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    • 8. 发明申请
    • Method of and apparatus for eluting impurities
    • 洗脱杂质的方法和装置
    • US20050028840A1
    • 2005-02-10
    • US10893233
    • 2004-07-19
    • Sung-Jae LeeBok-Soon Ko
    • Sung-Jae LeeBok-Soon Ko
    • H01L21/304B08B3/04H01L21/00B08B3/00
    • H01L21/67051B08B3/048Y10S134/902
    • Impurities can be eluted simultaneously from a plurality of local areas of a surface layer of a semiconductor substrate. A supporting unit supports the substrate, and a sample plate is disposed on the surface of the substrate. The sample plate has a plurality of holes that expose the local areas of the surface of the substrate. Eluant is provided onto the local areas of the surface layer of the substrate through the holes in the sample plate. The impurities are thus dissolved by the eluant to produce a sample. A nozzle transfers the sample from the local areas of the surface of the substrate to a plurality of sample cups. Therefore, samples from the surface layer of the substrate may be produced in a short amount of time.
    • 杂质可以从半导体衬底的表面层的多个局部区域同时洗脱。 支撑单元支撑基板,并且样品板设置在基板的表面上。 样品板具有暴露基板表面的局部区域的多个孔。 通过样品板中的孔将洗脱液提供到基底的表面层的局部区域上。 因此,杂质被洗脱剂溶解以产生样品。 喷嘴将样品从基材表面的局部区域转移到多个样品杯。 因此,可以在短时间内制造来自基板的表面层的样品。