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1. 发明授权

US5869888A Semiconductor device with lead structure on principal surface of chip 失效
标题翻译：芯片主表面具有导线结构的半导体器件
公开(公告)号：US5869888A
公开(公告)日：1999-02-09
申请号：US721339
申请日：1996-09-26
申请人： Kunihiro Tsubosaki , Michio Tanimoto , Kunihiko Nishi , Masahiro Ichitani , Shunji Koike , Kazunari Suzuki , Ryosuke Kimoto , Ichiro Anjoh , Taisei Jin , Akihiko Iwaya , Gen Murakami , Masamichi Ishihara , Junichi Arita
发明人： Kunihiro Tsubosaki , Michio Tanimoto , Kunihiko Nishi , Masahiro Ichitani , Shunji Koike , Kazunari Suzuki , Ryosuke Kimoto , Ichiro Anjoh , Taisei Jin , Akihiko Iwaya , Gen Murakami , Masamichi Ishihara , Junichi Arita
IPC分类号： H01L23/31 , H01L23/495 , H01L25/10 , H01L23/48
CPC分类号： H01L24/06 , H01L23/3107 , H01L23/3121 , H01L23/4951 , H01L24/05 , H01L24/49 , H01L25/105 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05624 , H01L2224/06136 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48253 , H01L2224/4826 , H01L2224/48465 , H01L2224/48624 , H01L2224/48724 , H01L2224/49113 , H01L2224/49171 , H01L2224/73215 , H01L2224/85424 , H01L2225/1029 , H01L24/45 , H01L24/48 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/1305 , H01L2924/181 , H01L2924/351 , Y10T29/49121
摘要： A semiconductor device having inner leads secured via insulating adhesive films to the principal surface of a semiconductor chip and electrically connected to the respective external terminals of the semiconductor chip. The semiconductor device that can be about the size of the chip is so configured that an outer lead is continuously extended from each inner lead up to the rear surface opposite to the principal surface of the semiconductor chip in order to hold the leads and an external device in conduction.
摘要翻译：一种半导体器件，其具有通过绝缘粘合剂膜固定到半导体芯片的主表面并与半导体芯片的各个外部端子电连接的内部引线。可以关于芯片尺寸的半导体器件被配置为使得外引线从每个内引线连续地延伸到与半导体芯片的主表面相对的后表面，以便保持引线和外部器件导通。

2. 发明授权

US4499612A Pocket for garments 失效
标题翻译：口袋为服装
公开(公告)号：US4499612A
公开(公告)日：1985-02-19
申请号：US482807
申请日：1983-04-07
申请人： Shunji Koike
发明人： Shunji Koike
IPC分类号： A41D27/20
CPC分类号： A41D27/20
摘要： A garment pocket construction comprising a normally open pocket into which objects are placed, an adjacent normally closed pocket, and a pouch connected to both pockets, the normally open pocket communicating with the pouch through a small opening through which small objects placed in the normally open pocket drop into the pouch, the normally closed pocket being open to the pouch for retrieval of the small objects dropped into the pouch. The normally closed pocket is provided with a closure which is opened to gain access to the pouch through said normally closed pocket.
摘要翻译：一种衣服口袋构造，其包括放置物体的常开口袋，相邻的常闭口袋以及连接到两个口袋的袋，该常开口袋通过小开口与小袋连通，通过该小开口将小物体放置在常开位置口袋下落到小袋中，常开的口袋向小袋开放，用于取出落入小袋的小物体。常闭口袋设置有封闭件，其被打开以通过所述常闭口袋进入袋子。

3. 发明授权

US5583375A Semiconductor device with lead structure within the planar area of the device 失效
标题翻译：具有引线结构的半导体器件在器件的平面区域内
公开(公告)号：US5583375A
公开(公告)日：1996-12-10
申请号：US990633
申请日：1992-12-14
申请人： Kunihiro Tsubosaki , Michio Tanimoto , Kunihiko Nishi , Masahiro Ichitani , Shunji Koike , Kazunari Suzuki , Ryosuke Kimoto , Ichiro Anjoh , Taisei Jin , Akihiko Iwaya , Gen Murakami , Masamichi Ishihara , Junichi Arita
发明人： Kunihiro Tsubosaki , Michio Tanimoto , Kunihiko Nishi , Masahiro Ichitani , Shunji Koike , Kazunari Suzuki , Ryosuke Kimoto , Ichiro Anjoh , Taisei Jin , Akihiko Iwaya , Gen Murakami , Masamichi Ishihara , Junichi Arita
IPC分类号： H01L23/31 , H01L23/495 , H01L25/10 , H01L23/48
CPC分类号： H01L24/06 , H01L23/3107 , H01L23/3121 , H01L23/4951 , H01L24/05 , H01L24/49 , H01L25/105 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05624 , H01L2224/06136 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48253 , H01L2224/4826 , H01L2224/48465 , H01L2224/48624 , H01L2224/48724 , H01L2224/49113 , H01L2224/49171 , H01L2224/73215 , H01L2224/85424 , H01L2225/1029 , H01L24/45 , H01L24/48 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/1305 , H01L2924/181 , H01L2924/351 , Y10T29/49121
摘要： A semiconductor device having inner leads secured via insulating adhesive films to the principal surface of a semiconductor chip and electrically connected to the respective external terminals of the semiconductor chip. The semiconductor device that can be about the size of the chip is so configured that an outer lead is continuously extended from each inner lead up to the rear surface opposite to the principal surface of the semiconductor chip in order to hold the leads and an external device in conduction.
摘要翻译：一种半导体器件，其具有通过绝缘粘合剂膜固定到半导体芯片的主表面并与半导体芯片的各个外部端子电连接的内部引线。可以关于芯片尺寸的半导体器件被配置为使得外引线从每个内引线连续地延伸到与半导体芯片的主表面相对的后表面，以便保持引线和外部器件导通。

4. 发明授权

US4853776A Fabric inspecting method and appartus for detecting flaws 失效
标题翻译：织物检查方法和检测缺陷的配件
公开(公告)号：US4853776A
公开(公告)日：1989-08-01
申请号：US176540
申请日：1988-04-01
申请人： Hisao Itaya , Toshihiko Okada , Morishige Hata , Shunji Koike , Takahiro Onishi
发明人： Hisao Itaya , Toshihiko Okada , Morishige Hata , Shunji Koike , Takahiro Onishi
IPC分类号： D06H3/08 , G01N21/898 , H04N7/18
CPC分类号： H04N7/18 , G01N21/8983 , H04N7/188 , G01N2021/8867 , G01N2021/8887 , G01N2201/102
摘要： An inspection method and apparatus for searching a fabric in strip form to find lump type and void type flaws on both faces of the fabric. Strobes and image pickup elements are arranged at opposite sides of the fabric in transportation. The strobes at one side of the fabric are caused to emit light, and the image pickup elements at the same side detect light reflected by the fabric while the image pickup elements at the other side detect light passing through the fabric.
摘要翻译：一种检索方法和装置，用于以织带形式搜索织物以在织物的两个面上发现块状和空隙型缺陷。色带和图像拾取元件布置在运输中织物的相对两侧。使织物一侧的闪光灯发光，同时侧面的图像拾取元件检测由织物反射的光，同时另一侧的图像拾取元件检测穿过织物的光。

5. 发明授权

US5714405A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US5714405A
公开(公告)日：1998-02-03
申请号：US721240
申请日：1996-09-26
申请人： Kunihiro Tsubosaki , Michio Tanimoto , Kunihiko Nishi , Masahiro Ichitani , Shunji Koike , Kazunari Suzuki , Ryosuke Kimoto , Ichiro Anjoh , Taisei Jin , Akihiko Iwaya , Gen Murakami , Masamichi Ishihara , Junichi Arita
发明人： Kunihiro Tsubosaki , Michio Tanimoto , Kunihiko Nishi , Masahiro Ichitani , Shunji Koike , Kazunari Suzuki , Ryosuke Kimoto , Ichiro Anjoh , Taisei Jin , Akihiko Iwaya , Gen Murakami , Masamichi Ishihara , Junichi Arita
IPC分类号： H01L23/31 , H01L23/495 , H01L25/10 , H01L21/60
CPC分类号： H01L24/06 , H01L23/3107 , H01L23/3121 , H01L23/4951 , H01L24/05 , H01L24/49 , H01L25/105 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05624 , H01L2224/06136 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48253 , H01L2224/4826 , H01L2224/48465 , H01L2224/48624 , H01L2224/48724 , H01L2224/49113 , H01L2224/49171 , H01L2224/73215 , H01L2224/85424 , H01L2225/1029 , H01L24/45 , H01L24/48 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/1305 , H01L2924/181 , H01L2924/351 , Y10T29/49121
摘要： A semiconductor device having inner leads secured via insulating adhesive films to the principal surface of a semiconductor chip and electrically connected to the respective external terminals of the semiconductor chip. The semiconductor device that can be about the size of the chip is so configured that an outer lead is continuously extended from each inner lead up to the rear surface opposite to the principal surface of the semiconductor chip in order to hold the leads and an external device in conduction.
摘要翻译：一种半导体器件，其具有通过绝缘粘合剂膜固定到半导体芯片的主表面并与半导体芯片的各个外部端子电连接的内部引线。可以关于芯片尺寸的半导体器件被配置为使得外引线从每个内引线连续地延伸到与半导体芯片的主表面相对的后表面，以便保持引线和外部器件导通。

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