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    • 2. 发明授权
    • TTL to CMOS buffer circuit
    • TTL到CMOS缓冲电路
    • US5019729A
    • 1991-05-28
    • US382493
    • 1989-07-21
    • Tohru KimuraSyuso FujiiTakashi Ohsawa
    • Tohru KimuraSyuso FujiiTakashi Ohsawa
    • G11C11/409H03K19/0185
    • H03K19/018528H03K19/01855
    • A buffer circuit includes first and second differential amplification type buffer circuits. The input nodes of the first and second differential amplification type buffer circuits are connected together and the output nodes of the first and second differential amplification type buffer circuits are also connected to each other. The first differential amplification type buffer circuit is constituted by a pair of driving P-channel MOS transistors and N-channel MOS transistors acting as loads of the P-channel MOS transistors and connected to constitute a current mirror circuit. The second differential amplification type buffer circuit is constituted by P-channel MOS transistors acting as loads and connected to constitute a current mirror circuit and a pair of driving N-channel MOS transistors.
    • 缓冲电路包括第一和第二差分放大型缓冲电路。 第一和第二差分放大型缓冲电路的输入节点连接在一起,并且第一和第二差分放大型缓冲电路的输出节点也彼此连接。 第一差分放大型缓冲电路由作为P沟道MOS晶体管的负载的一对驱动P沟道MOS晶体管和N沟道MOS晶体管构成,并连接构成电流镜电路。 第二差分放大型缓冲电路由作为负载的P沟道MOS晶体管构成,并连接构成电流镜电路和一对驱动N沟道MOS晶体管。
    • 3. 发明授权
    • Input protection circuit for semiconductor integrated circuit device
    • 半导体集成电路器件的输入保护电路
    • US4994874A
    • 1991-02-19
    • US425950
    • 1989-10-24
    • Mitsuru ShimizuYoshio OkadaSyuso FujiiShozo Saito
    • Mitsuru ShimizuYoshio OkadaSyuso FujiiShozo Saito
    • H01L27/04H01L21/822H01L23/60H01L27/02
    • H01L27/0259
    • First to third N.sup.+ -type impurity regions are formed separately from one another by a preset distance in the surface area of a P-type semiconductor substrate or a P-well region formed in an N-type semiconductor substrate. The first impurity region is connected to a power source and the second impurity region is connected to a ground terminal. The third impurity region formed between the first and second impurity regions is connected to one end of an input protection resistor which is connected at the other end to a signal input pad. The first impurity region, the third impurity region and that portion of the P-type semiconductor substrate or P-well region which lies between the first and third impurity regions constitute a first bipolar transistor for input protection and the second impurity region, the third impurity region and that portion of the P-type semiconductor substrate or P-well region which lies between the second and third impurity regions constitute a second bipolar transistor for input protection. The resistor and the first and second bipolar transistors constitute an input protection circuit.
    • 在N型半导体衬底中形成的P型半导体衬底或P阱区域的表面区域中,第一至第三N +型杂质区彼此分开地预定距离地形成。 第一杂质区域连接到电源,第二杂质区域连接到接地端子。 形成在第一和第二杂质区域之间的第三杂质区域连接到另一端连接到信号输入焊盘的输入保护电阻器的一端。 位于第一和第三杂质区域之间的第一杂质区域,第三杂质区域和P型半导体衬底或P阱区域的部分构成用于输入保护的第一双极晶体管,第二杂质区域,第三杂质区域 位于第二和第三杂质区之间的P型半导体衬底或P阱区的部分构成用于输入保护的第二双极晶体管。 电阻器和第一和第二双极晶体管构成输入保护电路。