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    • 9. 发明申请
    • METHODS FOR FORMING RESISTIVE-SWITCHING METAL OXIDES FOR NONVOLATILE MEMORY ELEMENTS
    • 形成非易失性存储元件的电阻式切换金属氧化物的方法
    • US20120149164A1
    • 2012-06-14
    • US13111230
    • 2011-05-19
    • Pragati KumarSandra G. MalhotraSean BarstowTony Chiang
    • Pragati KumarSandra G. MalhotraSean BarstowTony Chiang
    • H01L21/02
    • H01L45/1625H01L27/2409H01L27/2463H01L45/04H01L45/1233H01L45/146H01L45/1641
    • Nonvolatile memory elements are provided that have resistive switching metal oxides. The nonvolatile memory elements may be formed from resistive-switching metal oxide layers. Metal oxide layers may be formed using sputter deposition at relatively low sputtering powers, relatively low duty cycles, and relatively high sputtering gas pressures. Dopants may be incorporated into a base oxide layer at an atomic concentration that is less than the solubility limit of the dopant in the base oxide. At least one oxidation state of the metal in the base oxide is preferably different than at least one oxidation sate of the dopant. The ionic radius of the dopant and the ionic radius of the metal may be selected to be close to each other. Annealing and oxidation operations may be performed on the resistive switching metal oxides. Bistable metal oxides with relatively large resistivities and large high-state-to-low state resistivity ratios may be produced.
    • 提供具有电阻开关金属氧化物的非易失性存储元件。 非易失性存储元件可以由电阻式开关金属氧化物层形成。 金属氧化物层可以使用相对低的溅射功率,相对低的占空比和较高的溅射气体压力的溅射沉积形成。 掺杂剂可以以小于基底氧化物中的掺杂剂的溶解度极限的原子浓度结合到基底氧化物层中。 基底氧化物中金属的至少一种氧化态优选不同于掺杂剂的至少一种氧化态。 可以选择掺杂剂的离子半径和金属的离子半径彼此接近。 可以对电阻式开关金属氧化物进行退火和氧化操作。 可以制造具有相对较大的电阻率和大的高 - 低 - 电阻率比的双稳态金属氧化物。