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1. 发明授权

US09329328B2 Light guide plate and backlight module using the same 有权
标题翻译：导光板和背光模组使用相同
公开(公告)号：US09329328B2
公开(公告)日：2016-05-03
申请号：US13873251
申请日：2013-04-30
申请人： Shang-Wei Chen , Min-Yi Hsu , Chao-Hung Weng , Wen-Hsin Lo , Han-Wen Tsai , Ming-Feng Kuo , Ming-Dah Liu
发明人： Shang-Wei Chen , Min-Yi Hsu , Chao-Hung Weng , Wen-Hsin Lo , Han-Wen Tsai , Ming-Feng Kuo , Ming-Dah Liu
IPC分类号： G02B6/00 , F21V8/00
CPC分类号： G02B6/0053 , G02B6/0015 , G02B6/0016 , G02B6/0036 , G02B6/0051
摘要： A backlight module includes a light guide plate (LGP), a light source, and at least one prism sheet. The LGP includes a light emitting surface, a bottom surface, a light incident surface, and a plurality of first microstructures on the bottom surface. Each of the first microstructure is a recessed structure and includes a first surface and a second surface. An included angle between the first surface and the bottom surface ranges from 15 degrees to 27 degrees. An included angle between the second surface and the bottom surface ranges from 50 degrees to 90 degrees. The light source provides a light beam, and an included angle between a light emitting direction of the light beam emitted from the light emitting surface of the LGP and a normal direction of the light emitting surface is greater than 30 degrees. The prism sheet is disposed above the light emitting surface.
摘要翻译：背光模块包括导光板（LGP），光源和至少一个棱镜片。 LGP包括底表面上的发光面，底面，光入射面和多个第一微结构。第一微结构中的每一个是凹陷结构，并且包括第一表面和第二表面。第一表面和底表面之间的夹角为15度至27度。第二表面和底面之间的夹角为50度至90度。光源提供光束，并且从LGP的发光面发射的光束的发光方向与发光面的法线方向之间的夹角大于30度。棱镜片设置在发光面的上方。

2. 发明授权

US07863729B2 Circuit board structure embedded with semiconductor chips 有权
标题翻译：电路板结构嵌入半导体芯片
公开(公告)号：US07863729B2
公开(公告)日：2011-01-04
申请号：US12427668
申请日：2009-04-21
申请人： Shih Ping Hsu , Chung Cheng Lien , Shang Wei Chen
发明人： Shih Ping Hsu , Chung Cheng Lien , Shang Wei Chen
IPC分类号： H01L23/12 , H01L23/053
CPC分类号： H01L23/5389 , H01L23/13 , H01L23/5384 , H01L24/19 , H01L24/24 , H01L2224/04105 , H01L2224/20 , H01L2224/24227 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/15153 , H01L2924/15165 , H01L2924/18162 , H01L2924/351 , H05K1/185 , H05K3/4602 , H05K2201/09509 , H05K2201/09518 , H05K2201/09809 , H05K2201/10674 , H01L2924/00
摘要： A circuit board structure embedded with semiconductor chips is proposed. A semiconductor chip is received in a cavity of a supporting board. A dielectric layer and a circuit layer are formed on the supporting board and the semiconductor chip. A plurality of hollow conductive vias are formed in the dielectric layer for electrically connecting the circuit layer to the semiconductor chip. By providing the hollow conductive vias of present invention, the separating results of different coefficients of expansion and thermal stress are prevented, and thus electrical function of products is ensured.
摘要翻译：提出了一种嵌入半导体芯片的电路板结构。半导体芯片被容纳在支撑板的空腔中。在支撑板和半导体芯片上形成电介质层和电路层。在电介质层中形成多个中空导电通孔，用于将电路层与半导体芯片电连接。通过提供本发明的中空导电通孔，可以防止不同膨胀系数和热应力的分离结果，从而确保产品的电功能。

3. 发明申请

US20070181995A1 Circuit board structure embedded with semiconductor chips 审中-公开
标题翻译：电路板结构嵌入半导体芯片
公开(公告)号：US20070181995A1
公开(公告)日：2007-08-09
申请号：US11544199
申请日：2006-10-05
申请人： Shih Ping Hsu , Chung Cheng Lien , Shang Wei Chen
发明人： Shih Ping Hsu , Chung Cheng Lien , Shang Wei Chen
IPC分类号： H01L23/12
CPC分类号： H01L23/5389 , H01L23/13 , H01L23/5384 , H01L24/19 , H01L24/24 , H01L2224/04105 , H01L2224/20 , H01L2224/24227 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/15153 , H01L2924/15165 , H01L2924/18162 , H01L2924/351 , H05K1/185 , H05K3/4602 , H05K2201/09509 , H05K2201/09518 , H05K2201/09809 , H05K2201/10674 , H01L2924/00
摘要： A circuit board structure embedded with semiconductor chips is proposed. A semiconductor chip is received in a cavity of a supporting board. A dielectric layer and a circuit layer are formed on the supporting board and the semiconductor chip. A plurality of hollow conductive vias are formed in the dielectric layer for electrically connecting the circuit layer to the semiconductor chip. By providing the hollow conductive vias of present invention, the separating results of different coefficients of expansion and thermal stress are prevented, and thus electrical function of products is ensured.
摘要翻译：提出了一种嵌入半导体芯片的电路板结构。半导体芯片被容纳在支撑板的空腔中。在支撑板和半导体芯片上形成电介质层和电路层。在电介质层中形成多个中空导电通孔，用于将电路层与半导体芯片电连接。通过提供本发明的中空导电通孔，可以防止不同膨胀系数和热应力的分离结果，从而确保产品的电功能。

4. 发明申请

US20130286679A1 LIGHT GUIDE PLATE AND BACKLIGHT MODULE USING THE SAME 有权
标题翻译：光导板和背光模块使用相同
公开(公告)号：US20130286679A1
公开(公告)日：2013-10-31
申请号：US13873251
申请日：2013-04-30
申请人： Shang-Wei Chen , Min-Yi Hsu , Chao-Hung Weng , Wen-Hsin Lo , Han-Wen Tsai , Ming-Feng Kuo , Ming-Dah Liu
发明人： Shang-Wei Chen , Min-Yi Hsu , Chao-Hung Weng , Wen-Hsin Lo , Han-Wen Tsai , Ming-Feng Kuo , Ming-Dah Liu
IPC分类号： F21V8/00
CPC分类号： G02B6/0053 , G02B6/0015 , G02B6/0016 , G02B6/0036 , G02B6/0051
摘要： A backlight module includes a light guide plate (LGP), a light source, and at least one prism sheet. The LGP includes a light emitting surface, a bottom surface, a light incident surface, and a plurality of first microstructures on the bottom surface. Each of the first microstructure is a recessed structure and includes a first surface and a second surface. An included angle between the first surface and the bottom surface ranges from 15 degrees to 27 degrees. An included angle between the second surface and the bottom surface ranges from 50 degrees to 90 degrees. The light source provides a light beam, and an included angle between a light emitting direction of the light beam emitted from the light emitting surface of the LGP and a normal direction of the light emitting surface is greater than 30 degrees. The prism sheet is disposed above the light emitting surface.
摘要翻译：背光模块包括导光板（LGP），光源和至少一个棱镜片。 LGP包括底表面上的发光面，底面，光入射面和多个第一微结构。第一微结构中的每一个是凹陷结构，并且包括第一表面和第二表面。第一表面和底表面之间的夹角为15度至27度。第二表面和底面之间的夹角为50度至90度。光源提供光束，并且从LGP的发光面发射的光束的发光方向与发光面的法线方向之间的夹角大于30度。棱镜片设置在发光面的上方。

5. 发明申请

US20090032930A1 PACKAGING SUBSTRATE HAVING CHIP EMBEDDED THEREIN AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：具有嵌入芯片的包装基板及其制造方法
公开(公告)号：US20090032930A1
公开(公告)日：2009-02-05
申请号：US11832466
申请日：2007-08-01
申请人： Shih-Ping Hsu , Chung-Cheng Lien , Shang-Wei Chen , Kan-Jung Chia
发明人： Shih-Ping Hsu , Chung-Cheng Lien , Shang-Wei Chen , Kan-Jung Chia
IPC分类号： H01L21/52 , H01L23/18
CPC分类号： H01L21/52 , H01L23/24 , H01L24/19 , H01L2224/04105 , H01L2224/12105 , H01L2924/14 , H01L2924/18162 , H01L2924/00
摘要： A packaging substrate having a chip embedded therein, comprises a first aluminum substrate having a first cavity therein; a second aluminum substrate having a second cavity corresponding to the first cavity; a dielectric layer disposed between the first aluminum substrate and the second aluminum substrate; a chip embedded in the first cavity and the second cavity, having an active surface with a plurality of electrode pads thereon; and one built-up structure disposed on the surface of the first aluminum substrate and the active surface of the chip, wherein the built-up structure has a plurality of conductive vias electrically connecting to the electrode pads. The substrate warpage is obviously reduced by the assistance of using aluminum or aluminum alloy as the material of the substrate. Also, a method of manufacturing a packaging substrate having a chip embedded therein is disclosed.
摘要翻译：具有嵌入其中的芯片的封装基板包括其中具有第一腔的第一铝基板; 第二铝基板，具有对应于第一空腔的第二腔; 设置在所述第一铝基板和所述第二铝基板之间的电介质层; 嵌入在所述第一腔和所述第二腔中的芯片，具有其上具有多个电极焊盘的活性表面; 以及设置在第一铝基板的表面和芯片的有源表面上的一个堆积结构，其中，所述积层结构具有电连接到电极焊盘的多个导电通孔。通过使用铝或铝合金作为基材的材料，显着减少了基板翘曲。另外，公开了一种制造具有嵌入其中的芯片的封装衬底的方法。

6. 发明申请

US20080185704A1 Carrier plate structure havign a chip embedded therein and the manufacturing method of the same 审中-公开
标题翻译：载板结构将其嵌入其中的芯片及其制造方法
公开(公告)号：US20080185704A1
公开(公告)日：2008-08-07
申请号：US11701409
申请日：2007-02-02
申请人： Shih-Ping Hsu , Chung-Cheng Lien , Kan-Jung Chia , Shang-Wei Chen
发明人： Shih-Ping Hsu , Chung-Cheng Lien , Kan-Jung Chia , Shang-Wei Chen
IPC分类号： H01L21/00 , H01L23/48
CPC分类号： H05K3/4608 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L23/5389 , H01L24/19 , H01L2224/04105 , H01L2224/20 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01016 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01082 , H01L2924/15174 , H01L2924/15311 , H01L2924/18162 , H05K1/053 , H05K1/183 , H05K3/445 , H05K3/4641 , H05K3/4697 , H05K2201/09481 , H05K2201/10674 , H05K2203/0315
摘要： A carrier plate structure having a chip embedded therein, comprises an aluminum plate having plural through-holes extending from the upper surface to the lower surface of the aluminum plate, a cavity therein, and an aluminum oxide layer formed on the surface of the aluminum plate; a chip embedded in the cavity with an active surface having plural electrode pads set thereon; and at least one build-up structure mounted on the surface of the aluminum plate and the active surface of the chip, wherein the build-up structure comprises at least one conductive structure to electrically connecting to the electrode pad. Besides, a method of manufacturing a carrier plate structure having a chip embedded therein is disclosed.
摘要翻译：具有嵌入其中的芯片的载体板结构包括铝板，其具有从铝板的上表面延伸到下表面的多个通孔，其中形成有空腔，并且在铝板的表面上形成氧化铝层 ; 嵌入在所述腔中的芯片，其上设置有多个电极焊盘的有源表面; 以及至少一个堆积结构，其安装在所述铝板的表面和所述芯片的有源表面上，其中所述积聚结构包括至少一个导电结构以电连接到所述电极焊盘。此外，公开了一种制造具有嵌入其中的芯片的载体板结构的方法。

7. 发明申请

US20080164597A1 Plate structure having chip embedded therein and the manufacturing method of the same 失效
标题翻译：具有嵌入其中的芯片的板结构及其制造方法
公开(公告)号：US20080164597A1
公开(公告)日：2008-07-10
申请号：US11649295
申请日：2007-01-04
申请人： Shih-Ping Hsu , Chung-Cheng Lien , Kan-Jung Chia , Shang-Wei Chen
发明人： Shih-Ping Hsu , Chung-Cheng Lien , Kan-Jung Chia , Shang-Wei Chen
IPC分类号： H01L23/48
CPC分类号： H01L23/5389 , H01L23/49822 , H01L24/19 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01082 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/18162
摘要： A plate structure having a chip embedded therein, comprises an aluminum plate having at least one aluminum oxide layer formed on its surface, and a cavity therein; a chip embedded in the cavity, wherein the chip has an active surface; at least one electrode pad mounted on the active surface; and a build-up structure mounted on the surface of the aluminum plate, the active surface of the chip, and the surface of the electrode pad, wherein the build-up structure comprises at least one conducting to electrically connect to the electrode pad. Besides, a method of manufacturing a plate structure having a chip embedded therein is disclosed. Therefore, the plate structure having a chip embedded therein can be processed by a simple method to achieve the tenacity of aluminum and the rigidity of aluminum oxide.
摘要翻译：具有嵌入其中的芯片的板结构包括其表面上形成有至少一个氧化铝层的铝板及其中的空腔; 嵌入在所述腔中的芯片，其中所述芯片具有活性表面; 安装在所述有源表面上的至少一个电极焊盘; 以及安装在铝板的表面，芯片的有源表面和电极焊盘的表面上的积聚结构，其中积聚结构包括至少一个电连接到电极焊盘的导电体。此外，公开了一种制造具有嵌入其中的芯片的板结构的方法。因此，具有嵌入其中的芯片的板结构可以通过简单的方法来加工，以实现铝的强度和氧化铝的刚性。

8. 发明申请

US20080145975A1 METHOD FOR FABRICATING CIRCUIT BOARD STRUCTURE WITH EMBEDDED SEMICONDUCTOR CHIP 审中-公开
标题翻译：用嵌入式半导体芯片制作电路板结构的方法
公开(公告)号：US20080145975A1
公开(公告)日：2008-06-19
申请号：US11956258
申请日：2007-12-13
申请人： Shih-Ping Hsu , Shang-Wei Chen
发明人： Shih-Ping Hsu , Shang-Wei Chen
IPC分类号： H01L21/58
CPC分类号： H01L23/5389 , H01L24/19 , H01L2224/04105 , H01L2224/20 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/15311 , H01L2924/18162 , H01L2924/3011 , H01L2924/351 , H01L2924/00
摘要： The invention provides a method for fabricating printed circuit board having an embedded semiconductor chip, including: providing a carrier board including a first and a second surface and at least one through hole penetrating the first and second surfaces; disposing a semiconductor chip in the through hole and including an active surface and an inactive surface, the active surface including a plurality of electrode pads; forming at least one non photoimagable laminating layer on the first surface of the carrier board with a through hole to expose the inactive surface of the semiconductor chip; forming a dielectric layer on the second surface of the carrier board and the active surface of the semiconductor chip; and forming a circuit layer on the dielectric layer, the circuit layer electrically connecting to the electrode pads of the semiconductor chip through conductive structures in the dielectric layer, thereby preventing the carrier board from warpage due to temperature variations and an asymmetric structure during a single-side circuit formation process of the carrier board.
摘要翻译：本发明提供一种制造具有嵌入式半导体芯片的印刷电路板的方法，包括：提供包括第一和第二表面的载体板和穿过第一和第二表面的至少一个通孔; 在所述通孔中设置半导体芯片并且包括活性表面和非活性表面，所述活性表面包括多个电极焊盘; 在所述载体板的所述第一表面上形成至少一个不可光成像的层压层，其具有通孔以露出所述半导体芯片的非活性表面; 在载体板的第二表面和半导体芯片的有源表面上形成电介质层; 并且在电介质层上形成电路层，该电路层通过电介质层中的导电结构与半导体芯片的电极焊盘电连接，从而防止载体板由于温度变化而产生翘曲，载板的侧电路形成过程。

9. 发明授权

US07208870B2 Silver alloy used in an organic electroluminescent panel 失效
标题翻译：银合金用于有机电致发光面板
公开(公告)号：US07208870B2
公开(公告)日：2007-04-24
申请号：US10691577
申请日：2003-10-24
申请人： Yih Chang , Shang-Wei Chen , Tien Wang Huang , Tien-Rong Lu , Hsin Tzu Yao , Chih-Jen Yang
发明人： Yih Chang , Shang-Wei Chen , Tien Wang Huang , Tien-Rong Lu , Hsin Tzu Yao , Chih-Jen Yang
IPC分类号： H01J1/62 , H01J63/04
CPC分类号： C22C5/08 , H01B1/02 , H01L27/3283 , H01L51/5212 , H01L51/5228
摘要： An organic electroluminescent panel having a silver alloy is disclosed, which has a substrate; a plurality of the first electrodes; a plurality of the second electrodes; a plurality of conducting lines containing a silver alloy; a plurality of isolating walls; and a plurality of organic electroluminescent media. The first electrodes are arranged in parallel on the substrate. The organic electroluminescent media are disposed on the first electrodes. The second electrodes are disposed on the organic electroluminescent media. The conducting lines containing the silver alloy connect to the first electrodes or the second electrodes. The silver alloy contained in the conducting lines has 80 to 99.8 mol % of silver; 0.1 to 10 mol % of copper; and 0.1 to 10 mol % of at least one transition metal selected from the group consisting of palladium (Pd), magnesium (Mg), gold (Au), platinum (Pt), and the combinations thereof.
摘要翻译：公开了具有银合金的有机电致发光面板，其具有基板; 多个第一电极; 多个第二电极; 含有银合金的多条导线; 多个隔离壁; 和多个有机电致发光介质。第一电极平行地布置在基板上。有机电致发光介质设置在第一电极上。第二电极设置在有机电致发光介质上。含有银合金的导线与第一电极或第二电极连接。包含在导线中的银合金具有80至99.8mol％的银; 0.1〜10摩尔％的铜; 和0.1〜10摩尔％的选自钯（Pd），镁（Mg），金（Au），铂（Pt）等的至少一种过渡金属及其组合。

10. 发明申请

US20050236176A1 Circuit board with identifiable information and method for fabricating the same 有权
标题翻译：具有可识别信息的电路板及其制造方法
公开(公告)号：US20050236176A1
公开(公告)日：2005-10-27
申请号：US10921832
申请日：2004-08-20
申请人： Shih-Ping Hsu , Shang-Wei Chen , Suo-Hsia Tang , Chao-Wen Shih
发明人： Shih-Ping Hsu , Shang-Wei Chen , Suo-Hsia Tang , Chao-Wen Shih
IPC分类号： G06K1/00 , H05K1/02 , H05K3/00 , H05K3/10 , H05K3/40 , H05K3/46
CPC分类号： H05K1/0266 , H05K1/0269 , H05K3/107 , H05K3/4644 , H05K2201/09781 , H05K2201/09927 , H05K2201/09936
摘要： A circuit board with identifiable information and a method for fabricating the same are proposed. At least one insulating layer within the circuit board has a non-circuit area free of a circuit layout. A plurality of openings are formed in the non-circuit area of the insulating layer. A patterned circuit layer is formed on the insulating layer. Metal identifiable information is disposed in the openings of the non-circuit area. By this arrangement, a product status of the circuit board can be traced and identified via the metal patterned information.
摘要翻译：提出了具有可识别信息的电路板及其制造方法。电路板内的至少一个绝缘层具有不具有电路布局的非电路区域。在绝缘层的非电路区域中形成多个开口。在绝缘层上形成图案化的电路层。金属识别信息设置在非电路区域的开口中。通过这种布置，电路板的产品状态可以通过金属图案信息进行跟踪和识别。

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