专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20090219069A1 Semiconductor integrated circuit device 有权
公开(公告)号：US20090219069A1
公开(公告)日：2009-09-03
申请号：US12453383
申请日：2009-05-08
申请人： Masao Shinozaki , Kenji Nishimoto , Takashi Akioka , Yutaka Kohara , Sanae Asari , Shusaku Miyata , Shinji Nakazato
发明人： Masao Shinozaki , Kenji Nishimoto , Takashi Akioka , Yutaka Kohara , Sanae Asari , Shusaku Miyata , Shinji Nakazato
IPC分类号： H03L7/06 , H01L23/498 , G06F1/04
CPC分类号： H01L23/5286 , H01L24/11 , H01L24/13 , H01L2224/0231 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05671 , H01L2224/13099 , H01L2224/131 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/13091 , H01L2924/14 , H01L2924/19043 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00014 , H01L2924/013 , H01L2924/01027
摘要： Circuit elements and wirings constituting a circuit, and first electrodes electrically connected to such a circuit are provided on one main surface of a semiconductor substrate. An organic insulating film is formed on the circuit except for openings on the surfaces of the first electrodes. First and second external connecting electrodes are provided on the organic insulating film. At least one conductive layer for electrically connecting the first and second external connecting electrodes and the first electrodes is placed on the organic insulating film.

2. 发明申请

US20080198148A1 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND DATA PROCESSOR SYSTEM 有权
标题翻译：半导体集成电路设备和数据处理器系统
公开(公告)号：US20080198148A1
公开(公告)日：2008-08-21
申请号：US12020418
申请日：2008-01-25
申请人： Shusaku MIYATA , Hirofumi Sonoyama
发明人： Shusaku MIYATA , Hirofumi Sonoyama
IPC分类号： G06F3/038
CPC分类号： G09G3/2096 , G09G5/39
摘要： To provide an input interface technique of display data which can contribute to improvement of reliability and high performance of a system in which a semiconductor integrated circuit device including a RAM and a display driver circuit is incorporated. A semiconductor integrated circuit device includes a first high-speed serial interface circuit which has one differential serial data channel and a second high-speed serial interface circuit which has a plurality of differential serial data channels, the first high-speed serial interface circuit performs interface with the outside for control information, and a control circuit performs an internal operation on the basis of the control information. Both of the high-speed serial interface circuits share a RAM for storage of display data information. Whether the data information to be supplied to the RAM is received by using the first high-speed serial interface circuit or the second high-speed serial interface circuit is determined by the control circuit in accordance with the control information that is input to the first high-speed serial interface circuit.
摘要翻译：提供可以有助于提高可靠性和高性能的显示数据的输入接口技术，其中并入包括RAM和显示驱动电路的半导体集成电路器件的系统。半导体集成电路器件包括具有一个差分串行数据通道的第一高速串行接口电路和具有多个差分串行数据通道的第二高速串行接口电路，第一高速串行接口电路执行接口与外部进行控制信息，并且控制电路基于控制信息执行内部操作。两个高速串行接口电路共享用于存储显示数据信息的RAM。通过使用第一高速串行接口电路或第二高速串行接口电路来接收提供给RAM的数据信息是否由控制电路根据输入到第一高速串行接口电路的控制信息来确定 - 串行接口电路。

3. 发明申请

US20060006480A1 Semiconductor integrated circuit device 有权
公开(公告)号：US20060006480A1
公开(公告)日：2006-01-12
申请号：US11202352
申请日：2005-08-12
申请人： Masao Shinozaki , Kenji Nishimoto , Takashi Akioka , Yutaka Kohara , Sanae Asari , Shusaku Miyata , Shinji Nakazato
发明人： Masao Shinozaki , Kenji Nishimoto , Takashi Akioka , Yutaka Kohara , Sanae Asari , Shusaku Miyata , Shinji Nakazato
IPC分类号： H01L29/76
CPC分类号： H01L23/5286 , H01L24/11 , H01L24/13 , H01L2224/0231 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05671 , H01L2224/13099 , H01L2224/131 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/13091 , H01L2924/14 , H01L2924/19043 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00014 , H01L2924/013 , H01L2924/01027
摘要： Circuit elements and wirings constituting a circuit, and first electrodes electrically connected to such a circuit are provided on one main surface of a semiconductor substrate. An organic insulating film is formed on the circuit except for openings on the surfaces of the first electrodes. First and second external connecting electrodes are provided on the organic insulating film. At least one conductive layer for electrically connecting the first and second external connecting electrodes and the first electrodes is placed on the organic insulating film.

4. 发明授权

US06963136B2 Semiconductor integrated circuit device 有权
标题翻译：半导体集成电路器件
公开(公告)号：US06963136B2
公开(公告)日：2005-11-08
申请号：US10362661
申请日：2001-12-17
申请人： Masao Shinozaki , Kenji Nishimoto , Takashi Akioka , Yutaka Kohara , Sanae Asari , Shusaku Miyata , Shinji Nakazato
发明人： Masao Shinozaki , Kenji Nishimoto , Takashi Akioka , Yutaka Kohara , Sanae Asari , Shusaku Miyata , Shinji Nakazato
IPC分类号： H01L21/60 , H01L23/485 , H01L23/528 , H01L29/40
CPC分类号： H01L23/5286 , H01L24/11 , H01L24/13 , H01L2224/0231 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05671 , H01L2224/13099 , H01L2224/131 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/13091 , H01L2924/14 , H01L2924/19043 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00014 , H01L2924/013 , H01L2924/01027
摘要： Circuit elements and wirings constituting a circuit, and first electrodes electrically connected to such a circuit are provided on one main surface of a semiconductor substrate. An organic insulating film is formed on the circuit except for openings on the surfaces of the first electrodes. First and second external connecting electrodes are provided on the organic insulating film. At least one conductive layer for electrically connecting the first and second external connecting electrodes and the first electrodes is placed on the organic insulating film.
摘要翻译：构成电路的电路元件和布线以及与这种电路电连接的第一电极设置在半导体衬底的一个主表面上。除了第一电极的表面上的开口之外，在电路上形成有机绝缘膜。第一和第二外部连接电极设置在有机绝缘膜上。用于将第一和第二外部连接电极和第一电极电连接的至少一个导电层被放置在有机绝缘膜上。

5. 发明授权

US08018447B2 Semiconductor integrated circuit device and data processor system 有权
标题翻译：半导体集成电路器件和数据处理器系统
公开(公告)号：US08018447B2
公开(公告)日：2011-09-13
申请号：US12020418
申请日：2008-01-25
申请人： Shusaku Miyata , Hirofumi Sonoyama
发明人： Shusaku Miyata , Hirofumi Sonoyama
IPC分类号： G09G5/00 , G09G3/36
CPC分类号： G09G3/2096 , G09G5/39
摘要： To provide an input interface technique of display data which can contribute to improvement of reliability and high performance of a system in which a semiconductor integrated circuit device including a RAM and a display driver circuit is incorporated. A semiconductor integrated circuit device includes a first high-speed serial interface circuit which has one differential serial data channel and a second high-speed serial interface circuit which has a plurality of differential serial data channels, the first high-speed serial interface circuit performs interface with the outside for control information, and a control circuit performs an internal operation on the basis of the control information. Both of the high-speed serial interface circuits share a RAM for storage of display data information. Whether the data information to be supplied to the RAM is received by using the first high-speed serial interface circuit or the second high-speed serial interface circuit is determined by the control circuit in accordance with the control information that is input to the first high-speed serial interface circuit.
摘要翻译：提供可以有助于提高可靠性和高性能的显示数据的输入接口技术，其中并入包括RAM和显示驱动电路的半导体集成电路器件的系统。半导体集成电路器件包括具有一个差分串行数据通道的第一高速串行接口电路和具有多个差分串行数据通道的第二高速串行接口电路，第一高速串行接口电路执行接口与外部进行控制信息，并且控制电路基于控制信息执行内部操作。两个高速串行接口电路共享用于存储显示数据信息的RAM。通过使用第一高速串行接口电路或第二高速串行接口电路来接收提供给RAM的数据信息是否由控制电路根据输入到第一高速串行接口电路的控制信息来确定 - 串行接口电路。

6. 发明授权

US07808107B2 Semiconductor integrated circuit device 有权
公开(公告)号：US07808107B2
公开(公告)日：2010-10-05
申请号：US12453383
申请日：2009-05-08
申请人： Masao Shinozaki , Kenji Nishimoto , Takashi Akioka , Yutaka Kohara , Sanae Asari , Shusaku Miyata , Shinji Nakazato
发明人： Masao Shinozaki , Kenji Nishimoto , Takashi Akioka , Yutaka Kohara , Sanae Asari , Shusaku Miyata , Shinji Nakazato
IPC分类号： H01L23/48
CPC分类号： H01L23/5286 , H01L24/11 , H01L24/13 , H01L2224/0231 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05671 , H01L2224/13099 , H01L2224/131 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/13091 , H01L2924/14 , H01L2924/19043 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00014 , H01L2924/013 , H01L2924/01027
摘要： Circuit elements and wirings constituting a circuit, and first electrodes electrically connected to such a circuit are provided on one main surface of a semiconductor substrate. An organic insulating film is formed on the circuit except for openings on the surfaces of the first electrodes. First and second external connecting electrodes are provided on the organic insulating film. At least one conductive layer for electrically connecting the first and second external connecting electrodes and the first electrodes is placed on the organic insulating film.

7. 发明授权

US08334860B2 Semiconductor integrated circuit device and data processor system 有权
标题翻译：半导体集成电路器件和数据处理器系统
公开(公告)号：US08334860B2
公开(公告)日：2012-12-18
申请号：US13223308
申请日：2011-08-31
申请人： Shusaku Miyata , Hirofumi Sonoyama
发明人： Shusaku Miyata , Hirofumi Sonoyama
IPC分类号： G09G5/00
CPC分类号： G09G3/2096 , G09G5/39
摘要： A semiconductor integrated circuit device includes a first high-speed serial interface circuit which has one differential serial data channel and a second high-speed serial interface circuit which has a plurality of differential serial data channels, the first high-speed serial interface circuit performs interface with the outside for control information, and a control circuit performs an internal operation on the basis of the control information. Both of the high-speed serial interface circuits share a RAM for storage of display data information. Whether the data information to be supplied to the RAM is received by using the first high-speed serial interface circuit or the second high-speed serial interface circuit is determined by the control circuit in accordance with the control information that is input to the first high-speed serial interface circuit.
摘要翻译：半导体集成电路器件包括具有一个差分串行数据通道的第一高速串行接口电路和具有多个差分串行数据通道的第二高速串行接口电路，第一高速串行接口电路执行接口与外部进行控制信息，并且控制电路基于控制信息执行内部操作。两个高速串行接口电路共享用于存储显示数据信息的RAM。通过使用第一高速串行接口电路或第二高速串行接口电路来接收提供给RAM的数据信息是否由控制电路根据输入到第一高速串行接口电路的控制信息来确定 - 串行接口电路。

8. 发明申请

US20100117081A1 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE FOR DRIVING DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：用于驱动显示装置的半导体集成电路装置及其制造方法
公开(公告)号：US20100117081A1
公开(公告)日：2010-05-13
申请号：US12575665
申请日：2009-10-08
申请人： Atsushi OBUCHI , Kazuhisa HIGUCHI , Kazuo OKADO , Kazuto MITSUI , Shusaku MIYATA
发明人： Atsushi OBUCHI , Kazuhisa HIGUCHI , Kazuo OKADO , Kazuto MITSUI , Shusaku MIYATA
IPC分类号： H01L33/00 , H01L23/498 , H01L23/58 , H01L21/66
CPC分类号： H01L23/48 , G01R31/318511 , G09G3/006 , G09G3/3648 , G09G2300/0426 , H01L24/13 , H01L24/14 , H01L24/17 , H01L25/16 , H01L2224/02166 , H01L2224/0345 , H01L2224/0361 , H01L2224/0401 , H01L2224/05027 , H01L2224/05124 , H01L2224/05166 , H01L2224/05553 , H01L2224/05554 , H01L2224/05572 , H01L2224/05664 , H01L2224/0603 , H01L2224/11462 , H01L2224/1147 , H01L2224/11912 , H01L2224/13013 , H01L2224/13016 , H01L2224/13027 , H01L2224/13144 , H01L2224/1403 , H01L2224/14051 , H01L2224/29299 , H01L2224/29399 , H01L2224/83851 , H01L2224/9211 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/1461 , H01L2924/15788 , H01L2924/19041 , H01L2224/81 , H01L2924/00 , H01L2224/05552
摘要： A semiconductor integrated circuit device for driving an LCD, COG chip packaging is performed. To achieve this, an elongate and relatively thick gold bump electrode is formed over an aluminum-based pad having a relatively small area. In a wafer probe test performed after formation of the gold bump electrode, a cantilever type probe needle having gold as a main component and having an almost perpendicularly bent tip portion is used. The diameter of this probe needle in the vicinity of its tip is usually almost the same as the width of the gold bump electrode. This makes it difficult to perform the wafer probe test stably. To counteract this, a plurality of bump electrode rows for outputting a display device drive signal are formed such that the width of inner bump electrodes is made greater than the width of outer bump electrodes.
摘要翻译：执行用于驱动LCD，COG芯片封装的半导体集成电路器件。为了实现这一点，在具有相对小的面积的铝基焊盘上形成细长且相对较厚的金凸块电极。在形成金凸块电极之后进行的晶片探针测试中，使用具有金作为主要成分并具有几乎垂直弯曲的尖端部分的悬臂型探针。该探头针在其尖端附近的直径通常与金凸块电极的宽度几乎相同。这使得难以稳定地执行晶片探针测试。为了抵消这一点，形成用于输出显示装置驱动信号的多个凸块电极列，使得内凸块电极的宽度大于外凸块电极的宽度。

9. 发明申请

US20120044218A1 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND DATA PROCESSOR SYSTEM 有权
标题翻译：半导体集成电路设备和数据处理器系统
公开(公告)号：US20120044218A1
公开(公告)日：2012-02-23
申请号：US13223308
申请日：2011-08-31
申请人： SHUSAKU MIYATA , Hirofumi Sonoyama
发明人： SHUSAKU MIYATA , Hirofumi Sonoyama
IPC分类号： G06F3/038
CPC分类号： G09G3/2096 , G09G5/39
摘要： A semiconductor integrated circuit device includes a first high-speed serial interface circuit which has one differential serial data channel and a second high-speed serial interface circuit which has a plurality of differential serial data channels, the first high-speed serial interface circuit performs interface with the outside for control information, and a control circuit performs an internal operation on the basis of the control information. Both of the high-speed serial interface circuits share a RAM for storage of display data information. Whether the data information to be supplied to the RAM is received by using the first high-speed serial interface circuit or the second high-speed serial interface circuit is determined by the control circuit in accordance with the control information that is input to the first high-speed serial interface circuit.
摘要翻译：半导体集成电路器件包括具有一个差分串行数据通道的第一高速串行接口电路和具有多个差分串行数据通道的第二高速串行接口电路，第一高速串行接口电路执行接口与外部进行控制信息，并且控制电路基于控制信息执行内部操作。两个高速串行接口电路共享用于存储显示数据信息的RAM。通过使用第一高速串行接口电路或第二高速串行接口电路来接收提供给RAM的数据信息是否由控制电路根据输入到第一高速串行接口电路的控制信息来确定 - 串行接口电路。

10. 发明授权

US07982314B2 Semiconductor integrated circuit device 有权
标题翻译：半导体集成电路器件
公开(公告)号：US07982314B2
公开(公告)日：2011-07-19
申请号：US12805261
申请日：2010-07-21
申请人： Masao Shinozaki , Kenji Nishimoto , Takashi Akioka , Yutaka Kohara , Sanae Asari , Shusaku Miyata , Shinji Nakazato
发明人： Masao Shinozaki , Kenji Nishimoto , Takashi Akioka , Yutaka Kohara , Sanae Asari , Shusaku Miyata , Shinji Nakazato
IPC分类号： H01L23/48
CPC分类号： H01L23/5286 , H01L24/11 , H01L24/13 , H01L2224/0231 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05671 , H01L2224/13099 , H01L2224/131 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/13091 , H01L2924/14 , H01L2924/19043 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00014 , H01L2924/013 , H01L2924/01027
摘要： Circuit elements and wirings constituting a circuit, and first electrodes electrically connected to such a circuit are provided on one main surface of a semiconductor substrate. An organic insulating film is formed on the circuit except for openings on the surfaces of the first electrodes. First and second external connecting electrodes are provided on the organic insulating film. At least one conductive layer for electrically connecting the first and second external connecting electrodes and the first electrodes is placed on the organic insulating film.
摘要翻译：构成电路的电路元件和布线以及与这种电路电连接的第一电极设置在半导体衬底的一个主表面上。除了第一电极的表面上的开口之外，在电路上形成有机绝缘膜。第一和第二外部连接电极设置在有机绝缘膜上。用于将第一和第二外部连接电极和第一电极电连接的至少一个导电层被放置在有机绝缘膜上。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式