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1. 发明授权

US09524945B2 Cu pillar bump with L-shaped non-metal sidewall protection structure 有权
标题翻译：铜柱凸起具有L形非金属侧壁保护结构
公开(公告)号：US09524945B2
公开(公告)日：2016-12-20
申请号：US12781987
申请日：2010-05-18
申请人： Chien Ling Hwang , Yi-Wen Wu , Chung-Shi Liu
发明人： Chien Ling Hwang , Yi-Wen Wu , Chung-Shi Liu
IPC分类号： H01L23/488 , H01L23/00
CPC分类号： H01L24/13 , H01L24/05 , H01L24/11 , H01L24/16 , H01L24/81 , H01L2224/0345 , H01L2224/0401 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05671 , H01L2224/10126 , H01L2224/10145 , H01L2224/11019 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/11464 , H01L2224/11622 , H01L2224/11849 , H01L2224/1308 , H01L2224/13083 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13166 , H01L2224/13181 , H01L2224/13552 , H01L2224/13565 , H01L2224/1357 , H01L2224/13575 , H01L2224/13686 , H01L2224/1369 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/81193 , H01L2224/814 , H01L2224/81447 , H01L2224/81815 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01047 , H01L2924/01049 , H01L2924/01073 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/0504 , H01L2924/07025 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/1421 , H01L2924/1431 , H01L2924/1437 , H01L2924/3841 , H01L2924/0105 , H01L2924/00
摘要： An L-shaped sidewall protection process is used for Cu pillar bump technology. The L-shaped sidewall protection structure is formed of at least one of non-metal material layers, for example a dielectric material layer, a polymer material layer or combinations thereof.
摘要翻译： Cu柱凸块技术采用L形侧壁保护工艺。 L形侧壁保护结构由非金属材料层，例如介电材料层，聚合物材料层或其组合中的至少一种形成。

2. 发明授权

US09186087B2 Combined cardiac and respiratory motion compensation for atrial fibrillation ablation procedures 有权
标题翻译：心房颤动消融手术联合心脏和呼吸运动补偿
公开(公告)号：US09186087B2
公开(公告)日：2015-11-17
申请号：US13433817
申请日：2012-03-29
申请人： Rui Liao , Alexander Benjamin Brost , Wen Wu , Terrence Chen , Joachim Hornegger , Martin Willibald Koch , Norbert Strobel , Andreas Wimmer
发明人： Rui Liao , Alexander Benjamin Brost , Wen Wu , Terrence Chen , Joachim Hornegger , Martin Willibald Koch , Norbert Strobel , Andreas Wimmer
IPC分类号： A61B5/06 , A61B6/12 , A61B6/00 , A61B19/00 , A61B17/00
CPC分类号： A61B5/061 , A61B6/12 , A61B6/487 , A61B6/503 , A61B6/504 , A61B6/5217 , A61B2017/00699 , A61B2017/00703 , A61B2034/2065 , A61B2090/376
摘要： A method for compensating cardiac and respiratory motion in atrial fibrillation ablation procedures includes (a) simultaneously determining a position of a circumferential mapping (CFM) catheter and a coronary sinus (CS) catheter in two consecutive image frames of a series of first 2-D image frames; (b) determining a distance between a virtual electrode on the CS catheter and a center of the CFM catheter for a first image frame of the two consecutive image frames, and for a second image frame of the two consecutive image frames; and (c) if an absolute difference of the distance for the first image frame and the distance for the second image frame is greater than a predetermined threshold, compensating for motion of the CFM catheter in a second 2-D image.
摘要翻译：用于补偿心房颤动消融手术中的心脏和呼吸运动的方法包括（a）同时确定一系列第一2-D的两个连续图像帧中的圆周映射（CFM）导管和冠状窦（CS）导管的位置图像帧; （b）确定所述CS导管上的虚拟电极与所述两个连续图像帧的第一图像帧的所述CFM导管的中心之间的距离，以及所述两个连续图像帧的第二图像帧; 以及（c）如果第一图像帧的距离和第二图像帧的距离的绝对差大于预定阈值，则补偿CFM导管在第二二维图像中的运动。

3. 发明授权

US09117772B2 Bonding package components through plating 有权
标题翻译：通过电镀将封装组件接合
公开(公告)号：US09117772B2
公开(公告)日：2015-08-25
申请号：US13527422
申请日：2012-06-19
申请人： Zheng-Yi Lim , Yi-Wen Wu , Tzong-Hann Yang , Ming-Che Ho , Chung-Shi Liu
发明人： Zheng-Yi Lim , Yi-Wen Wu , Tzong-Hann Yang , Ming-Che Ho , Chung-Shi Liu
IPC分类号： H01L21/44 , H01L23/31 , H01L25/10 , H01L25/00 , H01L25/065 , H01L21/56 , H01L23/498 , H01L23/00
CPC分类号： H01L24/81 , H01L21/56 , H01L23/3107 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/49833 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/17 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/13016 , H01L2224/13017 , H01L2224/13018 , H01L2224/13023 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13582 , H01L2224/13583 , H01L2224/13611 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/13664 , H01L2224/16148 , H01L2224/16225 , H01L2224/16238 , H01L2224/16501 , H01L2224/16505 , H01L2224/32135 , H01L2224/32141 , H01L2224/32145 , H01L2224/81085 , H01L2224/811 , H01L2224/8112 , H01L2224/81121 , H01L2224/81193 , H01L2224/81232 , H01L2224/81355 , H01L2224/81359 , H01L2224/81801 , H01L2224/8192 , H01L2225/06513 , H01L2225/06517 , H01L2225/0652 , H01L2225/1023 , H01L2225/1058 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/15311 , H01L2924/1533 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/3841 , H01L2924/00014 , H01L2924/00012 , H01L2924/01005 , H01L2924/01074 , H01L2924/01015 , H01L2924/06 , H01L2924/00
摘要： A method includes aligning a first electrical connector of a first package component to a second electrical connector of a second package component. With the first electrical connector aligned to the second electrical connector, a metal layer is plated on the first and the second electrical connectors. The metal layer bonds the first electrical connector to the second electrical connector.
摘要翻译：一种方法包括将第一包装部件的第一电连接器与第二包装部件的第二电连接器对准。利用第一电连接器与第二电连接器对准，金属层被电镀在第一和第二电连接器上。金属层将第一电连接器连接到第二电连接器。

4. 发明授权

US09031367B2 Optical element package and manufacturing method thereof 有权
标题翻译：光学元件封装及其制造方法
公开(公告)号：US09031367B2
公开(公告)日：2015-05-12
申请号：US13598822
申请日：2012-08-30
申请人： Kai-Wen Wu , Tai-Cherng Yu
发明人： Kai-Wen Wu , Tai-Cherng Yu
IPC分类号： G02B6/12 , G02B6/30 , G02B6/36 , G02B6/42
CPC分类号： G02B6/4214 , G02B6/30 , G02B6/3636 , G02B6/3652 , G02B6/423 , G02B6/4246 , G02B6/4249 , Y10T29/49826
摘要： An optical element package includes an optical wave guide array, at least one optical assembly and at least one optical transmission member. The optical wave guide array has a reflection groove. The reflection groove includes a reflection surface. The at least one optical assembly is positioned on the optical wave guide array adjacent to the reflection surface. The at least one optical transmission member is positioned on the optical wave guide array, and is optically coupled with the reflection surface. The optical signals emitted by the at least one optical assembly are reflected by the reflection surface and then reaching the at least one optical transmission member for transmission.
摘要翻译：光学元件封装包括光波导阵列，至少一个光学组件和至少一个光学传输构件。光波导阵列具有反射槽。反射槽包括反射面。至少一个光学组件位于邻近反射表面的光波导阵列上。所述至少一个光传输部件位于所述光波导阵列上，并与所述反射面光学耦合。由至少一个光学组件发射的光信号被反射表面反射，然后到达至少一个光传输部件进行透射。

5. 发明授权

US08983641B2 Electronic device for activating and controlling user-controllable functions thereof according to an earphone connected thereto, and associated method 有权
标题翻译：根据与其连接的耳机来激活和控制其用户可控功能的电子设备及相关方法
公开(公告)号：US08983641B2
公开(公告)日：2015-03-17
申请号：US13283597
申请日：2011-10-28
申请人： Tsung-Jen Chuang , Shih-Fang Wong , Wen-Wu Wang , Wen-Dong Luo , Bin Liu
发明人： Tsung-Jen Chuang , Shih-Fang Wong , Wen-Wu Wang , Wen-Dong Luo , Bin Liu
IPC分类号： G06F17/00 , G11B19/08
CPC分类号： G11B19/08 , H04R3/00
摘要： An exemplary electronic device is connected with an earphone. The earphone includes a first storage unit storing information as to functions of the earphone. The electronic device includes a second storage unit storing a function information table recording information as to user-controllable functions of the electronic device, function units corresponding to the user-controllable functions, an identifying module, and a control module. The identifying module retrieves the information as to functions stored in the first storage unit, and determines whether one or more of the controllable functions of the electronic device are controllable by the earphone. The control module activates all of the function units corresponding to the controllable functions of the electronic device which are controllable by the earphone, and controls one or more of the activated function units according to one or more control signals transmitted from the earphone to the electronic device. A related method is also provided.
摘要翻译：示例性电子设备与耳机连接。耳机包括存储关于耳机的功能的信息的第一存储单元。电子设备包括存储关于电子设备的用户可控功能的功能信息表记录信息，与用户可控功能对应的功能单元，识别模块和控制模块的第二存储单元。识别模块检索关于存储在第一存储单元中的功能的信息，并且确定电子设备的一个或多个可控功能是否可被耳机控制。控制模块激活对应于由耳机控制的电子设备的可控功能的所有功能单元，并且根据从耳机发送到电子设备的一个或多个控制信号来控制一个或多个激活的功能单元。还提供了相关的方法。

6. 发明申请

US20150065242A1 PORTABLE APPARATUS AND METHOD FOR PLAYING INTERACTIVE GAMES VIA PORTABLE APPARATUS 审中-公开
标题翻译：便携式装置和通过便携式装置播放交互式游戏的方法
公开(公告)号：US20150065242A1
公开(公告)日：2015-03-05
申请号：US14461805
申请日：2014-08-18
申请人： TING-JIA CHANG , CHUN-YU CHEN , YEN-WEN WU
发明人： TING-JIA CHANG , CHUN-YU CHEN , YEN-WEN WU
IPC分类号： A63F13/35
CPC分类号： A63F13/837 , A63F13/327 , A63F13/33 , A63F13/426 , A63F2300/8023
摘要： A method for playing interactive games via a portable apparatus is disclosed. The method is applied to a portable apparatus. The method includes: transmitting a location signal; receiving location signals transmitted from other portable apparatuses; receiving a shooting signal; and determining a game status based on the shooting signal.
摘要翻译：公开了一种通过便携式设备玩互动游戏的方法。该方法应用于便携式设备。该方法包括：发送位置信号; 接收从其他便携式设备发送的位置信号; 接收拍摄信号; 以及基于所述拍摄信号确定游戏状态。

7. 发明授权

US08937388B2 Methods and apparatus of packaging semiconductor devices 有权
标题翻译：封装半导体器件的方法和装置
公开(公告)号：US08937388B2
公开(公告)日：2015-01-20
申请号：US13492285
申请日：2012-06-08
申请人： Yi-Wen Wu , Ming-Che Ho , Wen-Hsiung Lu , Chia-Wei Tu , Chung-Shi Liu
发明人： Yi-Wen Wu , Ming-Che Ho , Wen-Hsiung Lu , Chia-Wei Tu , Chung-Shi Liu
IPC分类号： H01L23/52
CPC分类号： H01L24/06 , H01L23/3114 , H01L23/3192 , H01L23/525 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/02331 , H01L2224/02351 , H01L2224/02375 , H01L2224/02381 , H01L2224/03828 , H01L2224/0401 , H01L2224/05548 , H01L2224/05551 , H01L2224/05557 , H01L2224/05572 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/06051 , H01L2224/10145 , H01L2224/11334 , H01L2224/13021 , H01L2224/13024 , H01L2224/13027 , H01L2224/131 , H01L2224/13111 , H01L2924/00014 , H01L2924/01322 , H01L2924/01023 , H01L2924/01047 , H01L2924/01029 , H01L2924/00012 , H01L2924/014 , H01L2224/05552 , H01L2924/00
摘要： Methods and apparatuses for wafer level packaging (WLP) of semiconductor devices are disclosed. A contact pad of a circuit may be connected to a solder bump by way of a post passivation interconnect (PPI) line and a PPI pad. The PPI pad may comprise a hollow part and an opening. The PPI pad may be formed together with the PPI line as one piece. The hollow part of the PPI pad can function to control the amount of solder flux used in the ball mounting process so that any extra amount of solder flux can escape from an opening of the solid part of the PPI pad. A solder ball can be mounted to the PPI pad directly without using any under bump metal (UBM) as a normal WLP package would need.
摘要翻译：公开了用于半导体器件的晶片级封装（WLP）的方法和装置。电路的接触焊盘可以通过后钝化互连（PPI）线和PPI焊盘连接到焊料凸块。 PPI垫可以包括中空部分和开口。 PPI垫可以与PPI线一起形成为一体。 PPI垫的中空部分可用于控制球安装过程中使用的焊剂量，以便任何额外量的焊剂可以从PPI焊盘的固体部分的开口逸出。焊锡球可以直接安装到PPI焊盘，而不使用正常的WLP封装所需的任何下凸块金属（UBM）。

8. 发明授权

US08911159B2 Circuit board assembly having optical transceiver for signal transmission 有权
标题翻译：具有用于信号传输的光收发器的电路板组件
公开(公告)号：US08911159B2
公开(公告)日：2014-12-16
申请号：US13559566
申请日：2012-07-26
申请人： Kai-Wen Wu
发明人： Kai-Wen Wu
IPC分类号： G02B6/36
CPC分类号： G02B6/4246 , G02B6/4203 , G02B6/4214 , G02B6/425 , G02B6/4257 , G02B6/43
摘要： A circuit board assembly includes a circuit board, a first optical transceiver electrically connected to the circuit board, a first transparent shell optically coupled with the first optical transceiver, a second optical transceiver electrically connected to the circuit board, a second transparent shell optically coupled with the second optical transceiver, and a plurality of light wave guides optically coupled with the first transparent shell and the second transparent shell. The first optical transceiver sends first light signals. The first light signals are transmitted through the first transparent shell, the light wave guides, and the second transparent shell and are received by the second optical transceiver. The second optical transceiver sends second light signals. The second light signals are transmitted through the second transparent shell, the light wave guides, and the first transparent shell and are received by first optical transceiver.
摘要翻译：电路板组件包括电路板，电连接到电路板的第一光收发器，与第一光收发器光耦合的第一透明外壳，与电路板电连接的第二光收发器，第二透明外壳，光耦合第二光收发器和与第一透明壳和第二透明壳光学耦合的多个光波导。第一个光收发器发送第一个光信号。第一光信号通过第一透明壳体，光波导件和第二透明壳体传输并被第二光收发器接收。第二个光收发器发送第二个光信号。第二光信号通过第二透明壳体，光波导和第一透明壳体传输并被第一光收发器接收。

9. 发明授权

US08890326B2 Easily assembled chip assembly and chip assembling method 有权
标题翻译：易于组装的芯片组装和芯片组装方法
公开(公告)号：US08890326B2
公开(公告)日：2014-11-18
申请号：US13559622
申请日：2012-07-27
申请人： Kai-Wen Wu
发明人： Kai-Wen Wu
IPC分类号： H01L23/48
CPC分类号： H01L24/83 , H01L24/29 , H01L2224/26165 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/8314 , H01L2224/83192 , H01L2224/83385 , H01L2224/83874 , H01L2924/12042 , H01L2924/12043 , H01L2924/15153 , H05K1/0274 , H05K3/305 , H05K2201/09381 , H05K2201/0969 , H05K2201/2018 , Y02P70/613 , H01L2924/00014 , H01L2924/00
摘要： A chip assembly includes a PCB, a connecting pad fixed on the PCB, and a chip. The connecting pad defines a through hole. The chip is received in the through hole and fixed on the PCB by an adhesive distributed in the through hole. A thickness of the adhesive is less than that of the connecting pad.
摘要翻译：芯片组件包括PCB，固定在PCB上的连接焊盘和芯片。连接垫定义一个通孔。芯片被容纳在通孔中并通过分布在通孔中的粘合剂固定在PCB上。粘合剂的厚度小于连接垫的厚度。

10. 发明授权

US08887385B2 Impedance matching method 有权
标题翻译：阻抗匹配法
公开(公告)号：US08887385B2
公开(公告)日：2014-11-18
申请号：US13534217
申请日：2012-06-27
申请人： Kai-Wen Wu
发明人： Kai-Wen Wu
IPC分类号： H05K3/02
CPC分类号： H05K1/0253 , H01R12/53 , H01R13/6474 , H05K1/0245 , H05K1/025 , H05K1/111 , H05K1/117 , H05K3/40 , H05K2201/09372 , H05K2201/10287 , Y10T29/49004 , Y10T29/49117 , Y10T29/4913 , Y10T29/49155
摘要： A circuit board assembly includes a circuit board, at least one pad formed on the circuit board, and at least one connection line. Each of the at least one connection line includes a connection end connected to a respective one of the at least one pad and has the same resistance value as the respective pad.
摘要翻译：电路板组件包括电路板，形成在电路板上的至少一个焊盘和至少一个连接线。所述至少一个连接线中的每一个包括连接到所述至少一个焊盘中的相应一个焊盘并且具有与相应焊盘相同的电阻值的连接端。

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