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    • 4. 发明申请
    • APPARATUS FOR DRYING SEMICONDUCTOR SUBSTRATE
    • 干燥半导体基板的装置
    • US20070017117A1
    • 2007-01-25
    • US11458194
    • 2006-07-18
    • Hun-Jung YISang-Oh PARK
    • Hun-Jung YISang-Oh PARK
    • F26B3/00F26B5/04
    • H01L21/67034
    • An apparatus for drying a substrate is provided. In one embodiment, the apparatus includes a drying room in which a support member for supporting a plurality of wafers is disposed. The apparatus further includes a drying gas-supply element for supplying a drying gas to the substrates supported by the support member. The drying gas-supply element includes nozzles located within the drying room and arranged in a plurality of groups, and supply pipes for supplying a drying gas to the nozzles. Nozzles belonging to a first group are formed such that the density of the openings in a spray port is higher in a front region than in other regions, and nozzles belonging to a second group are formed such that density of openings in a spray port is higher in a rear region than in other regions. Different supply pipes can be connected to nozzles belonging to different groups, and a flow control valve can be installed in each of the supply pipes.
    • 提供了一种干燥基板的设备。 在一个实施例中,该设备包括一个干燥室,其中设置有用于支撑多个晶片的支撑构件。 该装置还包括用于将干燥气体供给到由支撑构件支撑的基板的干燥气体供应元件。 干燥气体供给元件包括位于干燥室内的喷嘴,并且设置成多组,并且向喷嘴供给干燥气体供给管。 形成属于第一组的喷嘴,使得喷嘴中的开口的密度在前区域比在其它区域高,并且形成属于第二组的喷嘴,使得喷嘴中的开口密度更高 在后方区域比其他地区。 可以将不同的供给管连接到属于不同组的喷嘴,并且可以在每个供应管中安装流量控制阀。
    • 5. 发明申请
    • Wafer guides for processing semiconductor substrates
    • 用于处理半导体衬底的晶片导板
    • US20060027513A1
    • 2006-02-09
    • US11234033
    • 2005-09-24
    • Pil-Kwon JunSang-oh ParkYong-Kyun KoHun-Jung Yi
    • Pil-Kwon JunSang-oh ParkYong-Kyun KoHun-Jung Yi
    • A47G19/08
    • H01L21/67326B65D25/103H01L21/67057Y10S134/902
    • A wafer guide used in cleaning and/or drying processes of semiconductor wafers is provided. The wafer guide includes a horizontal support panel and at least three vertical panels attached on one surface of the support panel. Each of the vertical panels has a vertical body panel and a plurality of protrusions upwardly extended from a top surface of the vertical body panel. Gap regions between the protrusions act as slots for holding wafers. Sidewalls of the slots have a convex shaped profile when viewed from a top view, and bottom surfaces of the slots also have a convex shaped profile when viewed from a cross sectional view that crosses the vertical panels. Accordingly, contact areas between the wafers and the wafer guide are reduced to improve a drying efficiency of the wafers.
    • 提供了用于半导体晶片的清洁和/或干燥处理的晶片引导件。 晶片引导件包括水平支撑面板和至少三个垂直面板,其附接在支撑面板的一个表面上。 每个垂直面板具有垂直的主体面板和从垂直主体面板的顶面向上延伸的多个突起。 突起之间的间隙区域用作保持晶片的槽。 当从顶视图观察时,槽的侧壁具有凸形的轮廓,并且当从横切垂直板的横截面视图观察时,槽的底表面也具有凸形轮廓。 因此,晶片和晶片引导件之间的接触面积减小,以提高晶片的干燥效率。