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1. 发明授权

US08923798B2 Apparatus and method of processing rescue request signal 有权
标题翻译：处理救援请求信号的装置及方法
公开(公告)号：US08923798B2
公开(公告)日：2014-12-30
申请号：US12588943
申请日：2009-11-03
申请人： Yong-Hoon Kang , Sang-Jun Kim , Pil-Kyu Jin
发明人： Yong-Hoon Kang , Sang-Jun Kim , Pil-Kyu Jin
IPC分类号： H04M11/04 , H04B3/36 , H04B1/60 , H04W4/22 , H04B7/155 , H04W76/00 , H04B7/14 , H04B17/02 , H04B7/15 , H04B7/185 , H04W64/00
CPC分类号： H04W4/22 , H04B7/155 , H04W4/90 , H04W64/00 , H04W76/50
摘要： Provided is a rescue request signal processing device connected with a repeater and including a signal detector configured to detect identification information of a wireless communication terminal from an uplink signal outputted from the wireless communication terminal; a signal strength information generator configured to generate strength information of the uplink signal of the wireless communication terminal when the detected identification information of the wireless communication terminal is identical with identification information of a wireless communication terminal included in a request signal for location information transmitted from a location information requesting device; and a transmitter configured to transmit the strength information of the uplink signal and at least one of location information and identification information of the repeater to a location information server.
摘要翻译：提供了一种与中继器连接的救援请求信号处理装置，包括：信号检测器，被配置为从无线通信终端输出的上行链路信号检测无线通信终端的识别信息; 信号强度信息生成器，被配置为当所检测的无线通信终端的识别信息与从包含在从无线通信终端发送的位置信息的请求信号中包括的无线通信终端的识别信息相同时，生成无线通信终端的上行链路信号的强度信息位置信息请求装置; 以及发射机，被配置为将上行链路信号的强度信息和中继器的位置信息和识别信息中的至少一个发送到位置信息服务器。

2. 发明申请

US20140208850A1 APPARATUS AND METHOD OF DETECTING A DEFECT OF A SEMICONDUCTOR DEVICE 审中-公开
标题翻译：检测半导体器件缺陷的装置和方法
公开(公告)号：US20140208850A1
公开(公告)日：2014-07-31
申请号：US13753111
申请日：2013-01-29
申请人： Geun-woo Kim , Hyun Kim , Yun-sik Yoo , Sang-jun Kim , Jae-yong Park , Tae-gyeong Chung
发明人： Geun-woo Kim , Hyun Kim , Yun-sik Yoo , Sang-jun Kim , Jae-yong Park , Tae-gyeong Chung
IPC分类号： G01N29/14
CPC分类号： G01N29/14 , G01N29/4454 , G01N2291/0289 , H01L21/67288
摘要： A semiconductor device defect detecting apparatus including: a sensor disposed on semiconductor process equipment, the sensor configured to detect a signal emitted from a semiconductor device in contact with the semiconductor process equipment; and a signal analyzer configured to determine whether the semiconductor device is defective based on the detected signal in a predetermined frequency range.
摘要翻译：一种半导体器件缺陷检测装置，包括：设置在半导体处理设备上的传感器，所述传感器被配置为检测与半导体处理设备接触的半导体器件发射的信号; 以及信号分析器，被配置为基于在预定频率范围内的检测信号来确定半导体器件是否有缺陷。

3. 发明授权

US08792536B2 Repeater using digital filter and method for digital filtering using the same 有权
标题翻译：中继器使用数字滤波器和数字滤波方法
公开(公告)号：US08792536B2
公开(公告)日：2014-07-29
申请号：US13526666
申请日：2012-06-19
申请人： Min Kon Kwak , Sang Jun Kim , You Sik Choi , Pil Kyu Jin , Se Woong Park
发明人： Min Kon Kwak , Sang Jun Kim , You Sik Choi , Pil Kyu Jin , Se Woong Park
IPC分类号： H04B17/02
CPC分类号： H04B7/155
摘要： A repeater using a digital filter is disclosed. The repeater comprises a MUX filter for filtering an RF signal received through an antenna or a signal to be transmitted through the antenna; a low noise amplifier for lowering noise of the signal filtered by the MUX filter; a down converter for converting the signal outputted from the low noise amplifier into an IF band signal to digitalize the signal; a digital filter for filtering the digital signal outputted form the down converter based on parameters inputted by a user; a filtering controller for controlling the digital filter by using a filtering coefficient calculated based on the parameters; an up converter for converting the signal filtered by the digital filter into an RF band signal; and a high power amplifier for amplifying the signal outputted from the up converter to a high power signal.
摘要翻译：公开了使用数字滤波器的中继器。中继器包括用于对通过天线接收的RF信号或要通过天线传输的信号进行滤波的MUX滤波器; 用于降低由MUX滤波器滤波的信号的噪声的低噪声放大器; 一个下变频器，用于将从低噪声放大器输出的信号转换为IF频带信号以对信号进行数字化; 数字滤波器，用于根据用户输入的参数对从下转换器输出的数字信号进行滤波; 滤波控制器，用于通过使用基于参数计算的滤波系数来控制数字滤波器; 用于将由数字滤波器滤波的信号转换成RF频带信号的上变频器; 以及用于将从上变频器输出的信号放大为高功率信号的高功率放大器。

4. 发明申请

US20090278249A1 Printed circuit board and method thereof and a solder ball land and method thereof 有权
标题翻译：印刷电路板及其方法和焊球地及其方法
公开(公告)号：US20090278249A1
公开(公告)日：2009-11-12
申请号：US12458429
申请日：2009-07-13
申请人： Ky-hyun Jung , Heui-seog Kim , Sang-jun Kim , Wha-su Sin , Ho-geon Song , Jun-young Ko
发明人： Ky-hyun Jung , Heui-seog Kim , Sang-jun Kim , Wha-su Sin , Ho-geon Song , Jun-young Ko
IPC分类号： H01L23/498 , H05K1/11 , H01B5/00
CPC分类号： H05K3/282 , H01L21/4853 , H01L23/49816 , H01L23/49838 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/05001 , H01L2224/05008 , H01L2224/05548 , H01L2224/05567 , H01L2224/16503 , H01L2224/32057 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83102 , H01L2224/83385 , H01L2224/92125 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/15311 , H01L2924/181 , H05K3/243 , H05K3/3457 , H05K2201/0391 , H05K2201/0989 , H01L2924/00014 , H01L2924/00012
摘要： A printed circuit board and method thereof and a solder ball land and method thereof. The example printed circuit board (PCB) may include a first solder ball land having a first surface treatment portion configured for a first type of resistance and a second solder ball land having a second surface treatment portion configured for a second type of resistance. The example solder ball land may include a first surface treatment portion configured for a first type of resistance and a second surface treatment portion configured for a second type of resistance. A first example method may include first treating a first surface of a first solder ball land to increase a first type of resistance and second treating a second surface of a second solder ball land to increase a second type of resistance other than the first type of resistance. A second example method may include first treating a solder ball land to increase a first type of resistance and second treating the solder ball land to increase a second type of resistance other than the first type of resistance.
摘要翻译：一种印刷电路板及其方法和焊球地及其方法。示例性印刷电路板（PCB）可以包括具有构造成用于第一类型电阻的第一表面处理部分的第一焊球焊盘和具有被配置为用于第二类型电阻的第二表面处理部分的第二焊球焊盘。示例性焊球焊盘可以包括被配置为用于第一类型电阻的第一表面处理部分和被配置用于第二类型电阻的第二表面处理部分。第一示例性方法可以包括首先处理第一焊球焊盘的第一表面以增加第一类型的电阻，并且第二处理第二焊球焊盘的第二表面以增加除第一类型电阻之外的第二类型的电阻。第二示例性方法可以包括首先处理焊球焊盘以增加第一类型的电阻，并且第二次处理焊球焊盘以增加除第一类型电阻之外的第二类型的电阻。

5. 发明授权

US07576438B2 Printed circuit board and method thereof and a solder ball land and method thereof 有权
公开(公告)号：US07576438B2
公开(公告)日：2009-08-18
申请号：US11486064
申请日：2006-07-14
申请人： Ky-hyun Jung , Heui-seog Kim , Sang-jun Kim , Wha-su Sin , Ho-geon Song , Jun-young Ko
发明人： Ky-hyun Jung , Heui-seog Kim , Sang-jun Kim , Wha-su Sin , Ho-geon Song , Jun-young Ko
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H05K3/282 , H01L21/4853 , H01L23/49816 , H01L23/49838 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/05001 , H01L2224/05008 , H01L2224/05548 , H01L2224/05567 , H01L2224/16503 , H01L2224/32057 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83102 , H01L2224/83385 , H01L2224/92125 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/15311 , H01L2924/181 , H05K3/243 , H05K3/3457 , H05K2201/0391 , H05K2201/0989 , H01L2924/00014 , H01L2924/00012
摘要： A printed circuit board and method thereof and a solder ball land and method thereof. The example printed circuit board (PCB) may include a first solder ball land having a first surface treatment portion configured for a first type of resistance and a second solder ball land having a second surface treatment portion configured for a second type of resistance. The example solder ball land may include a first surface treatment portion configured for a first type of resistance and a second surface treatment portion configured for a second type of resistance. A first example method may include first treating a first surface of a first solder ball land to increase a first type of resistance and second treating a second surface of a second solder ball land to increase a second type of resistance other than the first type of resistance. A second example method may include first treating a solder ball land to increase a first type of resistance and second treating the solder ball land to increase a second type of resistance other than the first type of resistance.

6. 发明授权

US07443512B2 Apparatus and method for measurement of film thickness using improved fast fourier transformation 失效
标题翻译：使用改进的快速傅里叶变换测量膜厚度的装置和方法
公开(公告)号：US07443512B2
公开(公告)日：2008-10-28
申请号：US10541876
申请日：2003-06-18
申请人： Sang-Youl Kim , Sang-Jun Kim
发明人： Sang-Youl Kim , Sang-Jun Kim
IPC分类号： G01B11/02 , G01B9/02 , G01J3/45
CPC分类号： G01B11/0625
摘要： The present invention relates to an apparatus and method for a measurement of a film thickness using an improved fast Fourier transformation. The apparatus includes a light source, a light receiving unit for converging a light from the light source, a detection unit for splitting a reflection light reflected by the surface of the sample and inputted into the optical fabric through the lens, and outputted to the other side of the optical fabric based on a light intensity of each wavelength and providing a certain amount of wavelength, a conversion unit for converting a wavelength based spectrum data detected by the detection unit into an analog signal and then converting into a digital signal through a converter, a computation unit for computing the number of vibrations based on a high speed Fourier transformation, and an analyzing unit for measuring a film thickness.
摘要翻译：本发明涉及使用改进的快速傅里叶变换来测量膜厚度的装置和方法。该装置包括光源，用于会聚来自光源的光的光接收单元，用于将由样品的表面反射的反射光分离并通过透镜输入到光学织物中的检测单元，并输出到另一个基于每个波长的光强度并提供一定量的波长的转换单元，用于将由检测单元检测到的基于波长的频谱数据转换为模拟信号，然后通过转换器转换成数字信号的转换单元，用于计算基于高速傅里叶变换的振动次数的计算单元和用于测量膜厚度的分析单元。

7. 发明申请

US20080110477A1 Cleaning solutions and methods of cleaning boards using the same 审中-公开
标题翻译：清洁方法和清洁使用其的方法
公开(公告)号：US20080110477A1
公开(公告)日：2008-05-15
申请号：US11985455
申请日：2007-11-15
申请人： Ky-Hyun Jung , Wha-Su Sin , Sang-Jun Kim , Jung-Hyeon Kim , Won-Seok Choi
发明人： Ky-Hyun Jung , Wha-Su Sin , Sang-Jun Kim , Jung-Hyeon Kim , Won-Seok Choi
IPC分类号： B08B3/04
CPC分类号： H05K3/26 , C11D3/2068 , C11D3/2086 , C11D11/0047 , H05K3/282 , H05K2203/122
摘要： A method of cleaning a board includes dipping a board having a surface on which an organic solderability preservative (OSP) is provided into a cleaning solution having glycolic acid, a surfactant and water.
摘要翻译：清洗板的方法包括将具有有机可焊性防腐剂（OSP）的表面的板浸渍到具有乙醇酸，表面活性剂和水的清洗溶液中。

8. 发明申请

US20070193920A1 Apparatus and method for separating a semiconductor chip 审中-公开
标题翻译：用于分离半导体芯片的装置和方法
公开(公告)号：US20070193920A1
公开(公告)日：2007-08-23
申请号：US11709853
申请日：2007-02-23
申请人： Jun-young Ko , Dae-sang Chan , Sang-jun Kim
发明人： Jun-young Ko , Dae-sang Chan , Sang-jun Kim
IPC分类号： B65D85/00
CPC分类号： H01L21/67132 , H01L21/67092
摘要： Example embodiments may provide an apparatus for and method of separating a semiconductor chip. In the example embodiments, a separating plate having an end insertable between a base tape and an adhesive film may move back and forth in a direction perpendicular to an edge of the semiconductor chip so as to separate the semiconductor chip. Example embodiments may allow fragile, thin semiconductor chips to be safely packaged without damage and thus may increase semiconductor chip yield.
摘要翻译：示例性实施例可以提供用于分离半导体芯片的装置和方法。在示例实施例中，具有可插入基带和粘合剂膜之间的端部的分离板可以在垂直于半导体芯片的边缘的方向上来回移动，以便分离半导体芯片。示例性实施例可以允许脆弱的薄半导体芯片安全地封装而不损坏，因此可以提高半导体芯片的产量。

9. 发明申请

US20070115863A1 Dualduplexer having matrix structure and method for forming the same 审中-公开
标题翻译：具有矩阵结构的双重双相器及其形成方法
公开(公告)号：US20070115863A1
公开(公告)日：2007-05-24
申请号：US10565243
申请日：2004-07-19
申请人： Tae-Won Seo , Young-Sang Yoon , Sang-Jun Kim , Jae-Bum Noh , Young-Seob Yoo
发明人： Tae-Won Seo , Young-Sang Yoon , Sang-Jun Kim , Jae-Bum Noh , Young-Seob Yoo
IPC分类号： H04L5/14 , H04B1/56
CPC分类号： H04B1/52 , H04B1/005
摘要： The present invention relates to a dualduplexer having a matrix structure and a fabrication method thereof. The dualduplexer includes a dualduplexing block which uses the transmitting input unit, the receiving input unit, the transmitting output unit and the receiving output unit in common, wherein the transmitting input unit, the receiving input unit, the transmitting output unit and the receiving output unit are connected in the form of a matrix; a low noise amplifying block for performing low noise amplification on a signal outputted from an input port of the dualduplexing block; and a high power amplifying block for performing high power amplification on the signal outputted from the low noise amplifying block and transmitting the amplified signal to the dualduplexing block.
摘要翻译：本发明涉及一种具有矩阵结构的双重双相器及其制造方法。双重双工器包括共同使用发送输入单元，接收输入单元，发送输出单元和接收输出单元的双重双向组合，其中发送输入单元，接收输入单元，发送输出单元和接收输出单元以矩阵的形式连接; 低噪声放大块，用于对从双重双链块的输入端口输出的信号进行低噪声放大; 以及高功率放大块，用于对从低噪声放大块输出的信号进行高功率放大，并将放大的信号发送到双重双链块。

10. 发明申请

US20070099550A1 Wafer grinding and tape attaching apparatus and method 失效
标题翻译：晶圆研磨和贴附装置及方法
公开(公告)号：US20070099550A1
公开(公告)日：2007-05-03
申请号：US11397883
申请日：2006-04-05
申请人： Jun-Young Ko , Dae-Sang Chan , Sang-Jun Kim
发明人： Jun-Young Ko , Dae-Sang Chan , Sang-Jun Kim
IPC分类号： B24B7/30 , B24B1/00 , B24B29/00
CPC分类号： B24B7/228 , B24B37/345
摘要： A wafer grinding and tape attaching apparatus and method, the method includes providing a wafer to a chuck table, grinding a back side of the wafer, providing a wafer ring having dicing tape and attaching the dicing tape to the back side of the ground wafer.
摘要翻译：一种晶片研磨和胶带附着装置及方法，该方法包括将晶片提供到卡盘台，研磨晶片的背面，提供具有切割带的晶片环，并将切割带附接到研磨晶片的背面。

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