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    • 3. 发明授权
    • Ultrasonic sensor
    • 超声波传感器
    • US08813569B2
    • 2014-08-26
    • US13102421
    • 2011-05-06
    • Yutaka AbeHiroyuki Toyoda
    • Yutaka AbeHiroyuki Toyoda
    • G01N29/04
    • G10K11/004G01N29/223G01S7/521
    • An ultrasonic sensor includes an ultrasonic element. The ultrasonic element includes an ultrasonic oscillator for sending, receiving or transceiving ultrasonic waves, an element body having an opening for passage of ultrasonic waves formed on one surface, the ultrasonic oscillator being arranged within the element body, and terminal portions protruding from the element body to feed an electric current to the ultrasonic oscillator. The ultrasonic sensor further includes a housing having an opening formed on one surface for communication with the opening of the element body. The housing includes a receiving portion for receiving the ultrasonic element and a positioning portion integrally formed with the receiving portion to position the ultrasonic element in place. The ultrasonic sensor includes a printed wiring board arranged to interpose the ultrasonic element between the printed wiring board and the receiving portion. The terminal portions of the ultrasonic element are mounted to the printed wiring board.
    • 超声波传感器包括超声波元件。 超声波元件包括用于发送,接收或收发超声波的超声波振荡器,具有在一个表面上形成的超声波通过的开口的元件体,超声波振荡器配置在元件体内,以及从元件体突出的端子部 以向超声波振荡器馈送电流。 超声波传感器还包括具有形成在一个表面上用于与元件主体的开口连通的开口的壳体。 壳体包括用于接收超声波元件的接收部分和与接收部分一体形成的定位部分,以将超声波元件定位就位。 超声波传感器包括布置成将超声波元件插入印刷线路板和接收部之间的印刷线路板。 超声波元件的端子部安装在印刷电路板上。
    • 4. 发明申请
    • ULTRASONIC SENSOR
    • 超声波传感器
    • US20110277550A1
    • 2011-11-17
    • US13102421
    • 2011-05-06
    • Yutaka ABEHiroyuki Toyoda
    • Yutaka ABEHiroyuki Toyoda
    • G01N29/04
    • G10K11/004G01N29/223G01S7/521
    • The ultrasonic element includes an ultrasonic oscillator for sending, receiving or transceiving ultrasonic waves, an element body having an opening for passage of ultrasonic waves formed on one surface, the ultrasonic oscillator being arranged within the element body, and terminal portions protruding from the element body to feed an electric current to the ultrasonic oscillator. The ultrasonic sensor further includes a housing having an opening formed on one surface for communication with the opening of the element body. The housing includes a receiving portion for receiving the ultrasonic element and a positioning portion integrally formed with the receiving portion to position the ultrasonic element in place. The ultrasonic sensor includes a printed wiring board arranged to interpose the ultrasonic element between the printed wiring board and the receiving portion. The terminal portions of the ultrasonic element are mounted to the printed wiring board.
    • 超声波元件包括用于发送,接收或收发超声波的超声波振荡器,具有在一个表面上形成的超声波通过的开口的元件体,超声波振荡器配置在元件体内,以及从元件体突出的端子部 以向超声波振荡器馈送电流。 超声波传感器还包括具有形成在一个表面上用于与元件主体的开口连通的开口的壳体。 壳体包括用于接收超声波元件的接收部分和与接收部分一体形成的定位部分,以将超声波元件定位就位。 超声波传感器包括布置成将超声波元件插入印刷线路板和接收部之间的印刷线路板。 超声波元件的端子部安装在印刷电路板上。
    • 6. 发明申请
    • COOLING SYSTEM AND ELECTRONIC APPARATUS APPLYING THE SAME THEREIN
    • 冷却系统和应用其的电子设备
    • US20110048676A1
    • 2011-03-03
    • US12852556
    • 2010-08-09
    • Hiroyuki TOYODATadakatsu NAKAJIMAYoshihiro KONDOShigeyuki SASAKIAkio IDEIShigemasa SATOH
    • Hiroyuki TOYODATadakatsu NAKAJIMAYoshihiro KONDOShigeyuki SASAKIAkio IDEIShigemasa SATOH
    • F28D15/02
    • F28D15/0266F28D1/05366F28D15/046F28F1/325F28F13/187F28F2215/12H01L23/427H01L2924/0002H01L2924/00
    • A cooling system applying a thermo siphon therein, being superior in energy saving and/or ecology, with an effective cooling, and also an electronic apparatus applying that therein, in particular, for cooling a CPU 200 mounted on a printed circuit board 100 within a housing thereof, comprises a heat-receiving jacket 310, being thermally connected with a surface of the CPU generating heats therein, and for evaporating liquid refrigerant stored in a pressure-reduced inner space with heat generation thereof, a condenser 320 for receiving refrigerant vapor from the heat-receiving jacket within a pressure-reduced inner space thereof and for condensing the refrigerant vapor into a liquid by transferring the heats into an outside of the apparatus, a vapor tube 331, and a liquid return tube 332, with applying the thermo siphon for circulating the refrigerant due to phase change thereof, wherein the condenser forms fine grooves on an inner wall surface thereof along a direction of flow of the refrigerant, and is also formed flat in a cross-section thereof, for cooling the refrigerant vapor from the heat-receiving jacket on the inner wall surface thereof, efficiently.
    • 一种在其中施加热虹吸的冷却系统,具有优异的节能和/或生态学,有效的冷却,以及在其中应用的电子设备,特别是用于冷却安装在印刷电路板100内的CPU 200 其壳体包括与在其中产生加热的CPU的表面热连接的热接收套310,并且用于通过发热而蒸发存储在减压内部空间中的液体制冷剂;冷凝器320,用于从 在其减压的内部空间内的热接收套管,并且通过将热量传递到设备的外部,蒸气管331和液体返回管332将制冷剂蒸汽冷凝成液体,同时施加热虹吸 用于使制冷剂由于其相变而循环,其中,冷凝器在其内壁表面上沿着r的流动方向形成细槽 制冷剂,并且也在其横截面上形成为平坦的,用于有效地从其受热套管的内壁表面冷却制冷剂蒸汽。
    • 8. 发明授权
    • Electronic device and a thermal connector used therein
    • 电子设备和其中使用的热连接器
    • US07839640B2
    • 2010-11-23
    • US12544137
    • 2009-08-19
    • Tomoo HayashiTadakatsu NakajimaYoshihiro KondoHiroyuki ToyodaAkio IdeiShigeyasu Tsubaki
    • Tomoo HayashiTadakatsu NakajimaYoshihiro KondoHiroyuki ToyodaAkio IdeiShigeyasu Tsubaki
    • H05K7/20
    • G06F1/185G06F1/20H05K7/20772
    • An electronic device comprises: a housing; blades each of which is detachable from the housing and on each of which at least CPU and a memory are mounted; first cooling devices each of that takes out heat generated in the blade outside the blade, each of said first cooling device having a heat release part in the form of an elongate column to be fixed to the blade; second cooling devices fixed to the housing to discharge heat transported from the first cooling devices outside the housing, each of said second cooling devices having a heat absorbing part, which is capable of containing the heat release part of the first cooling device; medium reservoirs each of which is put in fluid communication with a clearance, which is formed between the heat release part and the heat absorbing part when the heat release part is inserted into the heat absorbing part; a heat conducting medium stored in each of the medium reservoirs; pressurizing devices for pressurizing the heat conducting medium to supply the heat conducting medium to the clearance, and a detachable connecting part formed between the heat release part and the heat absorbing part.
    • 电子设备包括:壳体; 叶片,其每一个都可从壳体拆卸,并且至少安装有CPU和存储器; 第一冷却装置,每个冷却装置取出在叶片外部的叶片中产生的热量,所述第一冷却装置中的每一个具有固定到叶片的细长柱形式的散热部分; 第二冷却装置固定到壳体以排出从壳体外部的第一冷却装置输送的热量,每个所述第二冷却装置具有能够容纳第一冷却装置的散热部分的吸热部分; 当散热部分插入到吸热部分中时,形成在散热部和吸热部之间的间隙流体连通的中间容器; 存储在每个介质储存器中的导热介质; 用于对导热介质加压以将导热介质供应到间隙的加压装置,以及形成在散热部分和吸热部分之间的可拆卸连接部分。