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1. 发明申请

US20140357448A1 CONTROL DEVICE FOR VEHICULAR CONTINUOUSLY VARIABLE TRANSMISSION 有权
标题翻译：用于车辆连续可变传动的控制装置
公开(公告)号：US20140357448A1
公开(公告)日：2014-12-04
申请号：US14354434
申请日：2011-10-28
申请人： Shuhei Ishikawa , Motonori Kimura , Atsushi Ayabe , Shinya Toyoda
发明人： Shuhei Ishikawa , Motonori Kimura , Atsushi Ayabe , Shinya Toyoda
IPC分类号： B60W10/101 , B60W10/02
CPC分类号： B60W10/101 , B60W10/02 , B60W2510/0208 , B60W2520/105 , B60W2710/1005 , B60Y2300/18083 , F16H61/66259 , F16H2061/6605 , Y10T477/6203
摘要： A control device of a continuously variable transmission for a vehicle to which power of a drive force source is input through a transmission path connecting/disconnecting device changes a gear ratio of the continuously variable transmission to a lower vehicle speed side during vehicle deceleration when the transmission path connecting/disconnecting device is in a power transmission interrupted state of interrupting power transmission through a power transmission path between the drive force source and the continuously variable transmission, earlier as compared to when the transmission path connecting/disconnecting device is in a power transmittable state enabling the power transmission, and the control device changes a gear ratio of the continuously variable transmission earlier to the lower vehicle speed side when vehicle deceleration is larger, when the transmission path connecting/disconnecting device is in the power transmission interrupted state.
摘要翻译：用于通过传动路径连接/断开装置输入驱动力源的动力的车辆的无级变速器的控制装置在车辆减速期间将无级变速器的变速比改变为下车速侧，路径连接/断开装置在传动路径连接/断开装置处于电力可传输状态时处于较早的中断通过驱动力源和无级变速器之间的动力传递路径的动力传递的动力传递中断状态当传动路径连接/断开装置处于动力传递中断状态时，当车辆减速度较大时，控制装置能够将无级变速器的变速比改变为较低的车辆速度。

2. 发明授权

US07447032B2 Heat spreader module and method of manufacturing same 失效
标题翻译：散热器模块及其制造方法
公开(公告)号：US07447032B2
公开(公告)日：2008-11-04
申请号：US11515638
申请日：2006-09-05
申请人： Shuhei Ishikawa
发明人： Shuhei Ishikawa
IPC分类号： H05K7/20
CPC分类号： H01L23/3733 , H01L23/3735 , H01L2224/32225 , H01L2924/1305 , H01L2924/13055 , H01L2924/00
摘要： A heat spreader module is composed of a joined assembly, including a plate member, an insulating board disposed on the plate member, and a circuit board disposed on the insulating board. An IC chip is mounted on an upper surface of the joined assembly, or stated otherwise, on an upper surface of the circuit board, with a solder layer interposed therebetween. A heat sink is joined by a solder layer, for example, onto a lower surface of the joined assembly, or stated otherwise, onto a lower surface of the plate member, thereby making up a heat sink module.
摘要翻译：散热器模块由接合组件组成，包括板构件，设置在板构件上的绝缘板和设置在绝缘板上的电路板。将IC芯片安装在接合组件的上表面上，或者以其它方式安装在电路板的上表面上，其间插入有焊料层。散热器通过焊料层例如连接在接合组件的下表面上，或者以其他方式连接到板构件的下表面上，从而组成散热模块。

3. 发明申请

US20070058349A1 Heat spreader module and method of manufacturing same 失效
标题翻译：散热器模块及其制造方法
公开(公告)号：US20070058349A1
公开(公告)日：2007-03-15
申请号：US11515638
申请日：2006-09-05
申请人： Shuhei Ishikawa
发明人： Shuhei Ishikawa
IPC分类号： H05K7/20
CPC分类号： H01L23/3733 , H01L23/3735 , H01L2224/32225 , H01L2924/1305 , H01L2924/13055 , H01L2924/00
摘要： A heat spreader module is composed of a joined assembly, including a plate member, an insulating board disposed on the plate member, and a circuit board disposed on the insulating board. An IC chip is mounted on an upper surface of the joined assembly, or stated otherwise, on an upper surface of the circuit board, with a solder layer interposed therebetween. A heat sink is joined by a solder layer, for example, onto a lower surface of the joined assembly, or stated otherwise, onto a lower surface of the plate member, thereby making up a heat sink module.
摘要翻译：散热器模块由接合组件组成，包括板构件，设置在板构件上的绝缘板和设置在绝缘板上的电路板。将IC芯片安装在接合组件的上表面上，或者以其它方式安装在电路板的上表面上，其间插入有焊料层。散热器通过焊料层例如连接在接合组件的下表面上，或以其他方式连接到板构件的下表面上，从而组成散热模块。

4. 发明授权

US07069645B2 Method for producing a circuit board 有权
标题翻译：电路板的制造方法
公开(公告)号：US07069645B2
公开(公告)日：2006-07-04
申请号：US10107893
申请日：2002-03-27
申请人： Takahiro Ishikawa , Masahiro Kida , Shuhei Ishikawa , Nobuaki Nakayama
发明人： Takahiro Ishikawa , Masahiro Kida , Shuhei Ishikawa , Nobuaki Nakayama
IPC分类号： H05K3/36
CPC分类号： H05K3/04 , H01L2224/32225 , H05K1/0306 , H05K3/06 , H05K3/202 , H05K3/38 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/53174
摘要： A method for producing a circuit board having a metal circuit pattern on an insulating substrate is provided, including the steps of joining a metal plate onto a surface of the insulating substrate using a hard brazing member containing an active element and removing unnecessary conductive layer portions adjacent a metal circuit pattern of the metal plate to at least partially expose a portion of the surface of the insulating substrate.
摘要翻译：提供一种在绝缘基板上制造具有金属电路图案的电路板的方法，包括以下步骤：使用包含有源元件的硬钎焊构件将金属板接合到绝缘基板的表面上，并除去相邻的不必要的导电层部分金属板的金属电路图案，以至少部分地暴露绝缘基板的表面的一部分。

5. 发明授权

US06911728B2 Member for electronic circuit, method for manufacturing the member, and electronic part 失效
标题翻译：电子电路成员，制造该部件的方法和电子部件
公开(公告)号：US06911728B2
公开(公告)日：2005-06-28
申请号：US10258231
申请日：2001-12-19
申请人： Shuhei Ishikawa , Takahiro Ishikawa , Masahiro Kida , Ken Suzuki
发明人： Shuhei Ishikawa , Takahiro Ishikawa , Masahiro Kida , Ken Suzuki
IPC分类号： H01L23/373 , H05K1/03 , H05K3/00 , H05K3/38 , H01L23/10 , H01L23/34
CPC分类号： H01L23/3735 , H01L2224/325 , H01L2924/01019 , H01L2924/13055 , H01L2924/3511 , H05K1/0306 , H05K3/0058 , H05K3/38 , H01L2924/00
摘要： A member for use in an electronic circuit has a thermally conductive layer mounted on a heat sink. The thermally conductive layer comprises an insulating substrate, a first joint member joining the insulating substrate to the heat sink and containing an active element, a second joint member disposed on the insulating substrate, and an electrode disposed on the second joint member. The insulating substrate comprises an AlN layer or an Si3N4 layer. Each of the first and second joint members is made of a hard brazing material containing an active element. The heat sink is made of an SiC/Cu composite material or a C/Cu composite material.
摘要翻译：用于电子电路的部件具有安装在散热器上的导热层。导热层包括绝缘基板，将绝缘基板连接到散热器并且包含有源元件的第一接合构件，设置在绝缘基板上的第二接头构件和设置在第二接头构件上的电极。绝缘衬底包括AlN层或Si 3 N 4 N 4层。第一和第二接头构件中的每一个由包含有源元件的硬钎焊材料制成。散热片由SiC / Cu复合材料或C / Cu复合材料制成。

6. 发明授权

US06379781B1 Printed circuit board material and method of manufacturing board material and intermediate block body for board material 失效
标题翻译：印刷电路板材料和板材材料和中间块体的制造方法
公开(公告)号：US06379781B1
公开(公告)日：2002-04-30
申请号：US09446768
申请日：1999-12-23
申请人： Tomio Suzuki , Tadashi Otagiri , Satoru Kawai , Shuhei Ishikawa
发明人： Tomio Suzuki , Tadashi Otagiri , Satoru Kawai , Shuhei Ishikawa
IPC分类号： B32B300
CPC分类号： H05K3/4038 , H05K1/0287 , H05K1/0298 , H05K1/0373 , H05K3/4602 , H05K2201/0209 , H05K2201/0355 , H05K2201/09509 , H05K2201/09609 , H05K2201/10287 , H05K2203/0235 , Y10S428/901 , Y10T428/24917
摘要： A substrate material (10) for printed circuit, comprising a sheet-shaped composite material (11) composed of a plastic and a ceramic and conductive metal wires (12) fixed in the composite material (11) at given pitches, wherein the two surfaces of the substrate material (10) have electrical connection to each other via the metal wires (12). A process for producing a substrate material for printed circuit, which comprises stretching, in a mold, conductive metal wires at given pitches, then pouring, into the mold, a composite material composed of a plastic and a ceramic, curing the composite material, thereafter slicing the resulting material in a direction approximately perpendicular to the direction of the metal wires. Good electrical connection can be secured, and it is possible to prevent, during use, peeling between substrate material and conductive layers and between insulating material and metal wires. A printed circuit board of high density and excellent dimensional accuracy can be obtained.
摘要翻译：一种用于印刷电路的基板材料（10），包括由塑料和陶瓷构成的片状复合材料（11）和以给定的间距固定在复合材料（11）中的导电金属线（12），其中两个表面的基板材料（10）经由金属线（12）彼此电连接。一种印刷电路用基板材料的制造方法，其特征在于，在模具中以规定的间距拉伸导电金属丝，然后将由塑料和陶瓷构成的复合材料倒入模具中，然后固化复合材料将所得材料切割成大致垂直于金属丝方向的方向。可以确保良好的电连接，并且可以在使用期间防止在基板材料和导电层之间以及绝缘材料和金属线之间的剥离。可以获得高密度和优异的尺寸精度的印刷电路板。

7. 发明申请

US20090086435A1 HEAT SINK MODULE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：散热模块及其制造方法
公开(公告)号：US20090086435A1
公开(公告)日：2009-04-02
申请号：US12055659
申请日：2008-03-26
申请人： Ken Suzuki , Takahiro Ishikawa , Shuhei Ishikawa , Yumihiko Kuno
发明人： Ken Suzuki , Takahiro Ishikawa , Shuhei Ishikawa , Yumihiko Kuno
IPC分类号： H05K7/20 , F28F7/00 , B21D53/02
CPC分类号： H01L23/3735 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： There is provided a heat sink module having good thermal conductivity, excellent reliability without separation, and a space-saving property with a mechanism of sufficiently high heat radiation. The heat sink module includes: two or more heat conduction sections each having a heat sink layer formed from a heat sink material having a thermal expansion coefficient of 1×10−6/K to 8×10−6/K, an intermediate layer formed from Cu, a Cu alloy, Al, or an Al alloy, an electrically insulating layer, and an electrode layer formed from said metals, being joined in layers by a first brazing material; and a heat-radiating cooling section 7 having two or more seat surfaces being at least formed from said metals and the two or more heat conduction sections are joined by a second brazing material to seat surfaces with the heat sink layers of heat conduction sections disposed on seat surfaces.
摘要翻译：提供了具有良好的导热性，优异的可靠性而不分离的散热器模块，以及具有足够高的散热的机构的节省空间的特性。散热器模块包括：两个或更多个导热部分，每个热传导部分具有由热膨胀系数为1×10 -6 / K至8×10 -6 / K的散热材料形成的散热层，由Cu形成的中间层， Cu合金，Al或Al合金，电绝缘层和由所述金属形成的电极层，通过第一钎焊材料层合; 并且具有至少由所述金属形成的两个或更多个座面的散热冷却部7和两个以上的导热部通过第二钎焊材料接合到座面，其中热传导部的散热层设置在座面。

8. 发明申请

US20080272180A1 METHOD OF MANUFACTURING HEAT SPREADER MODULE 审中-公开
标题翻译：制造散热器模块的方法
公开(公告)号：US20080272180A1
公开(公告)日：2008-11-06
申请号：US12171499
申请日：2008-07-11
申请人： Takahiro ISHIKAWA , Masayuki SHINKAI , Makoto MIYAHARA , Shuhei ISHIKAWA , Nobuaki NAKAYAMA , Seji YASUI
发明人： Takahiro ISHIKAWA , Masayuki SHINKAI , Makoto MIYAHARA , Shuhei ISHIKAWA , Nobuaki NAKAYAMA , Seji YASUI
IPC分类号： B23K1/00
CPC分类号： C04B37/026 , B23K35/3006 , B32B2311/12 , C04B35/08 , C04B35/52 , C04B35/522 , C04B35/565 , C04B2235/407 , C04B2235/80 , C04B2235/96 , C04B2235/9607 , C04B2237/125 , C04B2237/34 , C04B2237/343 , C04B2237/36 , C04B2237/363 , C04B2237/365 , C04B2237/368 , C04B2237/407 , H01L21/4882 , H01L23/3735 , H01L2924/0002 , Y10T428/12493 , H01L2924/00
摘要： A heat spreader module has a pedestal, a heat spreader member joined to the pedestal by a first active hard brazing material, an intermediate layer joined to the heat spreader member by a second active hard brazing material, an insulating board joined to the intermediate layer by a third active hard brazing material, and a circuit board joined to the insulating board by a fourth active hard brazing material. The first through fourth active hard brazing materials are supplied such that the active hard brazing materials have a thickness ranging from 3 to 20 μm when the components of the heat spreader module are joined together under pressure, and contain an active element in an amount ranging from 400 to 1000 μg/cm2.
摘要翻译：散热器模块具有基座，通过第一主动硬钎焊材料接合到基座的散热构件，通过第二主动硬钎焊材料连接到散热构件的中间层，通过第二主动硬钎焊材料接合到中间层的绝缘板第三活性硬钎料，以及通过第四活性硬钎焊材料与绝缘板接合的电路板。供给第一至第四活性硬钎焊材料，使得当散热器组件的组件在压力下接合在一起时，活性硬钎焊材料的厚度范围为3-20μm，并且含有活性元素的量为 400至1000杯/厘米2。

9. 发明授权

US07161807B2 Heat spreader module 有权
标题翻译：散热器模块
公开(公告)号：US07161807B2
公开(公告)日：2007-01-09
申请号：US10783892
申请日：2004-02-20
申请人： Takahiro Ishikawa , Masayuki Shinkai , Makoto Miyahara , Shuhei Ishikawa , Nobuaki Nakayama , Kazuyoshi Inoue
发明人： Takahiro Ishikawa , Masayuki Shinkai , Makoto Miyahara , Shuhei Ishikawa , Nobuaki Nakayama , Kazuyoshi Inoue
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H01L23/3736 , H01L2924/0002 , H01L2924/00
摘要： A heat spreader module includes a base, a heat spreader member arranged on the base, a thermal conductive layer arranged on the heat spreader member, a first joining member interposed between the base and the heat spreader member, and a second joining member interposed between the heat spreader member and the thermal conductive layer. The base comprises a copper alloy which has a proof stress of not less than 45 MPa and a coefficient of thermal conductivity of not less than 270 W/mK after performing a heat treatment between 600° and 900° C. for 10 minutes.
摘要翻译：散热器模块包括基座，布置在基座上的散热构件，布置在散热构件上的导热层，插入在基座和散热构件之间的第一接合构件，以及插在其间的第二接合构件散热构件和导热层。该基体包括铜合金，其在600℃和900℃之间进行10分钟的热处理后，具有不低于45MPa的预定应力和不小于270W / mK的导热系数。

10. 发明授权

US5824167A Beryllium-copper alloy excellent in strength, workability and heat resistance and method for producing the same 失效
标题翻译：强度，加工性，耐热性优异的铍铜合金及其制造方法
公开(公告)号：US5824167A
公开(公告)日：1998-10-20
申请号：US513887
申请日：1995-10-30
申请人： Shuhei Ishikawa , Hiroyuki Hiramitsu , Yoshihisa Ishiguro , Kazumasa Yashiro
发明人： Shuhei Ishikawa , Hiroyuki Hiramitsu , Yoshihisa Ishiguro , Kazumasa Yashiro
IPC分类号： C22C9/00 , C22C9/01 , C22C9/06 , C22F1/08
CPC分类号： C22C9/01 , C22C9/00 , C22C9/06 , C22F1/08
摘要： In the present invention, in order to minimize the amount of deformation due to heat treatment, the content of Be is lowered than the conventional ones, and the decrease in strength accompanied by decreasing Be, is compensated by dissolving strengthening of Si and Al, and precipitation strengthening of intermetallic compounds NiBe and CoBe. Further, by precipitating such intermetallic compounds, workability and heat resistance are also improved simultaneously and aging treatment conditions are also made flexible. Thus, according to the present invention, a beryllium-copper alloy having excellent strength, workability and heat resistance, can be provided economically, and particularly as for aging materials, users' burden can be markedly decreased.
摘要翻译： PCT No.PCT / JP94 / 02253 Sec。 371 1995年10月30日第 102（e）日期1995年10月30日PCT 1994年12月27日PCT公布。 WO95 / 18873 PCT出版物日期1995年7月13日在本发明中，为了使热处理引起的变形量最小化，Be的含量比常规的低，并且随着Be的降低而降低，通过溶解强化 Si和Al，以及金属间化合物NiBe和CoBe的析出强化。此外，通过沉淀这种金属间化合物，可以同时提高加工性和耐热性，并且还可以使老化处理条件变得柔软。因此，根据本发明，可以经济地提供强度，加工性，耐热性优异的铍铜合金，特别是对于老化材料，使用者的负担显着降低。

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