/611 , H01J37/28 , H01J2237/21 , H01J2237/2811 , H01J2237/2815 , H01J2237/2817
摘要： In imaging a sample using an electron microscope, in order to reduce a time for focusing, a scanning range of a Z coordinate is reduced to complete focusing by obtaining SEM images such that: for a first predetermined number of portions, focal positions of an electron beam in obtaining each SEM image are moved in a predetermined range; then, a curved surface shape of the surface of the sample is estimated by using information relating to the focal positions of the electron beam in the first predetermined number of portions; after the images are taken, the range in which the focal positions of the electron beam are moved for scanning the electron beam on the surface of the sample is made to be narrower than the predetermined range by using the curved surface information estimated, thereby performing scanning to take the images of the sample.
摘要翻译：在使用电子显微镜对样品进行成像时，为了减少聚焦时间，通过获得SEM图像来减小Z坐标的扫描范围以完成聚焦，使得：对于第一预定数量的部分，电子的焦点位置获得每个SEM图像的光束在预定范围内移动; 然后，通过使用与第一预定数量的电子束的焦点位置有关的信息来估计样品表面的曲面形状; 在拍摄图像之后，通过使用估计的曲面信息使电子束的焦点位置移动以扫描样品表面上的电子束的范围比预定范围窄，从而执行扫描拍摄样品的图像。

3. 发明授权

US08340803B2 Component placement apparatus, component placement setting calculation apparatus, program, and component placement setting calculation method 有权
标题翻译：部件配置装置，部件配置设定计算装置，程序和部件配置设定计算方法
公开(公告)号：US08340803B2
公开(公告)日：2012-12-25
申请号：US12486070
申请日：2009-06-17
申请人： Takafumi Chida , Takahiro Nakano , Koichi Izuhara , Yoshiyuki Tsujimoto
发明人： Takafumi Chida , Takahiro Nakano , Koichi Izuhara , Yoshiyuki Tsujimoto
IPC分类号： G06F15/18
CPC分类号： H05K13/0478 , Y10T29/53174
摘要： The present invention is directed to a technique that avoids occurrence of interference among multiple placement heads, when multiple placement heads simultaneously access a circuit board, and a pallet which is arranged in one direction with respect to the circuit board. When the component placement part 150 having the multiple placement heads simultaneously pick up the components from the pallet 160 and simultaneously place the components on the circuit board, the controller 140 specifies a pair of component groups to be picked up simultaneously from the pallet 160 by the multiple placement heads and places the components on the circuit board, so that an area where the multiple placement heads move in overlapping manner is minimized, and the placement heads respectively pick up the components included in the pair of component groups being specified and place the components on the circuit board.
摘要翻译：本发明涉及一种避免多个放置头之间的干扰的发生，当多个放置头同时存取电路板时，以及相对于电路板沿一个方向布置的托盘。当具有多个放置头的部件放置部分150同时从托盘160拾取部件并同时将部件放置在电路板上时，控制器140指定一对组件组，以从托板160同时拾取组件组多个放置头并将部件放置在电路板上，使得多个放置头以重叠的方式移动的区域被最小化，并且放置头分别拾取包括在指定的一对组件组中的组件，并将组件在电路板上。

4. 发明申请

US20110110752A1 VACUUM PROCESSING SYSTEM AND VACUUM PROCESSING METHOD OF SEMICONDUCTOR PROCESSING SUBSTRATE 审中-公开
标题翻译：真空加工系统和半导体加工基板的真空加工方法
公开(公告)号：US20110110752A1
公开(公告)日：2011-05-12
申请号：US12883602
申请日：2010-09-16
申请人： Susumu TAUCHI , Hideaki Kondo , Teruo Nakata , Keita Nogi , Atsushi Shimoda , Takafumi Chida
发明人： Susumu TAUCHI , Hideaki Kondo , Teruo Nakata , Keita Nogi , Atsushi Shimoda , Takafumi Chida
IPC分类号： H01L21/677
CPC分类号： H01L21/67184 , H01L21/67196 , H01L21/67766 , H01L21/67778
摘要： The invention provides a vacuum processing system of a semiconductor processing substrate and a vacuum processing method using the same, comprising an atmospheric transfer chamber having a plurality of cassette stands, a lock chamber arranged on a rear side of the atmospheric transfer chamber, and a first vacuum transfer chamber connected to a rear side of the lock chamber, wherein the first vacuum transfer chamber does not have any vacuum processing chamber connected thereto and has transfer intermediate chambers connected thereto, and the transfer intermediate chambers have subsequent vacuum transfer chambers connected thereto, and wherein the wafers are transferred via the lock chamber to the first vacuum transfer chamber to be processed in each of the subsequent vacuum processing chambers, which are further transferred via any of the transfer intermediate chambers connected to the first vacuum transfer chamber to the subsequent vacuum transfer chambers, and the respective wafers transferred to the subsequent vacuum transfer chambers other than the first vacuum transfer chamber are transferred to the respective vacuum processing chambers connected to each of the vacuum processing chambers and processed therein.
摘要翻译：本发明提供了一种半导体处理基板的真空处理系统和使用该真空处理方法的真空处理方法，包括具有多个盒架的大气传送室，布置在大气传送室后侧的锁定室，以及第一真空传送室连接到锁定室的后侧，其中第一真空传送室不具有连接到其上的任何真空处理室，并且具有连接到其上的传送中间室，并且传送中间室具有连接到其上的随后的真空传送室，其中所述晶片经由所述锁定室传送到所述第一真空传送室，以在随后的每个真空处理室中被处理，所述真空处理室进一步通过连接到所述第一真空传送室的任何转移中间室转移到随后的真空转印室和相应的晶片tr 推送到除了第一真空转移室之后的后续真空转移室被转移到连接到每个真空处理室的各个真空处理室中并在其中处理。

5. 发明申请

US20080005892A1 SETTING DEVICE, COMPONENT MOUNTING SYSTEM, PROGRAM AND CALCULATING METHOD 失效
标题翻译：设置设备，组件安装系统，程序和计算方法
公开(公告)号：US20080005892A1
公开(公告)日：2008-01-10
申请号：US11773836
申请日：2007-07-05
申请人： Takafumi Chida , Attila Lengyel , Ken Igarashi , Haruhiko Yamaguchi , Manabu Okamoto , Koichi Izuhara
发明人： Takafumi Chida , Attila Lengyel , Ken Igarashi , Haruhiko Yamaguchi , Manabu Okamoto , Koichi Izuhara
IPC分类号： B23P19/04 , G05B13/00
CPC分类号： H05K13/0413 , H05K13/0853 , Y10T29/4913 , Y10T29/53174
摘要： Technology is provided for changing a mounting angle of a component to reduce the amount of relative displacement between a mounting head and a board. A component, for which a mounting angle can be changed, is specified based on information stored in a mounting data storage area and a component data storage area according to a predetermined component mounting order. A mounting time in a mounting path with the mounting angle of the specified component being changed is calculated for each mounting angle to specify the mounting path requiring the shortest mounting time.
摘要翻译：提供了用于改变部件的安装角度以减少安装头和板之间的相对位移量的技术。根据预定的部件安装顺序，可以基于存储在安装数据存储区域和部件数据存储区域中的信息来指定可以改变安装角度的部件。针对每个安装角度计算安装路径中安装具有指定部件的安装角度的安装时间，以指定需要最短安装时间的安装路径。

6. 发明授权

US09011065B2 Vacuum processing apparatus and operating method of vacuum processing apparatus 有权
标题翻译：真空处理装置和真空处理装置的操作方法
公开(公告)号：US09011065B2
公开(公告)日：2015-04-21
申请号：US12871333
申请日：2010-08-30
申请人： Susumu Tauchi , Hideaki Kondo , Teruo Nakata , Keita Nogi , Atsushi Shimoda , Takafumi Chida
发明人： Susumu Tauchi , Hideaki Kondo , Teruo Nakata , Keita Nogi , Atsushi Shimoda , Takafumi Chida
IPC分类号： H01L21/677 , H01L21/67
CPC分类号： H01L21/67184 , H01L21/67196 , H01L21/67201 , H01L21/67745 , H01L21/67769 , Y10S414/139
摘要： A vacuum processing apparatus which includes an atmospheric transfer chamber having a plurality of cassette stands for transferring a wafer, a lock chamber for storing the wafer, a first vacuum transfer chamber to which the wafer from the lock chamber is transferred, a transfer intermediate chamber connected to the first vacuum transfer chamber, and a second vacuum transfer chamber connected to the transfer intermediate chamber. At least one vacuum processing chamber is connected to the first vacuum transfer chamber, and two or more vacuum processing chambers are connected to a rear side of the second vacuum transfer chamber. A plurality of gate valves are disposed between the first vacuum transfer chamber and each of the lock chamber, the transfer intermediate chamber, and the vacuum processing chamber coupled to the first vacuum transfer chamber. A control unit is also provided for controlling operation of the gate valves.
摘要翻译：一种真空处理装置，包括具有用于传送晶片的多个盒架的大气传送室，用于存储晶片的锁定室，来自锁定室的晶片被转移到的第一真空传送室，连接到传送中间室到第一真空传送室，以及连接到传送中间室的第二真空传送室。至少一个真空处理室连接到第一真空传送室，并且两个或更多个真空处理室连接到第二真空传送室的后侧。多个闸阀设置在第一真空传送室与联接到第一真空传送室的锁定室，传送中间室和真空处理室中的每一个之间。还设置有用于控制闸阀的操作的控制单元。

7. 发明授权

US07885723B2 Setting device, component mounting system, program and calculating method 失效
标题翻译：设定装置，部件安装系统，程序和计算方法
公开(公告)号：US07885723B2
公开(公告)日：2011-02-08
申请号：US11773836
申请日：2007-07-05
申请人： Takafumi Chida , Attila Lengyel , Ken Igarashi , Haruhiko Yamaguchi , Manabu Okamoto , Koichi Izuhara
发明人： Takafumi Chida , Attila Lengyel , Ken Igarashi , Haruhiko Yamaguchi , Manabu Okamoto , Koichi Izuhara
IPC分类号： G06F19/00 , G05B13/02 , H05K3/30
CPC分类号： H05K13/0413 , H05K13/0853 , Y10T29/4913 , Y10T29/53174
摘要： Technology is provided for changing a mounting angle of a component to reduce the amount of relative displacement between a mounting head and a board. A component, for which a mounting angle can be changed, is specified based on information stored in a mounting data storage area and a component data storage area according to a predetermined component mounting order. A mounting time in a mounting path with the mounting angle of the specified component being changed is calculated for each mounting angle to specify the mounting path requiring the shortest mounting time.
摘要翻译：提供了用于改变部件的安装角度以减少安装头和板之间的相对位移量的技术。根据预定的部件安装顺序，可以基于存储在安装数据存储区域和部件数据存储区域中的信息来指定可以改变安装角度的部件。针对每个安装角度计算安装路径中安装具有指定部件的安装角度的安装时间，以指定需要最短安装时间的安装路径。

8. 发明申请

US20110110751A1 VACUUM PROCESSING SYSTEM AND VACUUM PROCESSING METHOD OF SEMICONDUCTOR PROCESSING SUBSTRATE 有权
标题翻译：真空加工系统和半导体加工基板的真空加工方法
公开(公告)号：US20110110751A1
公开(公告)日：2011-05-12
申请号：US12871333
申请日：2010-08-30
申请人： Susumu TAUCHI , Hideaki Kondo , Teruo Nakata , Keita Nogi , Atsushi Shimoda , Takafumi Chida
发明人： Susumu TAUCHI , Hideaki Kondo , Teruo Nakata , Keita Nogi , Atsushi Shimoda , Takafumi Chida
IPC分类号： H01L21/677
CPC分类号： H01L21/67184 , H01L21/67196 , H01L21/67201 , H01L21/67745 , H01L21/67769 , Y10S414/139
摘要： A vacuum processing system of a semiconductor processing substrate and a vacuum processing method using the same comprises an atmospheric transfer chamber having a plurality of cassette stands for transferring a wafer, a lock chamber for storing the wafer transferred from the atmospheric transfer chamber, a first vacuum transfer chamber to which the wafer from the lock chamber is transferred, a transfer intermediate chamber connected to the first vacuum transfer chamber, a second vacuum transfer chamber connected to the transfer intermediate chamber, at least one vacuum processing chamber connected to the first vacuum transfer chamber, and two or more vacuum processing chambers connected to a rear side of the second vacuum transfer chamber, wherein the number of vacuum processing chambers connected to the first vacuum transfer chamber is smaller than the number of vacuum processing chambers connected to the second vacuum transfer chamber, or the number of use of vacuum processing chambers connected to the first vacuum transfer chamber is restricted to one.
摘要翻译：半导体处理基板的真空处理系统和使用其的真空处理方法包括具有多个用于传送晶片的盒架的大气传送室，用于存储从大气传送室转移的晶片的锁定室，第一真空传送室，来自锁定室的晶片被转印到该传送室，连接到第一真空传送室的传送中间室，连接到传送中间室的第二真空传送室，连接到第一真空传送室的至少一个真空处理室以及连接到第二真空传送室的后侧的两个或更多个真空处理室，其中连接到第一真空传送室的真空处理室的数量小于连接到第二真空传送室的真空处理室的数量，或使用真空加工台数连接到第一真空传送室的器件被限制为一个。

9. 发明申请

US20100071201A1 Component Placement Apparatus, Component Placement Setting Calculation Apparatus, Program, and Component Placement Setting Calculation Method 有权
标题翻译：组件放置设备，组件放置设置计算设备，程序和组件放置设置计算方法
公开(公告)号：US20100071201A1
公开(公告)日：2010-03-25
申请号：US12486070
申请日：2009-06-17
申请人： Takafumi CHIDA , Takahiro NAKANO , Koichi IZUHARA , Yoshiyuki TSUJIMOTO
发明人： Takafumi CHIDA , Takahiro NAKANO , Koichi IZUHARA , Yoshiyuki TSUJIMOTO
IPC分类号： B23P19/00
CPC分类号： H05K13/0478 , Y10T29/53174
摘要： The present invention is directed to a technique that avoids occurrence of interference among multiple placement heads, when multiple placement heads simultaneously access a circuit board, and a pallet which is arranged in one direction with respect to the circuit board. When the component placement part 150 having the multiple placement heads simultaneously pick up the components from the pallet 160 and simultaneously place the components on the circuit board, the controller 140 specifies a pair of component groups to be picked up simultaneously from the pallet 160 by the multiple placement heads and places the components on the circuit board, so that an area where the multiple placement heads move in overlapping manner is minimized, and the placement heads respectively pick up the components included in the pair of component groups being specified and place the components on the circuit board.
摘要翻译：本发明涉及一种避免多个放置头之间的干扰的发生，当多个放置头同时存取电路板时，以及相对于电路板沿一个方向布置的托盘。当具有多个放置头的部件放置部分150同时从托盘160拾取部件并同时将部件放置在电路板上时，控制器140指定一对组件组，以从托板160同时拾取组件组多个放置头并将部件放置在电路板上，使得多个放置头以重叠的方式移动的区域被最小化，并且放置头分别拾取包括在指定的一对组件组中的组件，并将组件在电路板上。

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