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1. 发明授权

US5444925A Fluid treatment apparatus and method 失效
标题翻译：流体处理装置及方法
公开(公告)号：US5444925A
公开(公告)日：1995-08-29
申请号：US164502
申请日：1993-12-09
申请人： Steven L. Bard , Jeffrey D. Jones , Robert H. Katyl , Ronald J. Moore , Oscar A. Moreno
发明人： Steven L. Bard , Jeffrey D. Jones , Robert H. Katyl , Ronald J. Moore , Oscar A. Moreno
IPC分类号： B05C5/02 , B05D1/36 , B08B3/02 , C23F1/08 , F26B21/00 , H01L21/304 , H05K3/00 , H05K3/22 , H05K3/26 , F26B9/00
CPC分类号： B05D1/36 , B05C5/02 , B08B3/022 , C23F1/08 , F26B21/004 , H05K3/0085 , H05K3/227
摘要： A new apparatus for treating substrates with fluids, as well as a corresponding fluid treatment method, is disclosed. The new apparatus includes a new configuration of fluid jet injectors which substantially overcomes the problem of dragout, in which fluid impinged upon an area of a substrate is retained on that area, preventing fresh fluid from reaching the impinged area. This new configuration also avoids imposing torques on substrates, and substantially reduces the need for rollers and guides for transporting substrates.
摘要翻译：公开了一种用于用流体处理基底的新设备，以及相应的流体处理方法。新设备包括流体喷射喷射器的新构造，其基本上克服了拖曳问题，其中冲击在基底区域上的流体保留在该区域上，防止新鲜流体到达冲击区域。这种新的结构也避免了对基片施加扭矩，并且基本上减少了用于输送基片的滚子和引导件的需要。

2. 发明授权

US5289639A Fluid treatment apparatus and method 失效
标题翻译：流体处理装置及方法
公开(公告)号：US5289639A
公开(公告)日：1994-03-01
申请号：US911610
申请日：1992-07-10
申请人： Steven L. Bard , Jeffrey D. Jones , Robert H. Katyl , Ronald J. Moore , Oscar A. Moreno
发明人： Steven L. Bard , Jeffrey D. Jones , Robert H. Katyl , Ronald J. Moore , Oscar A. Moreno
IPC分类号： B05C5/02 , B05D1/36 , B08B3/02 , C23F1/08 , F26B21/00 , H01L21/304 , H05K3/00 , H05K3/22 , H05K3/26 , F26B7/00
CPC分类号： B05D1/36 , B05C5/02 , B08B3/022 , C23F1/08 , F26B21/004 , H05K3/0085 , H05K3/227
摘要： A new apparatus for treating substrates with fluids, as well as a corresponding fluid treatment method, is disclosed. The new apparatus includes a new configuration of fluid jet injectors which substantially overcomes the problem of dragout, in which fluid impinged upon an area of a substrate is retained on that area, preventing fresh fluid from reaching the impinged area. This new configuration also avoids imposing torques on substrates, and substantially reduces the need for rollers and guides for transporting substrates.
摘要翻译：公开了一种用于用流体处理基底的新设备，以及相应的流体处理方法。新设备包括流体喷射喷射器的新构造，其基本上克服了拖曳问题，其中冲击在基底区域上的流体保留在该区域上，防止新鲜流体到达冲击区域。这种新的结构也避免了对基片施加扭矩，并且基本上减少了用于输送基片的滚子和引导件的需要。

3. 发明授权

US5063951A Fluid treatment device 失效
标题翻译：流体处理装置
公开(公告)号：US5063951A
公开(公告)日：1991-11-12
申请号：US554487
申请日：1990-07-19
申请人： Steven L. Bard , David N. Christensen , John J. Glenning , James A. Nicoletti , Mark W. Urdanick
发明人： Steven L. Bard , David N. Christensen , John J. Glenning , James A. Nicoletti , Mark W. Urdanick
IPC分类号： B05C3/12 , B08B3/04 , C23F1/08 , H05K3/06 , H05K13/00
CPC分类号： C23F1/08 , B08B3/04 , H05K13/0061 , H05K3/068
摘要： A device for applying fluid (e.g., etchant) to a substrate (e.g., thin metallic tape) wherein the device includes a head member having means therein for directing a first fluid (e.g., etchant) at an established first pressure against the substrate and means for directing a second fluid (e.g., air) at an established second pressure equal to or greater than the first pressure (at the location of fluid intersection) and against the substrate in the area proximate the first fluid so as to substantially contain and limit the first fluid to impingement substantially only at the location against which the first fluid is designed to strike. Preferably, two opposing head members are utilized, and these may serve to maintain the substrate therebetween in a suspended state. Both head members are movable relative to each other during fluid application. As stated, the device is particularly suited to function as an etcher, but may also serve other purposes (e.g., coating, cleaning, rinsing, etc.).
摘要翻译：一种用于将液体（例如，蚀刻剂）施加到基底（例如，薄金属带）的装置，其中该装置包括头部构件，该头部构件具有用于将建立的第一压力的第一流体（例如，蚀刻剂）引导到衬底上，用于将第二流体（例如，空气）引导到等于或大于第一压力（在流体相交处的位置处）的建立的第二压力并且靠近第一流体的区域中的基板，以便基本上容纳和限制第一流体基本上仅在第一流体被设计成撞击的位置处冲击。优选地，使用两个相对的头部构件，并且这些头部构件可用于将衬底保持在悬挂状态。两个头部构件在流体施加期间相对于彼此是可移动的。如所述，该装置特别适合用作蚀刻器，但也可用于其它目的（例如，涂覆，清洁，漂洗等）。

4. 发明授权

US4846929A Wet etching of thermally or chemically cured polyimide 失效
标题翻译：热蚀刻或化学固化的聚酰亚胺的湿蚀刻
公开(公告)号：US4846929A
公开(公告)日：1989-07-11
申请号：US218384
申请日：1988-07-13
申请人： Steven L. Bard , Claudius Feger , John J. Glenning , Gareth G. Hougham , Steven E. Molis , Walter P. Pawlowski , John J. Ritsko , Peter Slota, Jr. , Randy W. Snyder
发明人： Steven L. Bard , Claudius Feger , John J. Glenning , Gareth G. Hougham , Steven E. Molis , Walter P. Pawlowski , John J. Ritsko , Peter Slota, Jr. , Randy W. Snyder
IPC分类号： G03F7/26 , C08J7/12 , G03F7/40 , H01L21/306 , H01L21/311 , H05K1/03 , H05K3/00 , H05K3/10
CPC分类号： C08J7/12 , H01L21/31133 , H05K3/002 , C08J2379/08 , H05K1/0346 , H05K2201/0154 , H05K2203/0793 , H05K3/108
摘要： Polyimide is etched by contacting the polyimide with an aqueous solution of a metal hydroxide followed by contact with an acid followed by contact with an aqueous solution of a metal hydroxide. Etching of chemically cured polyimide can be enhanced by employing a presoaking in hot water. Also, partially etched chemically cured polyimide is removed with a concentrated acid solution.In preparing a metal coated polyimide structure for subsequent gold plating, two flash etching steps with the polyimide etch between are employed after developing the photoresist.

5. 发明授权

US5378307A Fluid treatment apparatus 失效
标题翻译：流体处理设备
公开(公告)号：US5378307A
公开(公告)日：1995-01-03
申请号：US54108
申请日：1993-04-28
申请人： Steven L. Bard , Gerald A. Bendz , Michael J. Canestaro , John R. Chapura , Edward J. Frankoski , Michael S. Horan , Jeffrey D. Jones , James S. Kamperman , John R. Kjelgaard, Jr. , Jack M. McCreary
发明人： Steven L. Bard , Gerald A. Bendz , Michael J. Canestaro , John R. Chapura , Edward J. Frankoski , Michael S. Horan , Jeffrey D. Jones , James S. Kamperman , John R. Kjelgaard, Jr. , Jack M. McCreary
IPC分类号： B05C5/00 , B05B15/04 , C23F1/08 , H01L23/12 , H05K3/00 , H05K3/06 , H05K3/18 , B08B3/02
CPC分类号： H05K3/0085 , B05B15/0406 , Y02P70/36
摘要： A fluid treatment apparatus and method for applying first and second fluids (e.g., etchant and water) to an article (e.g., circuit board) passing through the apparatus at a predetermined rate. The first fluid is impinged on a surface of the article and thereafter collected within the apparatus' common housing. The second fluid is impinged onto the surface of the article and collected within the same housing but at a location separate from the collected first fluid so as to at least partially prevent mixing thereof. The preferred means for effecting fluid impingement comprises separate fluid injecters, each including at least two rows of fluid jet injectors therein. The collected fluids are each returned to the respective impingement means. Replenishment of the second fluid is accomplished using a pump which supplies the second fluid, while the apparatus also includes means (e.g., a drain) to effectively remove the second fluid at a rate similar to the supply rate for the second fluid. The first fluid is also maintained at an established level above the article's surface using suitable means (e.g., dual rollers) located relative (e.g., on opposite sides of) the first fluid impingement means. Similar level retention for the second fluid is also possible. Cascading of the collected second fluid is also defined, this occurring within the same housing chamber which serves to collect the first fluid.
摘要翻译：一种用于将第一和第二流体（例如蚀刻剂和水）施加到以预定速率穿过设备的制品（例如电路板）的流体处理装置和方法。第一流体冲击在物品的表面上，然后收集在设备的共用外壳内。第二流体冲击到制品的表面上并收集在相同的壳体内，但是在与收集的第一流体分开的位置处，以至少部分地防止其混合。用于实现流体冲击的优选方式包括单独的流体注射器，每个流体注射器在其中包括至少两排流体喷射喷射器。收集的流体各自返回到相应的冲击装置。使用供应第二流体的泵来实现第二流体的补充，同时该装置还包括以与第二流体的供给速率相似的速率有效地去除第二流体的装置（例如排水管）。使用位于第一流体冲击装置相对（例如，在相对侧）上的合适的装置（例如，双辊），第一流体也保持在制品表面上方的确定水平。第二流体的相似水平保持也是可能的。还定义了所收集的第二流体的级联，其发生在用于收集第一流体的相同壳体室内。

6. 发明授权

US5192394A Fluid treatment apparatus and method 失效
标题翻译：流体处理装置及方法
公开(公告)号：US5192394A
公开(公告)日：1993-03-09
申请号：US808134
申请日：1991-12-16
申请人： Steven L. Bard , Jeffrey D. Jones
发明人： Steven L. Bard , Jeffrey D. Jones
IPC分类号： B05C3/00 , B05C5/00 , C23F1/08 , H05K3/00
CPC分类号： H05K3/0085 , C23F1/08
摘要： A fluid treatment apparatus and method wherein uniform treatment of a substrate (e.g., a thin, metallic sheet) is treated (e.g., etched) during movement thereof. This treatment involves directing a plurality of fluid jets through a collected first fluid onto one of the substrate's surfaces in such a manner that the fluid of each fluid jet will engage (collide with) the fluid from the nearest fluid jet as a result of being maintained across the substrate's surface at a predetermined velocity prior to mixing of the jets with surrounding fluid. Prevention of such mixing prior to such engagement has proven to assure uniform treatment of the substrate. In one aspect of the invention, fluid is directed onto opposite surfaces of the substrate in this fashion, the fluid from the lower surface, however, being passed through air or similar ambient and thus prevented from mixing therewith prior to such engagement.

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