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1. 发明授权

US08582094B1 Systems and methods for inspecting specimens including specimens that have a substantially rough uppermost layer 有权
标题翻译：用于检查样品的系统和方法，包括具有基本粗糙的最上层的样品
公开(公告)号：US08582094B1
公开(公告)日：2013-11-12
申请号：US11110383
申请日：2005-04-20
申请人： David Shortt , Stephen Biellak , Christian Wolters
发明人： David Shortt , Stephen Biellak , Christian Wolters
IPC分类号： G01N21/00 , G01J4/00
CPC分类号： G01N21/9501
摘要： Systems and methods for inspecting a specimen are provided. One system includes an illumination subsystem configured to direct light to the specimen at an oblique angle of incidence. The light is polarized in a plane that is substantially parallel to the plane of incidence. The system also includes a detection subsystem configured to detect light scattered from the specimen. The detected light is polarized in a plane that is substantially parallel to the plane of scattering. In addition, the system includes a processor configured to detect defects on the specimen using signals generated by the detection subsystem. In one embodiment, such a system may be configured to detect defects having a size that is less than half of a wavelength of the light directed to the specimen.
摘要翻译：提供了检查样本的系统和方法。一个系统包括被配置为以倾斜入射角将光引导到样本的照明子系统。光在基本上平行于入射平面的平面中极化。该系统还包括检测子系统，其被配置为检测从样本散射的光。检测到的光在基本上平行于散射平面的平面中极化。另外，该系统包括配置成使用由检测子系统产生的信号来检测样本上的缺陷的处理器。在一个实施例中，这样的系统可以被配置为检测具有小于指向样本的光的波长的一半的尺寸的缺陷。

2. 发明申请

US20060197946A1 Enhanced simultaneous multi-spot inspection and imaging 有权
公开(公告)号：US20060197946A1
公开(公告)日：2006-09-07
申请号：US11071072
申请日：2005-03-02
申请人： Stephen Biellak , David Shortt
发明人： Stephen Biellak , David Shortt
IPC分类号： G01N21/88
CPC分类号： G01N21/9501 , G01N21/474 , G01N21/8806
摘要： A system and method for inspection is disclosed. The design includes focusing illumination beams of radiation at an optical axis to an array of illuminated elongated spots on the surface at oblique angle(s) of incidence to the surface, performing a linear scan along a linear axis, wherein the linear axis is offset from the optical axis by a not insubstantial angular quantity, and imaging scattered radiation from the spots onto an array of receivers so that each receiver in the array receives scattered radiation from a corresponding spot in the array of spots.

3. 发明授权

US07489393B2 Enhanced simultaneous multi-spot inspection and imaging 有权
标题翻译：增强同时多点检测和成像
公开(公告)号：US07489393B2
公开(公告)日：2009-02-10
申请号：US11071072
申请日：2005-03-02
申请人： Stephen Biellak , David Shortt
发明人： Stephen Biellak , David Shortt
IPC分类号： G01N21/00
CPC分类号： G01N21/9501 , G01N21/474 , G01N21/8806
摘要： A system and method for inspection is disclosed. The design includes focusing illumination beams of radiation at an optical axis to an array of illuminated elongated spots on the surface at oblique angle(s) of incidence to the surface, performing a linear scan along a linear axis, wherein the linear axis is offset from the optical axis by a not insubstantial angular quantity, and imaging scattered radiation from the spots onto an array of receivers so that each receiver in the array receives scattered radiation from a corresponding spot in the array of spots.
摘要翻译：公开了一种用于检查的系统和方法。该设计包括将光轴上的照射光束照射到表面上的照射细长光斑阵列的倾斜角度，沿着线性轴进行线性扫描，其中线性轴线偏离通过非实质角度量的光轴，并且将来自斑点的散射辐射成像到接收器阵列上，使得阵列中的每个接收器接收来自点阵列中的对应点的散射辐射。

4. 发明授权

US07554656B2 Methods and systems for inspection of a wafer 有权
标题翻译：用于检查晶片的方法和系统
公开(公告)号：US07554656B2
公开(公告)日：2009-06-30
申请号：US11244451
申请日：2005-10-06
申请人： David Shortt , Stephen Biellak , Alexander Belyaev
发明人： David Shortt , Stephen Biellak , Alexander Belyaev
IPC分类号： G01N21/00
CPC分类号： G01N21/9501 , G01N21/47 , G01N2021/4711 , G01N2021/8854
摘要： Methods and systems for inspection of a wafer are provided. One method includes illuminating the wafer with light at a first wavelength that penetrates into the wafer and light at a second wafer that does not substantially penetrate into the wafer. The method also includes generating output signals responsive to light from the wafer resulting from the illuminating step. In addition, the method includes detecting defects on the wafer using the output signals. The method further includes determining if the defects are subsurface defects or surface defects using the output signals.
摘要翻译：提供了用于检查晶片的方法和系统。一种方法包括用穿透晶片的第一波长的光照射晶片，并且在基本上不渗入晶片的第二晶片处照射晶片。该方法还包括产生响应于来自晶片的光的输出信号，其由照明步骤产生。此外，该方法包括使用输出信号检测晶片上的缺陷。该方法还包括使用输出信号确定缺陷是否是地下缺陷或表面缺陷。

5. 发明申请

US20070081151A1 Methods and systems for inspection of a wafer 有权
标题翻译：用于检查晶片的方法和系统
公开(公告)号：US20070081151A1
公开(公告)日：2007-04-12
申请号：US11244451
申请日：2005-10-06
申请人： David Shortt , Stephen Biellak , Alexander Belyaev
发明人： David Shortt , Stephen Biellak , Alexander Belyaev
IPC分类号： G01N21/88
CPC分类号： G01N21/9501 , G01N21/47 , G01N2021/4711 , G01N2021/8854
摘要： Methods and systems for inspection of a wafer are provided. One method includes illuminating the wafer with light at a first wavelength that penetrates into the wafer and light at a second wafer that does not substantially penetrate into the wafer. The method also includes generating output signals responsive to light from the wafer resulting from the illuminating step. In addition, the method includes detecting defects on the wafer using the output signals. The method further includes determining if the defects are subsurface defects or surface defects using the output signals.
摘要翻译：提供了用于检查晶片的方法和系统。一种方法包括用穿透晶片的第一波长的光照射晶片，并且在基本上不渗入晶片的第二晶片处照射晶片。该方法还包括产生响应于来自晶片的光的输出信号，其由照明步骤产生。此外，该方法包括使用输出信号检测晶片上的缺陷。该方法还包括使用输出信号确定缺陷是否是地下缺陷或表面缺陷。

6. 发明授权

US07463349B1 Systems and methods for determining a characteristic of a specimen 有权
标题翻译：用于确定样本特征的系统和方法
公开(公告)号：US07463349B1
公开(公告)日：2008-12-09
申请号：US11421929
申请日：2006-06-02
申请人： Stephen Biellak , David Shortt
发明人： Stephen Biellak , David Shortt
IPC分类号： G01N21/00
CPC分类号： G01N21/9501
摘要： Systems and methods for determining a characteristic of a specimen are provided. One system includes an illumination subsystem configured to direct light to a first set of spots on the specimen at a normal angle of incidence and to simultaneously direct light to a second set of spots on the specimen at an oblique angle of incidence. The system also includes a detection subsystem configured to detect light scattered from the first and second sets of spots simultaneously and to generate first output responsive to the light scattered from the first set of spots and second output responsive to the light scattered from the second set of spots. The first and second outputs can be used to determine the characteristic of the specimen.
摘要翻译：提供了用于确定样本特征的系统和方法。一个系统包括照明子系统，该照明子系统被配置为以正常的入射角将光引导到样本上的第一组斑点，并且以倾斜的入射角同时将光引导到样本上的第二组斑点。该系统还包括检测子系统，被配置为同时检测从第一和第二组斑点散射的光，并响应于从第一组光点散射的光产生第一输出，并响应于从第二组光散射的光而产生第二输出斑点。第一和第二输出可用于确定样品的特性。

7. 发明授权

US07697129B2 Systems and methods for inspecting a wafer with increased sensitivity 有权
标题翻译：增加灵敏度检查晶圆的系统和方法
公开(公告)号：US07697129B2
公开(公告)日：2010-04-13
申请号：US12097172
申请日：2006-12-14
申请人： Kurt L. Haller , David Shortt , Christian Wolters
发明人： Kurt L. Haller , David Shortt , Christian Wolters
IPC分类号： G01N21/00
CPC分类号： G01N21/9501
摘要： Systems and methods for inspecting a wafer with increased sensitivity are provided. One system includes an inspection subsystem configured to direct light to a spot on the wafer and to generate output signals responsive to light scattered from the spot on the wafer. The system also includes a gas flow subsystem configured to replace a gas located proximate to the spot on the wafer with a medium that scatters less of the light than the gas thereby increasing the sensitivity of the system. In addition, the system includes a processor configured to detect defects on the wafer using the output signals.
摘要翻译：提供了用于检查具有增加的灵敏度的晶片的系统和方法。一个系统包括检查子系统，该检查子系统被配置为将光引导到晶片上的一个点上，并产生响应于从晶片上的点散射的光的输出信号。该系统还包括气流子系统，该气流子系统被配置成用与气体相比散射的光更少的介质来替代位于晶片上的点附近的气体，从而增加了系统的灵敏度。另外，该系统包括配置成使用输出信号来检测晶片上的缺陷的处理器。

8. 发明授权

US07372559B2 Systems and methods for inspecting a wafer with increased sensitivity 有权
标题翻译：增加灵敏度检查晶圆的系统和方法
公开(公告)号：US07372559B2
公开(公告)日：2008-05-13
申请号：US11302936
申请日：2005-12-14
申请人： Kurt L. Haller , David Shortt , Christian Wolters
发明人： Kurt L. Haller , David Shortt , Christian Wolters
IPC分类号： G01N21/00
CPC分类号： G01N21/9501
摘要： Systems and methods for inspecting a wafer with increased sensitivity are provided. One system includes an inspection subsystem configured to direct light to a spot on the wafer and to generate output signals responsive to light scattered from the spot on the wafer. The system also includes a gas flow subsystem configured to replace a gas located proximate to the spot on the wafer with a medium that scatters less of the light than the gas thereby increasing the sensitivity of the system. In addition, the system includes a processor configured to detect defects on the wafer using the output signals.
摘要翻译：提供了用于检查具有增加的灵敏度的晶片的系统和方法。一个系统包括检查子系统，该检查子系统被配置为将光引导到晶片上的一个点上，并产生响应于从晶片上的点散射的光的输出信号。该系统还包括气流子系统，该气流子系统被配置成用与气体相比散射的光更少的介质来替代位于晶片上的点附近的气体，从而增加了系统的灵敏度。另外，该系统包括配置成使用输出信号来检测晶片上的缺陷的处理器。

9. 发明授权

US07304310B1 Methods and systems for inspecting a specimen using light scattered in different wavelength ranges 有权
标题翻译：使用不同波长范围散射的光检查样本的方法和系统
公开(公告)号：US07304310B1
公开(公告)日：2007-12-04
申请号：US10719347
申请日：2003-11-21
申请人： David Shortt , Christian Wolters
发明人： David Shortt , Christian Wolters
IPC分类号： G01J3/00
CPC分类号： G01N21/956 , G01N21/8806 , G01N21/94 , G01N2021/8854 , G01N2021/95676 , G03F7/7085 , G03F7/70916
摘要： Methods and systems for inspecting a specimen are provided. One method includes directing ultraviolet light to a specimen. The method also includes detecting light scattered from the specimen having a selected wavelength range. In addition, the method includes detecting features, defects, or light scattering properties of the specimen using signals representative of the detected light. One inspection system includes an illumination subsystem configured to direct ultraviolet light to a specimen. The system also includes a channel configured to detect light scattered from the specimen having a selected wavelength range. In addition, the system includes a processor configured to detect features, defects, or light scattering properties of the specimen using signals that are representative of the detected light.
摘要翻译：提供了检查样本的方法和系统。一种方法包括将紫外光引导到样品。该方法还包括检测从具有选定波长范围的样本散射的光。此外，该方法包括使用表示检测到的光的信号检测样本的特征，缺陷或光散射性质。一个检查系统包括被配置为将紫外光引导到样本的照明子系统。该系统还包括被配置为检测从具有选定波长范围的样本散射的光的通道。另外，该系统包括处理器，其被配置为使用代表所检测到的光的信号来检测样本的特征，缺陷或光散射特性。

10. 发明申请

US20070132987A1 Systems and methods for inspecting a wafer with increased sensitivity 有权
标题翻译：增加灵敏度检查晶圆的系统和方法
公开(公告)号：US20070132987A1
公开(公告)日：2007-06-14
申请号：US11302936
申请日：2005-12-14
申请人： Kurt Haller , David Shortt , Christian Wolters
发明人： Kurt Haller , David Shortt , Christian Wolters
IPC分类号： G01N21/88
CPC分类号： G01N21/9501
摘要： Systems and methods for inspecting a wafer with increased sensitivity are provided. One system includes an inspection subsystem configured to direct light to a spot on the wafer and to generate output signals responsive to light scattered from the spot on the wafer. The system also includes a gas flow subsystem configured to replace a gas located proximate to the spot on the wafer with a medium that scatters less of the light than the gas thereby increasing the sensitivity of the system. In addition, the system includes a processor configured to detect defects on the wafer using the output signals.
摘要翻译：提供了用于检查具有增加的灵敏度的晶片的系统和方法。一个系统包括检查子系统，该检查子系统被配置为将光引导到晶片上的一个点上，并产生响应于从晶片上的点散射的光的输出信号。该系统还包括气流子系统，该气流子系统被配置成用与气体相比散射的光更少的介质来替代位于晶片上的点附近的气体，从而增加了系统的灵敏度。另外，该系统包括配置成使用输出信号来检测晶片上的缺陷的处理器。

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