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1. 发明申请

US20060191707A1 Circuit board and method for producing the same 审中-公开
标题翻译：电路板及其制造方法
公开(公告)号：US20060191707A1
公开(公告)日：2006-08-31
申请号：US11409880
申请日：2006-04-24
申请人： Takahiro Ishikawa , Masahiro Kida , Shuhei Ishikawa , Nobuaki Nakayama
发明人： Takahiro Ishikawa , Masahiro Kida , Shuhei Ishikawa , Nobuaki Nakayama
IPC分类号： H05K1/00 , H05K3/10
CPC分类号： H05K3/04 , H01L2224/32225 , H01L2924/13055 , H05K1/0306 , H05K3/06 , H05K3/202 , H05K3/38 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/53174 , H01L2924/00
摘要： A method for producing a circuit board having a metal circuit pattern on an insulating substrate is provided, including the steps of joining a metal plate onto a surface of the insulating substrate using a hard brazing member containing an active element and removing unnecessary conductive layer portions adjacent a metal circuit pattern of the metal plate to at least partially expose a portion of the surface of the insulating substrate.
摘要翻译：提供一种在绝缘基板上制造具有金属电路图案的电路板的方法，包括以下步骤：使用包含有源元件的硬钎焊构件将金属板接合到绝缘基板的表面上，并除去相邻的不必要的导电层部分金属板的金属电路图案，以至少部分地暴露绝缘基板的表面的一部分。

2. 发明授权

US07069645B2 Method for producing a circuit board 有权
标题翻译：电路板的制造方法
公开(公告)号：US07069645B2
公开(公告)日：2006-07-04
申请号：US10107893
申请日：2002-03-27
申请人： Takahiro Ishikawa , Masahiro Kida , Shuhei Ishikawa , Nobuaki Nakayama
发明人： Takahiro Ishikawa , Masahiro Kida , Shuhei Ishikawa , Nobuaki Nakayama
IPC分类号： H05K3/36
CPC分类号： H05K3/04 , H01L2224/32225 , H05K1/0306 , H05K3/06 , H05K3/202 , H05K3/38 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/53174
摘要： A method for producing a circuit board having a metal circuit pattern on an insulating substrate is provided, including the steps of joining a metal plate onto a surface of the insulating substrate using a hard brazing member containing an active element and removing unnecessary conductive layer portions adjacent a metal circuit pattern of the metal plate to at least partially expose a portion of the surface of the insulating substrate.
摘要翻译：提供一种在绝缘基板上制造具有金属电路图案的电路板的方法，包括以下步骤：使用包含有源元件的硬钎焊构件将金属板接合到绝缘基板的表面上，并除去相邻的不必要的导电层部分金属板的金属电路图案，以至少部分地暴露绝缘基板的表面的一部分。

3. 发明授权

US07433187B2 Heat spreader module 有权
标题翻译：散热器模块
公开(公告)号：US07433187B2
公开(公告)日：2008-10-07
申请号：US10807674
申请日：2004-03-24
申请人： Takahiro Ishikawa , Masayuki Shinkai , Makoto Miyahara , Shuhei Ishikawa , Nobuaki Nakayama , Seiji Yasui
发明人： Takahiro Ishikawa , Masayuki Shinkai , Makoto Miyahara , Shuhei Ishikawa , Nobuaki Nakayama , Seiji Yasui
IPC分类号： H05K7/20
CPC分类号： C04B37/026 , B23K35/3006 , B32B2311/12 , C04B35/08 , C04B35/52 , C04B35/522 , C04B35/565 , C04B2235/407 , C04B2235/80 , C04B2235/96 , C04B2235/9607 , C04B2237/125 , C04B2237/34 , C04B2237/343 , C04B2237/36 , C04B2237/363 , C04B2237/365 , C04B2237/368 , C04B2237/407 , H01L21/4882 , H01L23/3735 , H01L2924/0002 , Y10T428/12493 , H01L2924/00
摘要： A heat spreader module has a pedestal, a heat spreader member joined to the pedestal by a first active hard brazing material, an intermediate layer joined to the heat spreader member by a second active hard brazing material, an insulating board joined to the intermediate layer by a third active hard brazing material, and a circuit board joined to the insulating board by a fourth active hard brazing material. The first through fourth active hard brazing materials are supplied such that the active hard brazing materials have a thickness ranging from 3 to 20 μm when the components of the heat spreader module are joined together under pressure, and contain an active element in an amount ranging from 400 to 1000 μg/cm2.
摘要翻译：散热器模块具有基座，通过第一主动硬钎焊材料接合到基座的散热构件，通过第二主动硬钎焊材料连接到散热构件的中间层，通过第二主动硬钎焊材料接合到中间层的绝缘板第三活性硬钎料，以及通过第四活性硬钎焊材料与绝缘板接合的电路板。供给第一至第四活性硬钎焊材料，使得当散热器组件的组件在压力下接合在一起时，活性硬钎焊材料的厚度范围为3-20μm，并且含有活性元素的量为 400至1000杯/厘米2。

4. 发明授权

US07161807B2 Heat spreader module 有权
标题翻译：散热器模块
公开(公告)号：US07161807B2
公开(公告)日：2007-01-09
申请号：US10783892
申请日：2004-02-20
申请人： Takahiro Ishikawa , Masayuki Shinkai , Makoto Miyahara , Shuhei Ishikawa , Nobuaki Nakayama , Kazuyoshi Inoue
发明人： Takahiro Ishikawa , Masayuki Shinkai , Makoto Miyahara , Shuhei Ishikawa , Nobuaki Nakayama , Kazuyoshi Inoue
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H01L23/3736 , H01L2924/0002 , H01L2924/00
摘要： A heat spreader module includes a base, a heat spreader member arranged on the base, a thermal conductive layer arranged on the heat spreader member, a first joining member interposed between the base and the heat spreader member, and a second joining member interposed between the heat spreader member and the thermal conductive layer. The base comprises a copper alloy which has a proof stress of not less than 45 MPa and a coefficient of thermal conductivity of not less than 270 W/mK after performing a heat treatment between 600° and 900° C. for 10 minutes.
摘要翻译：散热器模块包括基座，布置在基座上的散热构件，布置在散热构件上的导热层，插入在基座和散热构件之间的第一接合构件，以及插在其间的第二接合构件散热构件和导热层。该基体包括铜合金，其在600℃和900℃之间进行10分钟的热处理后，具有不低于45MPa的预定应力和不小于270W / mK的导热系数。

5. 发明授权

US06911728B2 Member for electronic circuit, method for manufacturing the member, and electronic part 失效
标题翻译：电子电路成员，制造该部件的方法和电子部件
公开(公告)号：US06911728B2
公开(公告)日：2005-06-28
申请号：US10258231
申请日：2001-12-19
申请人： Shuhei Ishikawa , Takahiro Ishikawa , Masahiro Kida , Ken Suzuki
发明人： Shuhei Ishikawa , Takahiro Ishikawa , Masahiro Kida , Ken Suzuki
IPC分类号： H01L23/373 , H05K1/03 , H05K3/00 , H05K3/38 , H01L23/10 , H01L23/34
CPC分类号： H01L23/3735 , H01L2224/325 , H01L2924/01019 , H01L2924/13055 , H01L2924/3511 , H05K1/0306 , H05K3/0058 , H05K3/38 , H01L2924/00
摘要： A member for use in an electronic circuit has a thermally conductive layer mounted on a heat sink. The thermally conductive layer comprises an insulating substrate, a first joint member joining the insulating substrate to the heat sink and containing an active element, a second joint member disposed on the insulating substrate, and an electrode disposed on the second joint member. The insulating substrate comprises an AlN layer or an Si3N4 layer. Each of the first and second joint members is made of a hard brazing material containing an active element. The heat sink is made of an SiC/Cu composite material or a C/Cu composite material.
摘要翻译：用于电子电路的部件具有安装在散热器上的导热层。导热层包括绝缘基板，将绝缘基板连接到散热器并且包含有源元件的第一接合构件，设置在绝缘基板上的第二接头构件和设置在第二接头构件上的电极。绝缘衬底包括AlN层或Si 3 N 4 N 4层。第一和第二接头构件中的每一个由包含有源元件的硬钎焊材料制成。散热片由SiC / Cu复合材料或C / Cu复合材料制成。

6. 发明申请

US20090086435A1 HEAT SINK MODULE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：散热模块及其制造方法
公开(公告)号：US20090086435A1
公开(公告)日：2009-04-02
申请号：US12055659
申请日：2008-03-26
申请人： Ken Suzuki , Takahiro Ishikawa , Shuhei Ishikawa , Yumihiko Kuno
发明人： Ken Suzuki , Takahiro Ishikawa , Shuhei Ishikawa , Yumihiko Kuno
IPC分类号： H05K7/20 , F28F7/00 , B21D53/02
CPC分类号： H01L23/3735 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： There is provided a heat sink module having good thermal conductivity, excellent reliability without separation, and a space-saving property with a mechanism of sufficiently high heat radiation. The heat sink module includes: two or more heat conduction sections each having a heat sink layer formed from a heat sink material having a thermal expansion coefficient of 1×10−6/K to 8×10−6/K, an intermediate layer formed from Cu, a Cu alloy, Al, or an Al alloy, an electrically insulating layer, and an electrode layer formed from said metals, being joined in layers by a first brazing material; and a heat-radiating cooling section 7 having two or more seat surfaces being at least formed from said metals and the two or more heat conduction sections are joined by a second brazing material to seat surfaces with the heat sink layers of heat conduction sections disposed on seat surfaces.
摘要翻译：提供了具有良好的导热性，优异的可靠性而不分离的散热器模块，以及具有足够高的散热的机构的节省空间的特性。散热器模块包括：两个或更多个导热部分，每个热传导部分具有由热膨胀系数为1×10 -6 / K至8×10 -6 / K的散热材料形成的散热层，由Cu形成的中间层， Cu合金，Al或Al合金，电绝缘层和由所述金属形成的电极层，通过第一钎焊材料层合; 并且具有至少由所述金属形成的两个或更多个座面的散热冷却部7和两个以上的导热部通过第二钎焊材料接合到座面，其中热传导部的散热层设置在座面。

7. 发明授权

US06857556B2 Method for bonding different members and composite members bonded by the method 有权
标题翻译：通过该方法粘接不同构件和复合构件的方法
公开(公告)号：US06857556B2
公开(公告)日：2005-02-22
申请号：US10033797
申请日：2002-01-03
申请人： Takahiro Ishikawa , Masayuki Shinkai , Masahiro Kida
发明人： Takahiro Ishikawa , Masayuki Shinkai , Masahiro Kida
IPC分类号： B23K1/19 , B23K1/20 , B23K31/02 , B23K35/00 , B23K35/02 , B23K35/28 , B23K35/30 , B23K35/32 , B23K103/18 , C04B37/02
CPC分类号： B23K35/286 , B23K35/005 , B23K35/0222 , B23K35/0244 , B23K35/30 , B23K35/327 , B23K2103/02 , B23K2103/08 , B23K2103/18 , B23K2103/52 , B32B18/00 , B32B2311/22 , C04B35/62842 , C04B37/025 , C04B37/026 , C04B2235/3217 , C04B2235/401 , C04B2235/402 , C04B2235/404 , C04B2235/428 , C04B2235/5436 , C04B2235/80 , C04B2235/96 , C04B2237/064 , C04B2237/12 , C04B2237/121 , C04B2237/125 , C04B2237/366 , C04B2237/368 , C04B2237/403 , C04B2237/405 , C04B2237/706 , Y10T428/12535 , Y10T428/12611 , Y10T428/2991
摘要： A bonding method for bonding one member having a dented portion and a second different member having an engaging protruding portion with an adhesive composition having a controlled coefficient of expansion and the resultant composite product. Three alternative techniques are used to first apply a hard solder in contact with a layer of fine particles between the two members. Then a final heating is applied under pressure to melt the hard solder. The resulting bonding layer bonds the two different fitting members.
摘要翻译：一种接合方法，用于将具有凹陷部分的一个部件和具有接合突出部分的第二不同部件与具有受控膨胀系数的粘合剂组合物和所得的复合产品接合。使用三种替代技术来首先将硬焊料与两个构件之间的细颗粒层接触。然后在压力下施加最终加热以熔化硬焊料。所形成的粘合层将两个不同的配件构件结合。

8. 发明授权

US06830724B2 Method of producing ceramic matrix composite, and ceramic matrix composite produced by the method for production 失效
标题翻译：生产陶瓷基复合材料的方法，以及生产方法生产的陶瓷基复合材料
公开(公告)号：US06830724B2
公开(公告)日：2004-12-14
申请号：US10219505
申请日：2002-08-15
申请人： Makoto Kobashi , Naoyuki Kanetake , Takahiro Ishikawa , Masahiro Kida
发明人： Makoto Kobashi , Naoyuki Kanetake , Takahiro Ishikawa , Masahiro Kida
IPC分类号： B22F700
CPC分类号： C04B35/78 , C04B35/581 , Y10T428/12007
摘要： A method of producing a ceramic matrix composite is provided, which production method reduces metal residual percentage within matrix with little energy consumption, without requiring special external heating means and special equipment while it is industrially simple and at a low price. It is a method of producing a ceramic matrix composite having the steps of filling mixed powder obtained by mixing metal powder and boron nitride powder into a predetermined container to form a green compact having a porous structure, and infiltrating the above described green compact with molten Al to form a composite material containing metal boride and having aluminum nitride as a matrix. The green compact is formed by compressing the mixed powder whose mixing ratio of metal powder to boron nitride powder is 1:1.8 to 1:2.2 (molar ratio) so that porosity of the green compact is 34 to 42%.
摘要翻译：提供了一种陶瓷基复合材料的制造方法，该制造方法在能量消耗少的基质内减少金属残留量，而无需特殊的外部加热装置和专用设备，而且在工业上简单且价格低廉。一种陶瓷基复合材料的制造方法，其特征在于，具有将金属粉末和氮化硼粉末混合而得到的混合粉末填充到规定的容器中，形成具有多孔结构的生坯的步骤，将熔融的Al 以形成含有金属硼化物并具有氮化铝作为基质的复合材料。通过压缩金属粉末与氮化硼粉末的混合比为1：1.8〜1：2.2（摩尔比）的混合粉末，使压坯的孔隙率为34〜42％，形成生坯。

9. 发明授权

US07758970B2 Different materials bonded member and production method thereof 有权
标题翻译：不同材料结合件及其制备方法
公开(公告)号：US07758970B2
公开(公告)日：2010-07-20
申请号：US12104547
申请日：2008-04-17
申请人： Masayuki Shinkai , Takahiro Ishikawa , Masahiro Kida
发明人： Masayuki Shinkai , Takahiro Ishikawa , Masahiro Kida
IPC分类号： B32B15/04
CPC分类号： C04B37/026 , B32B2311/22 , C04B37/023 , C04B2235/6567 , C04B2235/658 , C04B2235/6581 , C04B2235/6585 , C04B2235/96 , C04B2237/08 , C04B2237/122 , C04B2237/123 , C04B2237/125 , C04B2237/127 , C04B2237/34 , C04B2237/343 , C04B2237/348 , C04B2237/365 , C04B2237/366 , C04B2237/368 , C04B2237/40 , C04B2237/403 , C04B2237/405 , C04B2237/406 , C04B2237/408 , C04B2237/55 , C04B2237/60 , C04B2237/68 , C04B2237/706 , C04B2237/708 , C04B2237/72 , Y10T428/12535 , Y10T428/12542 , Y10T428/12576 , Y10T428/12583
摘要： A different materials bonded member includes a ceramic base material and a metallic member which are bonded together through an Au solder material. The solder material is disposed on a bonding surface of the ceramic base through a given active metal layer or a given metalized layer and the solder material is heated and melted to form a pre-coat layer adhering to the bonding surface, the metallic member is disposed on a surface of the pre-coat layer through a barrier layer having a given function. A bonded part is formed by solidifying the pre-coat layer after it has been heated and melted under given temperature conditions to bond the ceramic base and the metallic member to one another.
摘要翻译：不同的材料接合构件包括通过Au焊料材料结合在一起的陶瓷基底材料和金属构件。焊料通过给定的活性金属层或给定的金属化层设置在陶瓷基体的接合表面上，并且焊料材料被加热熔融以形成附着在接合表面上的预涂层，金属构件被布置通过具有给定功能的阻挡层在预涂层的表面上。通过在预定涂层被加热并在给定的温度条件下熔化之后将预涂层固化来形成接合部分，以将陶瓷基体和金属部件彼此粘结。

10. 发明申请

US20080230585A1 DIFFERENT MATERIALS BONDED MEMBER AND PRODUCTION METHOD THEREOF 有权
标题翻译：不同材料的粘合构件及其生产方法
公开(公告)号：US20080230585A1
公开(公告)日：2008-09-25
申请号：US12104547
申请日：2008-04-17
申请人： Masayuki Shinkai , Takahiro Ishikawa , Masahiro Kida
发明人： Masayuki Shinkai , Takahiro Ishikawa , Masahiro Kida
IPC分类号： B23K31/00 , B21D39/00
CPC分类号： C04B37/026 , B32B2311/22 , C04B37/023 , C04B2235/6567 , C04B2235/658 , C04B2235/6581 , C04B2235/6585 , C04B2235/96 , C04B2237/08 , C04B2237/122 , C04B2237/123 , C04B2237/125 , C04B2237/127 , C04B2237/34 , C04B2237/343 , C04B2237/348 , C04B2237/365 , C04B2237/366 , C04B2237/368 , C04B2237/40 , C04B2237/403 , C04B2237/405 , C04B2237/406 , C04B2237/408 , C04B2237/55 , C04B2237/60 , C04B2237/68 , C04B2237/706 , C04B2237/708 , C04B2237/72 , Y10T428/12535 , Y10T428/12542 , Y10T428/12576 , Y10T428/12583
摘要： A different materials bonded member includes a ceramic base material and a metallic member which are bonded together through an Au solder material. The solder material is disposed on a bonding surface of the ceramic base through a given active metal layer or a given metalized layer and the solder material is heated and melted to form a pre-coat layer adhering to the bonding surface, the metallic member is disposed on a surface of the pre-coat layer through a barrier layer having a given function. A bonded part is formed by solidifying the pre-coat layer after it has been heated and melted under given temperature conditions to bond the ceramic base and the metallic member to one another.
摘要翻译：不同的材料接合构件包括通过Au焊料材料结合在一起的陶瓷基底材料和金属构件。焊料通过给定的活性金属层或给定的金属化层设置在陶瓷基体的接合表面上，并且焊料材料被加热熔融以形成附着在接合表面上的预涂层，金属构件被布置通过具有给定功能的阻挡层在预涂层的表面上。通过在预定涂层被加热并在给定的温度条件下熔化之后将预涂层固化来形成接合部分，以将陶瓷基体和金属部件彼此粘结。

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