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    • 1. 发明授权
    • Infiltrating a powder metal skeleton by a similar alloy with depressed melting point exploiting a persistent liquid phase at equilibrium, suitable for fabricating steel parts
    • 通过相似的合金渗透粉末金属骨架,熔点低于平衡时持续的液相,适用于制造钢件
    • US07250134B2
    • 2007-07-31
    • US10723989
    • 2003-11-26
    • Brian D. KernanEmanuel M. SachsSamuel M. AllenAdam M. Lorenz
    • Brian D. KernanEmanuel M. SachsSamuel M. AllenAdam M. Lorenz
    • B22F3/26
    • C22C38/18B33Y80/00C22C33/0242
    • A steel powder metal skeleton is infiltrated with an infiltrant composition similar to the skeleton, with an additional agent that depresses the melting point of the infiltrant relative to the skeleton. Infiltration is driven primarily by capillary pressure. The powder and infiltrant compositions differ primarily only in a higher concentration of a melting point depressant agent “MPD” in the infiltrant. Carbon (C) and silicon (Si) and several other elements can be elements in an MPD, either alone or in combination. Certain steel target compositions are such that a complementary infiltrant, and skeleton can be chosen such that a skeleton will remain solid at an infiltration temperature at which the infiltrant can be melted and fully infiltrated, and further where there is a persistent two phase field, with a liquid phase that is large enough (greater than 7% vol, and typically between 20 and 40 vol %) so that flow can be maintained without choke off from diffusional solidification. The solid and the liquid phases remaining after any diffusional solidification have different compositions, with a bulk composition of the target. Typically the difference is slight, and the full part is substantially homogeneous. Heat treating, such as austenitizing, quenching, or slow cooling and tempering, can improve homogeneity and mechanical properties. The MPD can have a relatively high diffusivity and solubility in the skeleton. Methods of designing systems of target, skeleton and infiltrant compositions and infiltration temperature are disclosed.
    • 钢粉末金属骨架用类似于骨架的渗透剂组合物渗透,另外一种可以降低渗透剂相对于骨架的熔点的试剂。 渗透主要由毛细管压力驱动。 粉末和渗透剂组合物主要仅在浸润剂中较高浓度的熔点降低剂“MPD”。 碳(C)和硅(Si)等几种元素可以单独或组合使用在MPD中的元素。 某些钢靶组合物使得可以选择互补的浸润剂和骨架,使得骨架将在浸润剂可以熔化和完全渗透的浸润温度下保持固体,并且进一步存在持续的两相场,其中 足够大的液相(大于7体积%,通常在20和40体积%之间),从而可以保持流动而不会阻碍扩散凝固。 在任何扩散固化后残留的固体和液相具有不同的组成,具有靶的体积组成。 通常,差异很小,整个部分基本上是均匀的。 诸如奥氏体化,淬火或缓慢冷却和回火的热处理可以改善均匀性和机械性能。 MPD可以在骨架中具有相对较高的扩散性和溶解性。 公开了设计目标,骨架和浸润剂组合物系统的方法和浸润温度。
    • 2. 发明授权
    • Automatic photographic film processor and fluid-tight seals therefor
    • 自动摄影胶片处理器和流体密封
    • US4166688A
    • 1979-09-04
    • US792055
    • 1977-04-28
    • Emanuel M. Sachs
    • Emanuel M. Sachs
    • G03D3/13G03D3/08
    • G03D3/132
    • An automatic photographic film processor or like device for treating sheets of materials of the type provided with a plurality of approximately equal-length, annularly arranged parallel rollers positioned in longitudinally contacting relation to form the periphery of a chamber adapted to contain a processing solution, fluid-tight seals being provided between the ends of such rollers and flat side plates. The rollers are each comprised of a rigid shaft having a resilient covering of a thickness at least comparable to that of the roller shaft. The end of the roller and the side plate are contoured so that a portion of the roller adjacent to the outer diameter thereof provides a seal when brought into flush contact with the side plate. This contouring also permits the rollers to be longitudinally compressed to assist in providing the seal, while providing strain relief to the roller end in the vicinity of the shaft.
    • 一种用于处理类型的自动摄影胶片处理器或类似装置,其设置有多个大致相等长度的环形布置的平行辊,其定位在纵向接触关系中,以形成适于容纳处理溶液的流体室的周边 在这些辊子的端部和平的侧板之间设置密封件。 滚子各自包括刚性轴,该刚性轴具有至少与辊轴的厚度相当的厚度的弹性覆盖物。 辊和侧板的端部成形,使得与其外径相邻的辊的一部分当与侧板齐平地接触时提供密封。 这种轮廓也允许辊被纵向压缩以帮助提供密封,同时为轴附近的辊端提供应变消除。
    • 3. 发明申请
    • MAKING SEMICONDUCTOR BODIES FROM MOLTEN MATERIAL USING A FREE-STANDING INTERPOSER SHEET
    • 使用自由插入片材制作材料的半导体器件
    • US20140113156A1
    • 2014-04-24
    • US13990498
    • 2011-12-01
    • Ralf JonczykEmanuel M. Sachs
    • Ralf JonczykEmanuel M. Sachs
    • H01L21/02
    • H01L31/182C04B41/4539C04B41/5096C30B11/002C30B15/00C30B15/007C30B15/32C30B29/06H01L21/02002H01L21/02532H01L31/1804Y02E10/546Y02P70/521
    • An interposer sheet can be used for making semiconductor bodies, such as of silicon, such as for solar cell use. It is free-standing, very thin, flexible, porous and able to withstand the chemical and thermal environment of molten semiconductor without degradation. It is typically of a ceramic material, such as silica, silicon nitride, silicon oxynitride, silicon oxycarbide, silicon carbide, silicon carbonitride, silicon oxycarbonitride and others. It is provided between a forming surface of a mold sheet, and the molten material from which a semiconductor body will be formed. It may be secured to the forming surface or deposited upon the melt. The interposer sheet suppresses grain nucleation, and limits heat flow from the melt. It promotes separation of the semiconductor body from the forming surface. It can be fabricated before its use. Because free-standing and not adhered to the forming surface, problems of mismatch of CTE are minimized. The interposer sheet and semiconductor body are free to expand and contract relatively independently of the forming surface.
    • 插入片可用于制造诸如硅的半导体本体,例如用于太阳能电池。 它是独立的,非常薄的,柔性的,多孔的并且能够耐受熔融半导体的化学和热环境而不降解。 它通常是陶瓷材料,例如二氧化硅,氮化硅,氮氧化硅,碳氧化硅,碳化硅,碳氮化硅,碳氮氧化硅等。 设置在模板的成形表面和将形成半导体本体的熔融材料之间。 它可以固定到成形表面或沉积在熔体上。 插入片抑制晶粒成核,并限制来自熔体的热流。 它促进半导体主体与成形表面的分离。 它可以在使用之前进行制造。 由于独立且不粘附到成型表面,CTE的失配问题被最小化。 插入片和半导体本体相对于成形表面相对自由地膨胀和收缩。
    • 4. 发明授权
    • Wedge imprint patterning of irregular surface
    • 楔形印记图案不规则表面
    • US08633052B2
    • 2014-01-21
    • US12937810
    • 2009-04-17
    • Benjamin F. PolitoHolly G. GatesEmanuel M. Sachs
    • Benjamin F. PolitoHolly G. GatesEmanuel M. Sachs
    • H01L21/00
    • H01L31/182B29C43/021B29C43/222B29C59/02B29C2043/025B29C2043/3634B29C2043/3652B29C2043/465B29C2059/023B82Y10/00B82Y40/00G03F7/0002H01L31/0236H01L31/02363Y02E10/50
    • Patterned substrates for photovoltaic and other uses are made by pressing a flexible stamp upon a thin layer of resist material, which covers a substrate, such as a wafer. The resist changes phase or becomes flowable, flowing away from locations of impression, revealing the substrate, which is subjected to some shaping process, typically etching. Portions exposed by the stamp being are removed, and portions that protected by the resist, remain. A typical substrate is silicon, and a typical resist is a wax. Workpiece textures include extended grooves, discrete, spaced apart pits, and combinations and intermediates thereof. Platen or rotary patterning apparatus may be used. Rough and irregular workpiece substrates may be accommodated by extended stamp elements. Resist may be applied first to the workpiece, the stamp, or substantially simultaneously, in discrete locations, or over the entire surface of either. The resist dewets the substrate completely where desired.
    • 用于光伏和其他用途的图案化基板是通过将柔性印模压在覆盖诸如晶片的基底的抗蚀剂材料薄层上而制成的。 抗蚀剂改变相位或变得可流动,从印模的位置流出,露出经受一些成形过程的基底,通常是蚀刻。 被邮票曝光的部分被去除,并且被抗蚀剂保护的部分保留。 典型的基底是硅,典型的抗蚀剂是蜡。 工件纹理包括延伸凹槽,离散的,间隔开的凹坑,以及它们的组合和中间体。 可以使用压板或旋转图案形成装置。 粗糙和不规则的工件衬底可以由延长的印模元件容纳。 抗蚀剂可以首先施加到工件,印模或基本上同时地在离散的位置,或者在两者的整个表面上。 抗蚀剂在需要时完全将基材脱模。
    • 5. 发明申请
    • ARTICLES FORMED BY MANUFACTURING PROCESSES, SUCH AS THREE-DIMENSIONAL PRINTING, INCLUDING SOLVENT VAPOR FILMING AND THE LIKE
    • 制造工艺形成的文章,如三维印刷,包括溶剂蒸气膜和类似物
    • US20110076762A1
    • 2011-03-31
    • US12899033
    • 2010-10-06
    • James G. SerdyEmanuel M. Sachs
    • James G. SerdyEmanuel M. Sachs
    • C12N5/071B32B3/26B32B3/10
    • A61L27/56A61F2/28A61F2002/30062A61F2002/30224A61F2002/30225A61F2002/30785A61F2002/30985A61F2210/0004A61F2230/0069A61F2310/00293A61F2310/00353A61L27/54A61L2300/412A61L2300/434A61L2300/602B33Y10/00B33Y70/00B33Y80/00Y10T428/15Y10T428/24273Y10T428/31504
    • Methods of manufacturing an article use three-dimensional printing for a portion of the manufacturing. Three-dimensionally printing is conducted onto a powder bed which contains both organic-solvent-soluble, water-insoluble particles and water soluble, organic-solvent-insoluble particles. The water-soluble particles which may be selected for properties such as size and may include more than one substance. The organic-solvent-insoluble particles may further include at least one substantially insoluble substance such as a member of the calcium phosphate family. Printing may be done using an aqueous binder liquid. After removal of unbound powder, the preform may be exposed to the vapor of an organic solvent which causes the particles of organic-soluble-polymer to fuse to each other. This may further be followed by dissolving out the water-soluble particles, if such particles were present in the powder. Solvent vapor fusing together with the use of porogen particles may also be used in manufacturing methods other than 3DP. Rather than using organic solvent, heat responsive particles can be used, and can be filmed by elevated temperatures. Articles that may be produced by the described methods exhibit features such as a high porosity and an ability to undergo large deformations without breaking, and by at least partial springback from such deformation. The springback may be substantially instantaneous or may be time-dependent involving a time period of at least several seconds.
    • 制造制品的方法在制造的一部分中使用三维印刷。 将三维打印进行到含有有机溶剂可溶性,水不溶性颗粒和水溶性有机溶剂不溶性颗粒的粉末床上。 可以选择尺寸等性质的水溶性颗粒,并且可以包括多于一种物质。 有机溶剂不溶性颗粒可以进一步包括至少一种基本上不溶的物质,例如磷酸钙族的成员。 可以使用水性粘合剂液体进行印刷。 在去除未结合的粉末之后,预制件可能暴露于有机溶剂的蒸气中,这导致有机可溶聚合物颗粒彼此熔合。 如果这种颗粒存在于粉末中,则可以进一步溶解水溶性颗粒。 与使用致孔剂颗粒一起使用的溶剂蒸汽熔融也可用于3DP以外的制造方法。 不使用有机溶剂,可以使用热响应颗粒,并且可以通过升高的温度进行成膜。 可以通过所述方法产生的制品表现出诸如高孔隙率和经受大变形而不断裂的能力以及至少部分回弹的特征。 回弹可以基本上是瞬时的,或者可以是时间依赖性的,涉及至少几秒的时间段。