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1. 发明授权

US10257426B2 Image sensor modules, methods of manufacturing the same, and image processing systems including the image sensor modules 有权
公开(公告)号：US10257426B2
公开(公告)日：2019-04-09
申请号：US14994755
申请日：2016-01-13
申请人： Yun Tae Lee , Joon Seo Yim , Je Suk Lee , Jae Yong Park , Jun-Woo Park , Su-Young Lee
发明人： Yun Tae Lee , Joon Seo Yim , Je Suk Lee , Jae Yong Park , Jun-Woo Park , Su-Young Lee
IPC分类号： H04N5/232 , H01L27/146 , H04N5/225 , H04N5/345 , H04N9/04 , H04N5/374 , H04N5/378 , H04N5/369
摘要： An image sensor module is provided. The image sensor module includes a printed circuit board (PCB), an image sensor chip disposed on a first plane of the PCB and electrically connected to the PCB, and an image signal processing chip disposed on the first plane of the PCB and electrically connected to the PCB. An aspect ratio of the image signal processing chip is at least two times greater than an aspect ratio of the image sensor chip. A minimum feature size of a metal line implemented in the image sensor chip is at least 1.5 times greater than a minimum feature size of a metal line implemented in the image signal processing chip.

2. 发明申请

US20160198095A1 IMAGE SENSOR MODULES, METHODS OF MANUFACTURING THE SAME, AND IMAGE PROCESSING SYSTEMS INCLUDING THE IMAGE SENSOR MODULES 审中-公开
标题翻译：图像传感器模块，其制造方法和包括图像传感器模块的图像处理系统
公开(公告)号：US20160198095A1
公开(公告)日：2016-07-07
申请号：US14994755
申请日：2016-01-13
申请人： Yun Tae LEE , Joon Seo YIM , Je Suk LEE , Jae Yong PARK , Jun-Woo PARK , Su-Young LEE
发明人： Yun Tae LEE , Joon Seo YIM , Je Suk LEE , Jae Yong PARK , Jun-Woo PARK , Su-Young LEE
IPC分类号： H04N5/232 , H04N5/374 , H04N5/378 , H04N5/225
CPC分类号： H04N5/23296 , H01L27/14618 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/12044 , H04N5/2257 , H04N5/3454 , H04N5/374 , H04N5/378 , H04N5/379 , H04N9/045 , H01L2924/00014 , H01L2924/00
摘要： An image sensor module is provided. The image sensor module includes a printed circuit board (PCB), an image sensor chip disposed on a first plane of the PCB and electrically connected to the PCB, and an image signal processing chip disposed on the first plane of the PCB and electrically connected to the PCB. An aspect ratio of the image signal processing chip is at least two times greater than an aspect ratio of the image sensor chip. A minimum feature size of a metal line implemented in the image sensor chip is at least 1.5 times greater than a minimum feature size of a metal line implemented in the image signal processing chip.
摘要翻译：提供图像传感器模块。图像传感器模块包括印刷电路板（PCB），设置在PCB的第一平面上并电连接到PCB的图像传感器芯片，以及设置在PCB的第一平面上并且电连接到 PCB。图像信号处理芯片的纵横比比图像传感器芯片的纵横比至少大两倍。在图像传感器芯片中实现的金属线的最小特征尺寸比图像信号处理芯片中实施的金属线的最小特征尺寸至少大1.5倍。

3. 发明申请

US20140208850A1 APPARATUS AND METHOD OF DETECTING A DEFECT OF A SEMICONDUCTOR DEVICE 审中-公开
标题翻译：检测半导体器件缺陷的装置和方法
公开(公告)号：US20140208850A1
公开(公告)日：2014-07-31
申请号：US13753111
申请日：2013-01-29
申请人： Geun-woo Kim , Hyun Kim , Yun-sik Yoo , Sang-jun Kim , Jae-yong Park , Tae-gyeong Chung
发明人： Geun-woo Kim , Hyun Kim , Yun-sik Yoo , Sang-jun Kim , Jae-yong Park , Tae-gyeong Chung
IPC分类号： G01N29/14
CPC分类号： G01N29/14 , G01N29/4454 , G01N2291/0289 , H01L21/67288
摘要： A semiconductor device defect detecting apparatus including: a sensor disposed on semiconductor process equipment, the sensor configured to detect a signal emitted from a semiconductor device in contact with the semiconductor process equipment; and a signal analyzer configured to determine whether the semiconductor device is defective based on the detected signal in a predetermined frequency range.
摘要翻译：一种半导体器件缺陷检测装置，包括：设置在半导体处理设备上的传感器，所述传感器被配置为检测与半导体处理设备接触的半导体器件发射的信号; 以及信号分析器，被配置为基于在预定频率范围内的检测信号来确定半导体器件是否有缺陷。

4. 发明授权

US08420450B2 Method of molding semiconductor package 有权
公开(公告)号：US08420450B2
公开(公告)日：2013-04-16
申请号：US13094216
申请日：2011-04-26
申请人： Jun-young Ko , Jae-yong Park , Heui-seog Kim , Ho-geon Song
发明人： Jun-young Ko , Jae-yong Park , Heui-seog Kim , Ho-geon Song
IPC分类号： H01L21/16
CPC分类号： H01L21/52 , H01L21/56 , H01L21/565 , H01L25/0657 , H01L2224/16225 , H01L2224/48227 , H01L2225/06562
摘要： A method of molding a semiconductor package includes coating liquid molding resin or disposing solid molding resin on a top surface of a semiconductor chip arranged on a substrate. The solid molding resin may include powdered molding resin or sheet-type molding resin. In a case where liquid molding resin is coated on the top surface of the semiconductor chip, the substrate is mounted between a lower molding and an upper molding, and then melted molding resin is filled in a space between the lower molding and the upper molding. In a case where the solid molding resin is disposed on the top surface of the semiconductor chip, the substrate is mounted on a lower mold and then the solid molding resin is heated and melts into liquid molding resin having flowability. An upper mold is mounted on the lower mold, and melted molding resin is filled in a space between the lower molding and the upper molding.

5. 发明授权

US08259622B2 System and method for providing packet network-based multimedia ringback tone service 有权
标题翻译：提供基于分组网络的多媒体回铃音服务的系统和方法
公开(公告)号：US08259622B2
公开(公告)日：2012-09-04
申请号：US12599399
申请日：2008-05-08
申请人： Won Jun Lee , Jae Yong Park , Ki Mun Kim , Min Seok Kim , Young Ho Joo
发明人： Won Jun Lee , Jae Yong Park , Ki Mun Kim , Min Seok Kim , Young Ho Joo
IPC分类号： H04W4/00
CPC分类号： H04M3/42017 , H04W4/16
摘要： Disclosed herein is a system and method for providing a packet network-based MRBT service. In the method, when an originating MSC (110) requests call termination location information from an HLR (120), the HLR transmits an MRBT service request message, including a calling number and a called number, to an MRBT server (140). The MRBT server returns an MRBT service response message, including URL of MRBT content, to the HLR. The HLR transmits a call termination location information response message to the originating MSC, with MRBT service ID information and called party MRBT content URL information included in the call termination location information response message. The originating MSC (110) transmits called party MRBT content URL information to an originating MS (100) on a basis of the MRBT service ID information. The originating MS accesses the MRBT content URL, downloads relevant MRBT content, and plays and stores the MRBT content.
摘要翻译：本文公开了一种用于提供基于分组网络的MRBT服务的系统和方法。在该方法中，当起始MSC（110）从HLR（120）请求呼叫终止位置信息时，HLR向MRBT服务器（140）发送包括呼叫号码和被叫号码的MRBT服务请求消息。 MRBT服务器向HLR返回包括MRBT内容的URL的MRBT服务响应消息。 HLR向起始MSC发送呼叫终止位置信息响应消息，其中包括在呼叫终止位置信息响应消息中的MRBT服务ID信息和被叫方MRBT内容URL信息。始发MSC（110）基于MRBT服务ID信息向主叫MS（100）发送被叫方MRBT内容URL信息。始发MS访问MRBT内容URL，下载相关MRBT内容，并播放和存储MRBT内容。

6. 发明申请

US20110110062A1 Stack-type semiconductor device having chips having different backside structure and electronic apparatus including the same 审中-公开
标题翻译：具有不同背面结构的芯片的堆叠式半导体器件和包括其的电子设备
公开(公告)号：US20110110062A1
公开(公告)日：2011-05-12
申请号：US12661012
申请日：2010-03-09
申请人： Jae-yong Park , Heui-Seog Kim , Jun-young Ko , Dae-sang Chan
发明人： Jae-yong Park , Heui-Seog Kim , Jun-young Ko , Dae-sang Chan
IPC分类号： H05K7/02 , H01L23/12
CPC分类号： H01L23/49575 , H01L23/26 , H01L23/3121 , H01L23/3128 , H01L23/481 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L29/0657 , H01L2224/16145 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48147 , H01L2224/48227 , H01L2224/48247 , H01L2224/732 , H01L2224/73265 , H01L2225/0651 , H01L2225/06513 , H01L2225/06541 , H01L2225/06562 , H01L2225/06575 , H01L2924/01079 , H01L2924/10155 , H01L2924/181 , H01L2924/19041 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A stack-type semiconductor device including semiconductor chips having different backside structures and an electronic apparatus including the stack-type semiconductor device include: a base frame for a semiconductor device; a first semiconductor chip that is mounted on the base frame and has a bottom surface having a first surface roughness; and a second semiconductor chip that is mounted on the first semiconductor chip and has a bottom surface having a second surface roughness, wherein the second surface roughness is greater than the first surface roughness by 1.2 nm or more. The stack-type semiconductor device is manufactured to be thin while cracking of the first semiconductor chip is prevented. In addition, changes in data caused by charge loss resulting from diffusion of metal ions, which can occur when a stack-type semiconductor device is a memory device, is prevented.
摘要翻译：包括具有不同背面结构的半导体芯片的堆叠型半导体器件和包括堆叠型半导体器件的电子设备包括：半导体器件的基底框架; 第一半导体芯片，其安装在所述基座框架上并且具有第一表面粗糙度的底面; 以及第二半导体芯片，其安装在所述第一半导体芯片上并且具有第二表面粗糙度的底表面，其中所述第二表面粗糙度大于所述第一表面粗糙度为1.2nm以上。堆叠型半导体器件制造得很薄，同时防止了第一半导体芯片的破裂。此外，防止了当堆叠型半导体器件是存储器件时可能发生的由金属离子扩散引起的电荷损失导致的数据变化。

7. 发明授权

US07928971B2 Active matrix organic electroluminescent display device and method of fabricating the same 有权
公开(公告)号：US07928971B2
公开(公告)日：2011-04-19
申请号：US11979598
申请日：2007-11-06
申请人： Jae-Yong Park , So-Haeng Cho
发明人： Jae-Yong Park , So-Haeng Cho
IPC分类号： G09G3/30 , G09G5/00
CPC分类号： H01L27/3253 , G09G3/3233 , G09G2300/0443 , G09G2300/0842 , H01L27/12 , H01L27/1248 , H01L27/3244 , H01L27/3251 , H01L27/3262 , H01L27/3276 , H01L51/5212 , H01L51/5246 , H01L2251/5315
摘要： An organic electroluminescent display device includes a substrate, a gate line on the substrate, a data line crossing the gate line over the substrate, a switching thin film transistor near the crossing of the gate line and data line, a driving thin film transistor system including a plurality of sub-TFTs connected in parallel to the switching thin film transistor via a gate base, a power line crossing the gate line over the substrate and electrically connected with the plurality of sub-TFTs, a first electrode over the driving thin film transistor system in contact with the plurality of sub-TFTs, an organic electroluminescent layer on the first electrode, and a second electrode of transparent material on the organic electroluminescent layer.

8. 发明授权

US07863161B2 Method of cutting a wafer 有权
标题翻译：切割晶片的方法
公开(公告)号：US07863161B2
公开(公告)日：2011-01-04
申请号：US12138646
申请日：2008-06-13
申请人： Dae-Sang Chan , Jun-Young Ko , Wha-Su Sin , Jae-Yong Park
发明人： Dae-Sang Chan , Jun-Young Ko , Wha-Su Sin , Jae-Yong Park
IPC分类号： H01L21/00
CPC分类号： H01L21/78
摘要： In a method of cutting a wafer, a supporting member is attached to an upper surface of the wafer on which semiconductor chips are formed. An opening is formed at a lower surface of the wafer along a scribe lane of the wafer. The lower surface of the wafer may be plasma-etched to reduce a thickness of the wafer. A tensile tape may be attached to the lower surface of the wafer. Here, the tensile tape includes sequentially stacked tensile films having different tensile modules. The supporting member is then removed. The tensile tape is cooled to increase the tensile modules between the tensile films. The tensile tape is tensed until the tensile films are cut using the tensile modules difference to separate the tensile tape from the semiconductor chips. Thus, the lower surface of the wafer may be plasma-etched without using an etching mask.
摘要翻译：在切割晶片的方法中，支撑构件附接到其上形成有半导体芯片的晶片的上表面。在晶片的下表面沿着晶片的划线通道形成开口。可以等离子体蚀刻晶片的下表面以减小晶片的厚度。拉伸带可以附接到晶片的下表面。这里，拉伸带包括具有不同拉伸模块的顺序堆叠的拉伸膜。然后移除支撑构件。拉伸带被冷却以增加拉伸膜之间的拉伸模块。将拉伸带拉紧直到使用拉伸模块差来切割拉伸膜，以将拉伸带与半导体芯片分离。因此，可以不使用蚀刻掩模来等离子体蚀刻晶片的下表面。

9. 发明授权

US07755578B2 Organic light emitting diode display device and driving method thereof 有权
标题翻译：有机发光二极管显示装置及其驱动方法
公开(公告)号：US07755578B2
公开(公告)日：2010-07-13
申请号：US11598944
申请日：2006-11-14
申请人： Jae Yong Park , Kwang Jo Hwang , Jong Woo Park , Hee Dong Choi , Sang Ho Yu , Jin Hyoung Kim
发明人： Jae Yong Park , Kwang Jo Hwang , Jong Woo Park , Hee Dong Choi , Sang Ho Yu , Jin Hyoung Kim
IPC分类号： G09G3/30 , G09G3/32 , G09G3/10
CPC分类号： G09G3/3291 , G09G3/3233 , G09G2300/0417 , G09G2300/0819 , G09G2300/0842 , G09G2320/0295 , G09G2320/043
摘要： An organic light emitting diode display device and a driving method are provided. The organic light emitting diode display device comprises a data driver that generates a plurality of reference data voltages that have a level proportional to a gray scale level of a digital data supplied from the timing controller. The data driver supplies the data voltages to the plurality of data lines and compensates for the data voltages in accordance with a magnitude of the feedback voltages from the plurality of pixels fed back through the plurality of feedback lines under control of the timing controller.
摘要翻译：提供了一种有机发光二极管显示装置和驱动方法。有机发光二极管显示装置包括数据驱动器，该数据驱动器产生具有与从定时控制器提供的数字数据的灰度级成比例的电平的多个参考数据电压。数据驱动器将数据电压提供给多条数据线，并且在时序控制器的控制下，根据通过多条反馈线反馈的多个像素的反馈电压的大小补偿数据电压。

10. 发明授权

US07671530B2 Organic electroluminescence display device and method of fabricating the same 有权
标题翻译：有机电致发光显示装置及其制造方法
公开(公告)号：US07671530B2
公开(公告)日：2010-03-02
申请号：US11641002
申请日：2006-12-19
申请人： Jae Yong Park , Kwang Jo Hwang , Jong Woo Park , Hee Dong Choi , Sang Ho Yu , Jin Hyoung Kim
发明人： Jae Yong Park , Kwang Jo Hwang , Jong Woo Park , Hee Dong Choi , Sang Ho Yu , Jin Hyoung Kim
IPC分类号： H01J1/62
CPC分类号： H01L27/3276 , H01L27/3251
摘要： Provided are an organic electroluminescence display device and method of fabricating the same. An organic electroluminescence display device according to the present invention includes a first substrate; a plurality of data lines arranged in a first direction on the first substrate; a plurality of gate lines arranged in a second direction on the first substrate; a plurality of pixel regions defined by the gate lines and the data lines, wherein a first pixel line is defined as a line of the pixel regions arranged in the first direction and a second pixel line is defined as a line of the pixel regions arranged in the second direction; a thin film transistor in each pixel region; a plurality of first connecting lines electrically connecting the thin film transistors of the first pixel lines with each other; and a second connecting line electrically connecting the thin film transistor of at least one of the second pixel lines.
摘要翻译：提供一种有机电致发光显示装置及其制造方法。根据本发明的有机电致发光显示装置包括第一基板; 在第一基板上沿第一方向布置的多条数据线; 在所述第一基板上沿第二方向布置的多个栅极线; 由栅极线和数据线限定的多个像素区域，其中第一像素线被定义为沿第一方向布置的像素区域的线，而第二像素线被定义为布置在其中的像素区域的线第二个方向每个像素区域中的薄膜晶体管; 将第一像素线的薄膜晶体管彼此电连接的多个第一连接线; 以及第二连接线，电连接至少一个第二像素线的薄膜晶体管。

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