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1. 发明申请

US20070099550A1 Wafer grinding and tape attaching apparatus and method 失效
标题翻译：晶圆研磨和贴附装置及方法
公开(公告)号：US20070099550A1
公开(公告)日：2007-05-03
申请号：US11397883
申请日：2006-04-05
申请人： Jun-Young Ko , Dae-Sang Chan , Sang-Jun Kim
发明人： Jun-Young Ko , Dae-Sang Chan , Sang-Jun Kim
IPC分类号： B24B7/30 , B24B1/00 , B24B29/00
CPC分类号： B24B7/228 , B24B37/345
摘要： A wafer grinding and tape attaching apparatus and method, the method includes providing a wafer to a chuck table, grinding a back side of the wafer, providing a wafer ring having dicing tape and attaching the dicing tape to the back side of the ground wafer.
摘要翻译：一种晶片研磨和胶带附着装置及方法，该方法包括将晶片提供到卡盘台，研磨晶片的背面，提供具有切割带的晶片环，并将切割带附接到研磨晶片的背面。

2. 发明授权

US07591714B2 Wafer grinding and tape attaching apparatus and method 失效
标题翻译：晶圆研磨和贴附装置及方法
公开(公告)号：US07591714B2
公开(公告)日：2009-09-22
申请号：US11397883
申请日：2006-04-05
申请人： Jun-Young Ko , Dae-Sang Chan , Sang-Jun Kim
发明人： Jun-Young Ko , Dae-Sang Chan , Sang-Jun Kim
IPC分类号： B25B7/00
CPC分类号： B24B7/228 , B24B37/345
摘要： A wafer grinding and tape attaching apparatus and method, the method includes providing a wafer to a chuck table, grinding a back side of the wafer, providing a wafer ring having dicing tape and attaching the dicing tape to the back side of the ground wafer.
摘要翻译：一种晶片研磨和胶带附着装置及方法，该方法包括将晶片提供到卡盘台，研磨晶片的背面，提供具有切割带的晶片环，并将切割带附接到研磨晶片的背面。

3. 发明授权

US07863161B2 Method of cutting a wafer 有权
标题翻译：切割晶片的方法
公开(公告)号：US07863161B2
公开(公告)日：2011-01-04
申请号：US12138646
申请日：2008-06-13
申请人： Dae-Sang Chan , Jun-Young Ko , Wha-Su Sin , Jae-Yong Park
发明人： Dae-Sang Chan , Jun-Young Ko , Wha-Su Sin , Jae-Yong Park
IPC分类号： H01L21/00
CPC分类号： H01L21/78
摘要： In a method of cutting a wafer, a supporting member is attached to an upper surface of the wafer on which semiconductor chips are formed. An opening is formed at a lower surface of the wafer along a scribe lane of the wafer. The lower surface of the wafer may be plasma-etched to reduce a thickness of the wafer. A tensile tape may be attached to the lower surface of the wafer. Here, the tensile tape includes sequentially stacked tensile films having different tensile modules. The supporting member is then removed. The tensile tape is cooled to increase the tensile modules between the tensile films. The tensile tape is tensed until the tensile films are cut using the tensile modules difference to separate the tensile tape from the semiconductor chips. Thus, the lower surface of the wafer may be plasma-etched without using an etching mask.
摘要翻译：在切割晶片的方法中，支撑构件附接到其上形成有半导体芯片的晶片的上表面。在晶片的下表面沿着晶片的划线通道形成开口。可以等离子体蚀刻晶片的下表面以减小晶片的厚度。拉伸带可以附接到晶片的下表面。这里，拉伸带包括具有不同拉伸模块的顺序堆叠的拉伸膜。然后移除支撑构件。拉伸带被冷却以增加拉伸膜之间的拉伸模块。将拉伸带拉紧直到使用拉伸模块差来切割拉伸膜，以将拉伸带与半导体芯片分离。因此，可以不使用蚀刻掩模来等离子体蚀刻晶片的下表面。

4. 发明授权

US07713788B2 Method of manufacturing semiconductor package using redistribution substrate 有权
标题翻译：使用再分布基板制造半导体封装的方法
公开(公告)号：US07713788B2
公开(公告)日：2010-05-11
申请号：US12197067
申请日：2008-08-22
申请人： Jun-Young Ko , Dae-Sang Chan , Heui-Seog Kim , Wha-Su Sin , Jae-Yong Park
发明人： Jun-Young Ko , Dae-Sang Chan , Heui-Seog Kim , Wha-Su Sin , Jae-Yong Park
IPC分类号： H01L21/44
CPC分类号： H01L23/3128 , H01L23/49833 , H01L23/5389 , H01L24/24 , H01L25/0657 , H01L2224/24226 , H01L2224/82039 , H01L2225/06527 , H01L2225/06541 , H01L2225/06582 , H01L2924/01029 , H01L2924/01033 , H01L2924/15311
摘要： An inexpensive method of manufacturing a semiconductor package using a redistribution substrate that is relatively thin. The method includes: attaching a semiconductor chip to a redistribution substrate; attaching the redistribution substrate to which the semiconductor chip is attached to a printed circuit board; removing a support substrate of the redistribution substrate; forming via holes to expose a bond pad of the semiconductor chip and a bond finger of the printed circuit board; and filling the via holes with a conductive material. Meanwhile, a redistribution substrate to which at least one other semiconductor chip may be mounted on the redistribution substrate.
摘要翻译：使用相对薄的再分布基板制造半导体封装的廉价方法。该方法包括：将半导体芯片附接到再分布基板; 将安装有半导体芯片的再分布基板附着到印刷电路板上; 去除所述再分布基板的支撑基板; 形成通孔以暴露所述半导体芯片的接合焊盘和所述印刷电路板的接合指状物; 并用导电材料填充通孔。同时，可以将至少一个其它半导体芯片安装在再分布基板上的再分布基板。

5. 发明授权

US07696615B2 Semiconductor device having pillar-shaped terminal 有权
标题翻译：具有柱状端子的半导体器件
公开(公告)号：US07696615B2
公开(公告)日：2010-04-13
申请号：US11776497
申请日：2007-07-11
申请人： Jun-Young Ko , Dae-Sang Chan , Wha-Su Sin
发明人： Jun-Young Ko , Dae-Sang Chan , Wha-Su Sin
IPC分类号： H01L23/02 , H01L23/34 , H01L23/48 , H01L23/52 , H01L29/40 , H01L29/76 , H01L29/94 , H01L31/062 , H01L31/113 , H01L31/119
CPC分类号： H01L25/0657 , H01L23/49838 , H01L24/16 , H01L24/24 , H01L24/82 , H01L2224/13022 , H01L2224/16 , H01L2224/24011 , H01L2224/2518 , H01L2225/06513 , H01L2225/06517 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/13091 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/00
摘要： A semiconductor device and a method of forming the same are provided. A semiconductor chip included in the semiconductor device includes a pillar-shaped terminal and a pad-shaped terminal in a terminal region. The pillar-shaped terminal is exposed at a first surface of a chip substrate in the terminal region and the pad-shaped terminal is exposed at a second surface of the chip substrate in the terminal region, where the first surface and the second surface of the chip substrate in the terminal region face oppositely from each other.
摘要翻译：提供半导体器件及其形成方法。包括在半导体器件中的半导体芯片包括在端子区域中的柱状端子和衬垫形端子。柱状端子在端子区域中的芯片基板的第一表面处露出，并且在端子区域中的衬底基板的第二表面处露出垫状端子，其中第一表面和第二表面端子区域中的芯片衬底彼此相对地面对。

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