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1. 发明授权

US08567046B2 Methods for making magnetic components 有权
标题翻译：制造磁性部件的方法
公开(公告)号：US08567046B2
公开(公告)日：2013-10-29
申请号：US12632084
申请日：2009-12-07
申请人： Satish Prabhakaran , John Stanley Glaser , Ljubisa Dragoljub Stevanovic , Juan Manuel Rivas Davila
发明人： Satish Prabhakaran , John Stanley Glaser , Ljubisa Dragoljub Stevanovic , Juan Manuel Rivas Davila
IPC分类号： H01F7/06
CPC分类号： H01F17/02 , H01F17/06 , H01F27/10 , H01F27/2804 , H01F27/2895 , H01F41/041 , Y10T29/49002 , Y10T29/49071 , Y10T29/49073 , Y10T29/49075 , Y10T156/10
摘要： A method for making a magnetic component is provided. The method comprises providing a core with one or more ridges protruding from one or more surfaces of the core, depositing one or more electrically conductive materials on the core, and removing at least a portion of the one or more ridges to form one or more continuous conductors wound around the core. Each of the one or more continuous conductors defines at least one insulating gap. Further, a magnetic component and methods for making the magnetic component are also presented.
摘要翻译：提供了一种制造磁性部件的方法。该方法包括提供具有从芯的一个或多个表面突出的一个或多个脊的芯，在芯上沉积一个或多个导电材料，以及去除所述一个或多个脊的至少一部分以形成一个或多个连续导体缠绕在芯上。一个或多个连续导体中的每一个限定至少一个绝缘间隙。此外，还提出了磁性部件和用于制造磁性部件的方法。

2. 发明申请

US20130075878A1 COAXIAL POWER MODULE 有权
标题翻译：同轴电源模块
公开(公告)号：US20130075878A1
公开(公告)日：2013-03-28
申请号：US13247216
申请日：2011-09-28
申请人： Eladio Clemente Delgado , Arun Virupaksha Gowda , Antonio Caiafa , Brian Lynn Rowden , Ljubisa Dragoljub Stevanovic , Richard Alfred Beaupre
发明人： Eladio Clemente Delgado , Arun Virupaksha Gowda , Antonio Caiafa , Brian Lynn Rowden , Ljubisa Dragoljub Stevanovic , Richard Alfred Beaupre
IPC分类号： H01L23/552
CPC分类号： H01L23/552 , H01L25/117 , H01L2924/0002 , H01L2924/00
摘要： A power module includes at least one semiconductor die holding structure. Each die holding structure has a substantially cylindrical outer profile and a central axis. Each die holding structure is disposed within a common cylindrical EMI shield. A plurality of semiconductor devices are mounted to each die holding structure to form a substantially symmetric die mounting pattern respect to the central axis of the die holding structure.
摘要翻译：电源模块包括至少一个半导体管芯保持结构。每个模具保持结构具有基本上圆柱形的外部轮廓和中心轴线。每个管芯保持结构设置在共同的圆柱形EMI屏蔽内。多个半导体器件被安装到每个管芯保持结构，以相对于管芯保持结构的中心轴线形成大致对称的管芯安装图案。

3. 发明授权

US07817422B2 Heat sink and cooling and packaging stack for press-packages 有权
标题翻译：散热器和冷却和包装堆叠用于压力包装
公开(公告)号：US07817422B2
公开(公告)日：2010-10-19
申请号：US12193441
申请日：2008-08-18
申请人： Satish Sivarama Gunturi , Mahadevan Balasubramaniam , Ramakrishna Venkata Mallina , Richard Alfred Beaupre , Le Yan , Richard S. Zhang , Ljubisa Dragoljub Stevanovic , Adam Gregory Pautsch , Stephen Adam Solovitz
发明人： Satish Sivarama Gunturi , Mahadevan Balasubramaniam , Ramakrishna Venkata Mallina , Richard Alfred Beaupre , Le Yan , Richard S. Zhang , Ljubisa Dragoljub Stevanovic , Adam Gregory Pautsch , Stephen Adam Solovitz
IPC分类号： H05K7/20
CPC分类号： F28F3/12 , H01L23/473 , H01L25/117 , H01L2924/0002 , H01L2924/13055 , H01L2924/3011 , H01L2924/00
摘要： A heat sink for directly cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material. The cooling piece defines multiple inlet manifolds configured to receive a coolant and multiple outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved. The cooling piece further defines multiple millichannels configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink.
摘要翻译：提供了用于直接冷却至少一个电子设备封装的散热器。电子器件封装具有上接触表面和下接触表面。散热器包括由至少一种导热材料形成的冷却片。冷却片限定了多个入口歧管，其构造成接收冷却剂和多个出口歧管，其被配置为排出冷却剂。入口和出口歧管交错。冷却片进一步限定多个毫通道，其构造成从入口歧管接收冷却剂并且将冷却剂输送到出口歧管。毫通道和入口和出口歧管还被构造成通过与冷却剂直接接触直接冷却电子器件封装的上接触表面和下接触表面之一，使得散热器包括整体式散热器。

4. 发明申请

US20080042636A1 SYSTEM AND METHOD FOR CURRENT SENSING 审中-公开
标题翻译：电流传感系统及方法
公开(公告)号：US20080042636A1
公开(公告)日：2008-02-21
申请号：US11465474
申请日：2006-08-18
申请人： GLEN PETER KOSTE , YUN (NMN) LI , JOHN STANLEY GLASER , MICHAEL ANDREW DE ROOIJ , LJUBISA DRAGOLJUB STEVANOVIC , RICHARD ALFRED BEAUPRE , HUA (NMN) XIA
发明人： GLEN PETER KOSTE , YUN (NMN) LI , JOHN STANLEY GLASER , MICHAEL ANDREW DE ROOIJ , LJUBISA DRAGOLJUB STEVANOVIC , RICHARD ALFRED BEAUPRE , HUA (NMN) XIA
IPC分类号： G01R31/00
CPC分类号： G01R15/205
摘要： A current sensing system for estimating current in substantially parallel planar conductors. The system includes a magnetostrictive optical sensor including an optical sensing element coupled to a magnetostrictive element and disposed between substantially parallel planar conductors, wherein the magnetostrictive element is configured to cause a strain in the optical sensing element in the presence of a magnetic field between the substantially parallel planar conductors, and wherein the optical sensing element is configured to receive an optical interrogation signal and provide a wavelength modulated data signal indicative of magnitude of the current flowing through the conductors.
摘要翻译：用于估计基本上平行的平面导体中的电流的电流感测系统。该系统包括磁致伸缩光学传感器，其包括耦合到磁致伸缩元件并且设置在基本上平行的平面导体之间的光学感测元件，其中该磁致伸缩元件构造成在存在基本上平行平面导体，并且其中所述光学感测元件被配置为接收光学询问信号并提供指示流过所述导体的电流的大小的波长调制数据信号。

5. 发明授权

US07258464B2 Integral ballast lamp thermal management method and apparatus 失效
标题翻译：积分镇流灯热管理方法及装置
公开(公告)号：US07258464B2
公开(公告)日：2007-08-21
申请号：US10323251
申请日：2002-12-18
申请人： Garron K. Morris , Kamlesh Mundra , Ljubisa Dragoljub Stevanovic , Ashutosh Joshi , Didier G. Rouaud , Janos G. Sarkozi
发明人： Garron K. Morris , Kamlesh Mundra , Ljubisa Dragoljub Stevanovic , Ashutosh Joshi , Didier G. Rouaud , Janos G. Sarkozi
IPC分类号： F21V29/00
CPC分类号： F21V29/67 , F21V29/004 , F21V29/15 , F21V29/51 , F21V29/70
摘要： A lamp having a lighting source, integral electronics, and a thermal distribution mechanism disposed in a housing. The thermal distribution mechanism may include a For example, the lamp may include a thermal shield between the lighting source and the integral electronics. The lamp also may have a forced convection mechanism, such as an air-moving device, disposed adjacent the integral electronics. A heat pipe, a heat sink, or another conductive heat transfer member also may be disposed in thermal communication with one or more of the integral electronics. For example, the integral electronics may be mounted to a thermally conductive board. The housing itself also may be thermally conductive to conductively spread the heat and convect/radiate the heat away from the lamp.
摘要翻译：一种具有照明源，集成电子部件和布置在壳体中的热分配机构的灯。热分配机构可以包括例如，灯可以包括在照明源和集成电子器件之间的热屏蔽。该灯还可以具有邻近整体电子设备设置的强制对流机构，例如空气移动装置。还可以将热管，散热器或另一导电传热构件设置成与一个或多个整体电子器件热连通。例如，整体电子器件可以安装到导热板上。壳体本身也可以是导热的，以导电地传播热量并使热量远离灯的对流/辐射。

6. 发明授权

US08076696B2 Power module assembly with reduced inductance 有权
标题翻译：功率模块组件具有降低的电感
公开(公告)号：US08076696B2
公开(公告)日：2011-12-13
申请号：US12609400
申请日：2009-10-30
申请人： Richard Alfred Beaupre , Eladio Clemente Delgado , Ljubisa Dragoljub Stevanovic
发明人： Richard Alfred Beaupre , Eladio Clemente Delgado , Ljubisa Dragoljub Stevanovic
IPC分类号： H01L31/111
CPC分类号： H01L24/49 , H01L24/48 , H01L25/072 , H01L2224/48091 , H01L2224/48137 , H01L2224/48472 , H01L2224/4911 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/12032 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15747 , H01L2924/19107 , H01L2924/30107 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A device is provided that includes a first conductive substrate and a second conductive substrate. A first power semiconductor component having a first thickness can be electrically coupled to the first conductive substrate. A second power semiconductor component having a second thickness can be electrically coupled to the second conductive substrate. A positive terminal can also be electrically coupled to the first conductive substrate, while a negative terminal can be electrically coupled to the second power semiconductor component, and an output terminal may be electrically coupled to the first power semiconductor component and the second conductive substrate. The terminals, the power semiconductor components, and the conductive substrates may thereby be incorporated into a common circuit loop, and may together be configured such that a width of the circuit loop in at least one direction is defined by at least one of the first thickness or the second thickness.
摘要翻译：提供了一种包括第一导电衬底和第二导电衬底的器件。具有第一厚度的第一功率半导体部件可以电耦合到第一导电基板。具有第二厚度的第二功率半导体部件可以电耦合到第二导电基板。正端子也可以电耦合到第一导电衬底，而负端子可以电耦合到第二功率半导体部件，并且输出端子可以电耦合到第一功率半导体部件和第二导电衬底。因此，端子，功率半导体部件和导电基板可以并入到公共电路回路中，并且可以一起构造成使得至少一个方向上的电路回路的宽度由第一厚度或第二厚度。

7. 发明授权

US07898807B2 Methods for making millichannel substrate, and cooling device and apparatus using the substrate 有权
标题翻译：制造毫通底材的方法以及使用该基材的冷却装置和装置
公开(公告)号：US07898807B2
公开(公告)日：2011-03-01
申请号：US12400067
申请日：2009-03-09
申请人： Richard Alfred Beaupre , Ljubisa Dragoljub Stevanovic
发明人： Richard Alfred Beaupre , Ljubisa Dragoljub Stevanovic
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , C04B2237/407 , H01L23/3735 , H01L2224/32225 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H05K1/0272 , H05K1/0306 , H05K3/0061 , H05K2201/0355 , H05K2201/09745 , Y10T29/4935 , Y10T29/49366 , Y10T29/494 , Y10T428/2457 , H01L2924/00
摘要： A substrate for power electronics mounted thereon, comprises a middle ceramic layer having a lower surface and an upper surface, an upper metal layer attached to the upper surface of the middle ceramic layer, and a lower metal layer attached to the lower surface of the middle ceramic layer. The lower metal layer has a plurality of millichannels configured to deliver a coolant for cooling the power electronics, wherein the millichannels are formed on the lower metal layer prior to attachment to the lower surface of the middle ceramic layer. Methods for making a cooling device and an apparatus are also presented.
摘要翻译：安装在其上的用于电力电子的基板包括具有下表面和上表面的中间陶瓷层，附着到中间陶瓷层的上表面的上金属层和附接到中间陶瓷层的下表面的下金属层陶瓷层。下金属层具有多个毫通道，其构造成输送用于冷却电力电子设备的冷却剂，其中在连接到中间陶瓷层的下表面之前，在下金属层上形成毫通道。还提出了制造冷却装置和装置的方法。

8. 发明申请

US20100038058A1 HEAT SINK AND COOLING AND PACKAGING STACK FOR PRESS-PACKAGES 有权
标题翻译：用于压缩包的热水槽和冷却和包装堆叠
公开(公告)号：US20100038058A1
公开(公告)日：2010-02-18
申请号：US12193441
申请日：2008-08-18
申请人： Satish Sivarama Gunturi , Mahadevan Balasubramaniam , Ramakrishna Venkata Mallina , Richard Alfred Beaupre , Le Yan , Richard S. Zhang , Ljubisa Dragoljub Stevanovic , Adam Gregory Pautsch , Stephen Adam Solovitz
发明人： Satish Sivarama Gunturi , Mahadevan Balasubramaniam , Ramakrishna Venkata Mallina , Richard Alfred Beaupre , Le Yan , Richard S. Zhang , Ljubisa Dragoljub Stevanovic , Adam Gregory Pautsch , Stephen Adam Solovitz
IPC分类号： F28F7/00
CPC分类号： F28F3/12 , H01L23/473 , H01L25/117 , H01L2924/0002 , H01L2924/13055 , H01L2924/3011 , H01L2924/00
摘要： A heat sink for directly cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material. The cooling piece defines multiple inlet manifolds configured to receive a coolant and multiple outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved. The cooling piece further defines multiple millichannels configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink.
摘要翻译：提供了用于直接冷却至少一个电子设备封装的散热器。电子器件封装具有上接触表面和下接触表面。散热器包括由至少一种导热材料形成的冷却片。冷却片限定了多个入口歧管，其构造成接收冷却剂和多个出口歧管，其被配置为排出冷却剂。入口和出口歧管交错。冷却片进一步限定多个毫通道，其构造成从入口歧管接收冷却剂并且将冷却剂输送到出口歧管。毫通道和入口和出口歧管还被构造成通过与冷却剂直接接触直接冷却电子器件封装的上接触表面和下接触表面之一，使得散热器包括整体式散热器。

9. 发明申请

US20080304300A1 Power conversion system with galvanically isolated high frequency link 有权
标题翻译：电源转换系统采用电隔离高频链路
公开(公告)号：US20080304300A1
公开(公告)日：2008-12-11
申请号：US11810837
申请日：2007-06-06
申请人： Ravisekhar Nadimpalli Raju , Richard S. Zhang , Rajib Datta , Allen Michael Ritter , Ljubisa Dragoljub Stevanovic
发明人： Ravisekhar Nadimpalli Raju , Richard S. Zhang , Rajib Datta , Allen Michael Ritter , Ljubisa Dragoljub Stevanovic
IPC分类号： H02M7/06 , H02M7/00 , H02M7/155 , H02M7/217
CPC分类号： H02M7/217 , H02M2001/0074 , H02M2001/009 , Y02B70/1483
摘要： A power conversion system has a three-phase AC input, where each AC input phase is linked to a string of cascaded single-phase AC-DC converters placed in series with a three-phase AC-DC converter. Each single-phase AC-DC converter in one embodiment includes a silicon carbide (SiC) pulse width modulated MOSFET H-bridge that placed in series with the three-phase AC-DC converter that includes a silicon (Si) SCR bridge. The single-phase AC-DC converters and the three-phase AC-DC converter together in one embodiment include a mixed silicon-carbide (SiC) and silicon (Si) device topology.
摘要翻译：电力转换系统具有三相AC输入，其中每个AC输入相位与串联的三相AC-DC转换器串联的级联单相AC-DC转换器串联。在一个实施例中，每个单相AC-DC转换器包括与包括硅（Si）SCR桥的三相AC-DC转换器串联放置的碳化硅（SiC）脉宽调制MOSFET H桥。在一个实施例中，单相AC-DC转换器和三相AC-DC转换器一起包括混合碳化硅（SiC）和硅（Si）器件拓扑。

10. 发明授权

US06779920B2 X-ray localizer light system 失效
标题翻译： X光定位器灯系统
公开(公告)号：US06779920B2
公开(公告)日：2004-08-24
申请号：US09683895
申请日：2002-02-28
申请人： Ljubisa Dragoljub Stevanovic , Eugene George Olczak , Frank Jacob John Mueller , Dietmar Karl Sundermann
发明人： Ljubisa Dragoljub Stevanovic , Eugene George Olczak , Frank Jacob John Mueller , Dietmar Karl Sundermann
IPC分类号： G21K700
CPC分类号： G03B42/08
摘要： An X-ray localizer light system comprises: a long life X-ray localizer light source; an optical concentrator, the light source being situated at a first focal spot, the optical concentrator being configured for concentrating X-ray localizer light from the light source to a second focal spot; and an opaque shield having an aperture therein situated proximate to the second focal spot and being of such a geometrical shape so as to maximize light throughput while meeting light field edge contrast requirements. In another light system, the optical concentrator comprises a reflector comprising a quasi-ellipsoidal portion within which the light source is situated, a cylindrical portion situated between the quasi-ellipsoidal portion and the shield for reflecting stray light, a back reflector portion situated proximate to the shield, and a centrally-mounted portion situated between the aperture and the light source for directing back-reflected light in the direction of the aperture.
摘要翻译： X射线定位器光系统包括：长寿命X射线定位器光源; 所述光源位于第一焦斑处，所述光集中器被配置为将来自所述光源的X射线定位器光聚焦到第二焦点; 以及不透明屏蔽，其中具有孔，其中位于第二焦点附近并且具有这种几何形状，以便在满足光场边缘对比度要求的同时最大化光通量。在另一个光系统中，光集中器包括反射器，该反射器包括准椭圆体部分，光源位于该准椭圆体部分内，位于准椭球部分和屏蔽之间的圆柱部分用于反射杂散光，屏蔽件和位于孔和光源之间的中心安装部分，用于沿着孔的方向引导反射反射光。

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