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    • 7. 发明申请
    • METHODS TO PATTERN DIFFUSION LAYERS IN SOLAR CELLS AND SOLAR CELLS MADE BY SUCH METHODS
    • 通过这种方法制造太阳能电池和太阳能电池的扩散层图案的方法
    • US20110146782A1
    • 2011-06-23
    • US12937829
    • 2009-04-17
    • Andrew M. GaborRichard L. Wallace
    • Andrew M. GaborRichard L. Wallace
    • H01L31/0224H01L31/18
    • H01L31/1804H01L21/228H01L21/6715H01L31/022425H01L31/0288Y02E10/547Y02P70/521
    • Methods exploiting a Self Aligned Cell (SAC) architecture for doping purposes, use the architecture to direct the deposition and application of either a dopant or a diffusion retarder. Doping is provided in regions that will become metallization for conducting fingers. Dopant may be treated directly into metallization grooves. Or, diffusion retarder may be provided in non-groove locations, and dopant may be provided over some or all of the entire wafer surface. Dopant and metal automatically go where desired, and in register with each other. The SAC architecture also includes concave surfaces for light absorbing regions of a cell, to reduce reflection of light energy, which regions may also be treated with dopant in the concavities, to result in semiconductor emitter lines. Alternatively, diffusion retarder may be treated into the concavities, leaving upper tips of ridges between the concavities exposed, thereby subject to deeper doping.
    • 利用自对准单元(SAC)架构进行掺杂的方法,使用该架构来指导掺杂剂或扩散延迟器的沉积和应用。 在将成为导电手指的金属化的区域中提供掺杂。 掺杂剂可以直接处理成金属化槽。 或者,扩散延迟器可以设置在非凹槽位置,并且可以在整个晶片表面的一些或全部上提供掺杂剂。 掺杂剂和金属自动进入需要的地方,并相互注册。 SAC结构还包括用于单元的光吸收区域的凹面,以减少光能的反射,哪些区域也可以在凹部中用掺杂剂处理,以产生半导体发射线。 或者,扩散延迟器可以被处理成凹面,从而使暴露的凹部之间的脊的上部尖端留下更深的掺杂。
    • 9. 发明授权
    • Methods to pattern diffusion layers in solar cells and solar cells made by such methods
    • 通过这种方法制造太阳能电池和太阳能电池的扩散层图案的方法
    • US08628992B2
    • 2014-01-14
    • US12937829
    • 2009-04-17
    • Andrew M. GaborRichard L. Wallace
    • Andrew M. GaborRichard L. Wallace
    • H01L21/00
    • H01L31/1804H01L21/228H01L21/6715H01L31/022425H01L31/0288Y02E10/547Y02P70/521
    • Methods exploiting a Self Aligned Cell (SAC) architecture for doping purposes, use the architecture to direct the deposition and application of either a dopant or a diffusion retarder. Doping is provided in regions that will become metallization for conducting fingers. Dopant may be treated directly into metallization grooves. Or, diffusion retarder may be provided in non-groove locations, and dopant may be provided over some or all of the entire wafer surface. Dopant and metal automatically go where desired, and in register with each other. The SAC architecture also includes concave surfaces for light absorbing regions of a cell, to reduce reflection of light energy, which regions may also be treated with dopant in the concavities, to result in semi-conductor emitter lines. Alternatively, diffusion retarder may be treated into the concavities, leaving upper tips of ridges between the concavities exposed, thereby subject to deeper doping.
    • 利用自对准单元(SAC)架构进行掺杂的方法,使用该架构来指导掺杂剂或扩散延迟器的沉积和应用。 在将成为导电手指的金属化的区域中提供掺杂。 掺杂剂可以直接处理成金属化槽。 或者,扩散延迟器可以设置在非凹槽位置,并且可以在整个晶片表面的一些或全部上提供掺杂剂。 掺杂剂和金属自动进入需要的地方,并相互注册。 SAC架构还包括用于单元的光吸收区域的凹面,以减少光能的反射,哪些区域也可以在凹部中用掺杂剂处理,以产生半导体发射线。 或者,扩散延迟器可以被处理成凹面,从而使暴露的凹部之间的脊的上部尖端留下更深的掺杂。