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1. 发明申请

US20060197946A1 Enhanced simultaneous multi-spot inspection and imaging 有权
公开(公告)号：US20060197946A1
公开(公告)日：2006-09-07
申请号：US11071072
申请日：2005-03-02
申请人： Stephen Biellak , David Shortt
发明人： Stephen Biellak , David Shortt
IPC分类号： G01N21/88
CPC分类号： G01N21/9501 , G01N21/474 , G01N21/8806
摘要： A system and method for inspection is disclosed. The design includes focusing illumination beams of radiation at an optical axis to an array of illuminated elongated spots on the surface at oblique angle(s) of incidence to the surface, performing a linear scan along a linear axis, wherein the linear axis is offset from the optical axis by a not insubstantial angular quantity, and imaging scattered radiation from the spots onto an array of receivers so that each receiver in the array receives scattered radiation from a corresponding spot in the array of spots.

2. 发明申请

US20090299655A1 SYSTEMS AND METHODS FOR DETERMINING TWO OR MORE CHARACTERISTICS OF A WAFER 有权
标题翻译：用于确定波形的两个或更多特征的系统和方法
公开(公告)号：US20090299655A1
公开(公告)日：2009-12-03
申请号：US12128426
申请日：2008-05-28
申请人： Stephen Biellak , Daniel Kavaldjiev
发明人： Stephen Biellak , Daniel Kavaldjiev
IPC分类号： G06F19/00 , G01N21/47
CPC分类号： H01L22/12 , G01N21/9501 , G01N2021/8825 , H01L2924/0002 , H01L2924/00
摘要： Systems and methods for determining two or more characteristics of a wafer are provided. The two or more characteristics include a characteristic of the wafer that is spatially localized in at least one dimension and a characteristic of the wafer that is not spatially localized in two dimensions.
摘要翻译：提供了用于确定晶片的两个或多个特性的系统和方法。两个或更多个特征包括在至少一个维度上空间定位的晶片的特性和晶片在两维空间上不局限的特征。

3. 发明授权

US07489393B2 Enhanced simultaneous multi-spot inspection and imaging 有权
标题翻译：增强同时多点检测和成像
公开(公告)号：US07489393B2
公开(公告)日：2009-02-10
申请号：US11071072
申请日：2005-03-02
申请人： Stephen Biellak , David Shortt
发明人： Stephen Biellak , David Shortt
IPC分类号： G01N21/00
CPC分类号： G01N21/9501 , G01N21/474 , G01N21/8806
摘要： A system and method for inspection is disclosed. The design includes focusing illumination beams of radiation at an optical axis to an array of illuminated elongated spots on the surface at oblique angle(s) of incidence to the surface, performing a linear scan along a linear axis, wherein the linear axis is offset from the optical axis by a not insubstantial angular quantity, and imaging scattered radiation from the spots onto an array of receivers so that each receiver in the array receives scattered radiation from a corresponding spot in the array of spots.
摘要翻译：公开了一种用于检查的系统和方法。该设计包括将光轴上的照射光束照射到表面上的照射细长光斑阵列的倾斜角度，沿着线性轴进行线性扫描，其中线性轴线偏离通过非实质角度量的光轴，并且将来自斑点的散射辐射成像到接收器阵列上，使得阵列中的每个接收器接收来自点阵列中的对应点的散射辐射。

4. 发明授权

US08269960B2 Computer-implemented methods for inspecting and/or classifying a wafer 有权
标题翻译：用于检查和/或分类晶片的计算机实现的方法
公开(公告)号：US08269960B2
公开(公告)日：2012-09-18
申请号：US12179260
申请日：2008-07-24
申请人： Juergen Reich , Louis Vintro , Prasanna Dighe , Andrew Steinbach , Daniel Kavaldjiev , Stephen Biellak
发明人： Juergen Reich , Louis Vintro , Prasanna Dighe , Andrew Steinbach , Daniel Kavaldjiev , Stephen Biellak
IPC分类号： G01N21/00
CPC分类号： H01L22/12 , G01N21/9501 , H01L2924/0002 , H01L2924/00
摘要： Computer-implemented methods for inspecting and/or classifying a wafer are provided. One computer-implemented includes detecting defects on a wafer using one or more defect detection parameters, which are determined based on a non-spatially localized characteristic of the wafer that is determined using output responsive to light scattered from the wafer generated by an inspection system. Another computer-implemented method includes classifying a wafer based on a combination of a non-spatially localized characteristic of the wafer determined using output responsive to light scattered from the wafer generated by an inspection system and a spatially localized characteristic of the wafer determined using the output.
摘要翻译：提供了用于检查和/或分类晶片的计算机实现的方法。一种计算机实现的包括使用一个或多个缺陷检测参数来检测晶片上的缺陷，所述缺陷检测参数是基于使用响应于由检查系统产生的晶片散射的光的输出而确定的晶片的非空间局部特征确定的。另一种计算机实现的方法包括基于使用响应于由检查系统产生的晶片散射的光的输出确定的晶片的非空间局部化特性和使用输出确定的晶片的空间局部化特性的组合来分类晶片。

5. 发明授权

US08169613B1 Segmented polarizer for optimizing performance of a surface inspection system 有权
标题翻译：分段偏振器，用于优化表面检测系统的性能
公开(公告)号：US08169613B1
公开(公告)日：2012-05-01
申请号：US12618620
申请日：2009-11-13
申请人： Stephen Biellak , Daniel Kavaldjiev
发明人： Stephen Biellak , Daniel Kavaldjiev
IPC分类号： G01J4/00
CPC分类号： G01J1/0422 , G01J1/0429 , G01N21/8806 , G01N21/9501 , G02B5/3025 , G02B5/3075
摘要： A polarizing device may be used with sample inspection system having one or more collection systems that receive scattered radiation from a region on a sample surface and direct it to a detector. The polarizing device disposed between the collection system(s) and the detector. The polarizing device may include a plurality of polarizing sections. The sections may be characterized by different polarization characteristics. The polarizing device is configured to transmit scattered radiation from defects to the detector and to block noise from background sources that do not share characteristics with scattered radiation from the defects from reaching the detector while, maximizing a capture rate for the defects the detector at a less than optimal signal-to-noise ratio.
摘要翻译：可以使用具有一个或多个收集系统的样本检查系统的偏振装置，其接收来自样品表面上的区域的散射辐射并将其引导到检测器。设置在收集系统和检测器之间的偏振装置。偏振装置可以包括多个偏振部分。这些部分可以具有不同的偏振特性。偏振装置被配置为将来自缺陷的散射辐射传输到检测器并且阻止来自背景源的噪声，其不与来自缺陷的散射辐射共享特征以到达检测器，同时使检测器的缺陷的捕获率最小化比最佳信噪比。

6. 发明授权

US07554656B2 Methods and systems for inspection of a wafer 有权
标题翻译：用于检查晶片的方法和系统
公开(公告)号：US07554656B2
公开(公告)日：2009-06-30
申请号：US11244451
申请日：2005-10-06
申请人： David Shortt , Stephen Biellak , Alexander Belyaev
发明人： David Shortt , Stephen Biellak , Alexander Belyaev
IPC分类号： G01N21/00
CPC分类号： G01N21/9501 , G01N21/47 , G01N2021/4711 , G01N2021/8854
摘要： Methods and systems for inspection of a wafer are provided. One method includes illuminating the wafer with light at a first wavelength that penetrates into the wafer and light at a second wafer that does not substantially penetrate into the wafer. The method also includes generating output signals responsive to light from the wafer resulting from the illuminating step. In addition, the method includes detecting defects on the wafer using the output signals. The method further includes determining if the defects are subsurface defects or surface defects using the output signals.
摘要翻译：提供了用于检查晶片的方法和系统。一种方法包括用穿透晶片的第一波长的光照射晶片，并且在基本上不渗入晶片的第二晶片处照射晶片。该方法还包括产生响应于来自晶片的光的输出信号，其由照明步骤产生。此外，该方法包括使用输出信号检测晶片上的缺陷。该方法还包括使用输出信号确定缺陷是否是地下缺陷或表面缺陷。

7. 发明申请

US20090040525A1 SYSTEMS CONFIGURED TO INSPECT A WAFER 有权
标题翻译：系统配置检查波形
公开(公告)号：US20090040525A1
公开(公告)日：2009-02-12
申请号：US11837220
申请日：2007-08-10
申请人： Azmi Kadkly , Stephen Biellak , Mehdi Vaez-Iravani
发明人： Azmi Kadkly , Stephen Biellak , Mehdi Vaez-Iravani
IPC分类号： G01N21/47
CPC分类号： G01N21/9501
摘要： Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to illuminate an area on the wafer by directing light to the wafer at an oblique angle of incidence. The system also includes a collection subsystem configured to simultaneously collect light scattered from different spots within the illuminated area and to focus the light collected from the different spots to corresponding positions in an image plane. In addition, the system includes a detection subsystem configured to separately detect the light focused to the corresponding positions in the image plane and to separately generate output responsive to the light focused to the corresponding positions in the image plane. The output can be used to detect defects on the wafer.
摘要翻译：提供了配置用于检查晶片的系统。一个系统包括照明子系统，该照明子系统被配置为以倾斜的入射角将光引导到晶片上来照射晶片上的区域。该系统还包括收集子系统，其被配置为同时收集从照明区域内的不同点散射的光并且将从不同点收集的光聚焦到图像平面中的相应位置。另外，该系统包括检测子系统，该检测子系统被配置为分别检测聚焦到图像平面中的对应位置的光，并且响应于聚焦到图像平面中的对应位置的光单独产生输出。该输出可用于检测晶圆上的缺陷。

8. 发明申请

US20070081151A1 Methods and systems for inspection of a wafer 有权
标题翻译：用于检查晶片的方法和系统
公开(公告)号：US20070081151A1
公开(公告)日：2007-04-12
申请号：US11244451
申请日：2005-10-06
申请人： David Shortt , Stephen Biellak , Alexander Belyaev
发明人： David Shortt , Stephen Biellak , Alexander Belyaev
IPC分类号： G01N21/88
CPC分类号： G01N21/9501 , G01N21/47 , G01N2021/4711 , G01N2021/8854
摘要： Methods and systems for inspection of a wafer are provided. One method includes illuminating the wafer with light at a first wavelength that penetrates into the wafer and light at a second wafer that does not substantially penetrate into the wafer. The method also includes generating output signals responsive to light from the wafer resulting from the illuminating step. In addition, the method includes detecting defects on the wafer using the output signals. The method further includes determining if the defects are subsurface defects or surface defects using the output signals.
摘要翻译：提供了用于检查晶片的方法和系统。一种方法包括用穿透晶片的第一波长的光照射晶片，并且在基本上不渗入晶片的第二晶片处照射晶片。该方法还包括产生响应于来自晶片的光的输出信号，其由照明步骤产生。此外，该方法包括使用输出信号检测晶片上的缺陷。该方法还包括使用输出信号确定缺陷是否是地下缺陷或表面缺陷。

9. 发明授权

US08582094B1 Systems and methods for inspecting specimens including specimens that have a substantially rough uppermost layer 有权
标题翻译：用于检查样品的系统和方法，包括具有基本粗糙的最上层的样品
公开(公告)号：US08582094B1
公开(公告)日：2013-11-12
申请号：US11110383
申请日：2005-04-20
申请人： David Shortt , Stephen Biellak , Christian Wolters
发明人： David Shortt , Stephen Biellak , Christian Wolters
IPC分类号： G01N21/00 , G01J4/00
CPC分类号： G01N21/9501
摘要： Systems and methods for inspecting a specimen are provided. One system includes an illumination subsystem configured to direct light to the specimen at an oblique angle of incidence. The light is polarized in a plane that is substantially parallel to the plane of incidence. The system also includes a detection subsystem configured to detect light scattered from the specimen. The detected light is polarized in a plane that is substantially parallel to the plane of scattering. In addition, the system includes a processor configured to detect defects on the specimen using signals generated by the detection subsystem. In one embodiment, such a system may be configured to detect defects having a size that is less than half of a wavelength of the light directed to the specimen.
摘要翻译：提供了检查样本的系统和方法。一个系统包括被配置为以倾斜入射角将光引导到样本的照明子系统。光在基本上平行于入射平面的平面中极化。该系统还包括检测子系统，其被配置为检测从样本散射的光。检测到的光在基本上平行于散射平面的平面中极化。另外，该系统包括配置成使用由检测子系统产生的信号来检测样本上的缺陷的处理器。在一个实施例中，这样的系统可以被配置为检测具有小于指向样本的光的波长的一半的尺寸的缺陷。

10. 发明申请

US20130016346A1 Wafer Inspection 有权
标题翻译：晶圆检验
公开(公告)号：US20130016346A1
公开(公告)日：2013-01-17
申请号：US13544954
申请日：2012-07-09
申请人： Anatoly Romanovsky , Ivan Maleev , Daniel Kavaldjiev , Yury Yuditsky , Dirk Woll , Stephen Biellak
发明人： Anatoly Romanovsky , Ivan Maleev , Daniel Kavaldjiev , Yury Yuditsky , Dirk Woll , Stephen Biellak
IPC分类号： G01N21/956
CPC分类号： G01N21/9501 , G01N21/47 , G01N21/8806 , G01N21/8851 , G01N21/956
摘要： Systems configured to inspect a wafer are provided.
摘要翻译：提供了配置用于检查晶片的系统。

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