专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09172018B2 Islanded carrier for light emitting device 有权
标题翻译：用于发光装置的岛状载体
公开(公告)号：US09172018B2
公开(公告)日：2015-10-27
申请号：US13878432
申请日：2011-11-14
申请人： Qingwei Mo , Dirk Paul Joseph Vanderhaeghen
发明人： Qingwei Mo , Dirk Paul Joseph Vanderhaeghen
IPC分类号： H01L33/00 , H01L33/62 , H01L33/64
CPC分类号： H01L33/62 , H01L24/40 , H01L27/156 , H01L33/54 , H01L33/641 , H01L33/647 , H01L2224/16 , H01L2224/48091 , H01L2224/48472 , H01L2224/83801 , H01L2924/00014 , H01L2924/14 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2933/0075 , H01L2924/00012 , H01L2924/00 , H01L2224/37099
摘要： A low-cost conductive carrier element provides structural support to a light emitting device (LED) die, as well as electrical and thermal coupling to the LED die. A lead-frame is provided that includes at least one carrier element, the carrier element being partitioned to form distinguishable conductive regions to which the LED die is attached. When the carrier element is separated from the frame, the conductive regions are electrically isolated from each other. A dielectric may be placed between the conductive regions of the carrier element.
摘要翻译：低成本导电载体元件为发光器件（LED）管芯提供结构支撑，以及与LED管芯的电和热耦合。提供了一种引线框架，其包括至少一个载体元件，所述载体元件被分隔以形成与所述LED管芯连接的可区分的导电区域。当载体元件与框架分离时，导电区域彼此电隔离。电介质可以放置在载体元件的导电区域之间。

2. 发明申请

US20110297979A1 PASSIVATION FOR A SEMICONDUCTOR LIGHT EMITTING DEVICE 有权
标题翻译：半导体发光器件的钝化
公开(公告)号：US20110297979A1
公开(公告)日：2011-12-08
申请号：US12795272
申请日：2010-06-07
申请人： Frederic S. DIANA , Henry Kwong-Hin CHOY , Qingwei MO , Serge L. RUDAZ , Frank L. WEI , Daniel A, STEIGERWALD
发明人： Frederic S. DIANA , Henry Kwong-Hin CHOY , Qingwei MO , Serge L. RUDAZ , Frank L. WEI , Daniel A, STEIGERWALD
IPC分类号： H01L33/46 , H01L33/00 , H01L33/48 , H01L21/78
CPC分类号： H01L33/60 , H01L33/08 , H01L33/385 , H01L33/44 , H01L33/46 , H01L33/486 , H01L33/52 , H01L33/54 , H01L33/56 , H01L2933/0025 , H01L2933/005
摘要： In embodiments of the invention, a passivation layer is disposed over a side of a semiconductor structure including a light emitting layer disposed between an n-type region and a p-type region. A material configured to adhere to an underfill is disposed over an etched surface of the semiconductor structure.
摘要翻译：在本发明的实施例中，钝化层设置在包括设置在n型区域和p型区域之间的发光层的半导体结构的一侧上。配置成附着到底部填充物的材料设置在半导体结构的蚀刻表面上。

3. 发明授权

US07687810B2 Robust LED structure for substrate lift-off 有权
标题翻译：坚固的LED结构，用于衬底剥离
公开(公告)号：US07687810B2
公开(公告)日：2010-03-30
申请号：US11876404
申请日：2007-10-22
申请人： Qingwei Mo , Arnold Daguio
发明人： Qingwei Mo , Arnold Daguio
IPC分类号： H01L27/15 , H01L29/40 , H01L23/29
CPC分类号： H01L33/0079 , H01L33/0095 , H01L33/505 , H01L33/58 , H01L33/62 , H01L2224/13 , H01L2224/73204 , H01L2933/0041
摘要： An etching step is performed on an LED/substrate wafer to etch through the LED epitaxial layers entirely around each LED on the substrate wafer to form a gap between each LED on the wafer. The substrate is not etched. When the LEDs/substrates are singulated, edges of each substrate extend beyond edges of the LED die. The LEDs are flip-chips and are mounted on a submount with the LED die between the submount and the substrate. An insulating underfill material is injected under the LED die and also covers the sides of the LED die and “enlarged” substrate. The substrate is then removed by laser lift-off. The raised walls of the underfill that were along the edges of the enlarged substrate are laterally spaced from the edges of the LED die so that a phosphor plate can be easily positioned on top to the LED die with a relaxed positioning tolerance.
摘要翻译：在LED /衬底晶片上执行蚀刻步骤，以在衬底晶片上的每个LED上整个围绕LED外延层蚀刻，以在晶片上的每个LED之间形成间隙。衬底不被蚀刻。当LED /衬底被分割时，每个衬底的边缘延伸超过LED管芯的边缘。 LED是倒装芯片，并且安装在基座上，LED管芯位于基座和基板之间。在LED管芯下方注入绝缘底层填充材料，并且还覆盖LED管芯的侧面和“扩大的”基板。然后通过激光剥离去除衬底。沿着放大的基板的边缘的底部填充物的隆起的壁与LED模具的边缘横向间隔开，使得荧光体板可以容易地放置在LED模具的顶部，具有放松的定位公差。

4. 发明授权

US07622746B1 Highly reflective mounting arrangement for LEDs 失效
标题翻译： LED的高反射安装方式
公开(公告)号：US07622746B1
公开(公告)日：2009-11-24
申请号：US11378763
申请日：2006-03-17
申请人： Steven D. Lester , Frank Shum , Chao-Kun Lin , William So , Qingwei Mo
发明人： Steven D. Lester , Frank Shum , Chao-Kun Lin , William So , Qingwei Mo
IPC分类号： H01L31/0232
CPC分类号： H01L33/387 , H01L33/46
摘要： A semiconductor device emitting light about a predetermined wavelength comprising a structure comprising a plurality of layers, sometimes referred to as a stack, providing low resistance, high reflectivity and ohmic contacts to at least one semiconductor material.
摘要翻译：发射围绕预定波长的光的半导体器件包括包括多个层的结构，有时被称为堆叠，向至少一个半导体材料提供低电阻，高反射率和欧姆接触。

5. 发明申请

US20130221386A1 ISLANDED CARRIER FOR LIGHT EMITTING DEVICE 有权
标题翻译：用于发光装置的隔离载体
公开(公告)号：US20130221386A1
公开(公告)日：2013-08-29
申请号：US13878432
申请日：2011-11-14
申请人： Qingwei Mo , Dirk Paul Joseph Vanderhaeghen
发明人： Qingwei Mo , Dirk Paul Joseph Vanderhaeghen
IPC分类号： H01L33/62
CPC分类号： H01L33/62 , H01L24/40 , H01L27/156 , H01L33/54 , H01L33/641 , H01L33/647 , H01L2224/16 , H01L2224/48091 , H01L2224/48472 , H01L2224/83801 , H01L2924/00014 , H01L2924/14 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2933/0075 , H01L2924/00012 , H01L2924/00 , H01L2224/37099
摘要： A low-cost conductive carrier element provides structural support to a light emitting device (LED) die, as well as electrical and thermal coupling to the LED die. A lead-frame is provided that includes at least one carrier element, the carrier element being partitioned to form distinguishable conductive regions to which the LED die is attached. When the carrier element is separated from the frame, the conductive regions are electrically isolated from each other. A dielectric may be placed between the conductive regions of the carrier element.
摘要翻译：低成本导电载体元件为发光器件（LED）管芯提供结构支撑，以及与LED管芯的电和热耦合。提供了一种引线框架，其包括至少一个载体元件，所述载体元件被分隔以形成与所述LED管芯连接的可区分的导电区域。当载体元件与框架分离时，导电区域彼此电隔离。电介质可以放置在载体元件的导电区域之间。

6. 发明授权

US08471282B2 Passivation for a semiconductor light emitting device 有权
标题翻译：钝化半导体发光器件
公开(公告)号：US08471282B2
公开(公告)日：2013-06-25
申请号：US12795272
申请日：2010-06-07
申请人： Frederic S. Diana , Henry Kwong-Hin Choy , Qingwei Mo , Serge I. Rudaz , Frank L. Wei , Daniel A. Steigerwald
发明人： Frederic S. Diana , Henry Kwong-Hin Choy , Qingwei Mo , Serge I. Rudaz , Frank L. Wei , Daniel A. Steigerwald
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L33/08 , H01L33/385 , H01L33/44 , H01L33/46 , H01L33/486 , H01L33/52 , H01L33/54 , H01L33/56 , H01L2933/0025 , H01L2933/005
摘要： In embodiments of the invention, a passivation layer is disposed over a side of a semiconductor structure including a light emitting layer disposed between an n-type region and a p-type region. A material configured to adhere to an underfill is disposed over an etched surface of the semiconductor structure.
摘要翻译：在本发明的实施例中，钝化层设置在包括设置在n型区域和p型区域之间的发光层的半导体结构的一侧上。配置成附着到底部填充物的材料设置在半导体结构的蚀刻表面上。

7. 发明申请

US20090101929A1 ROBUST LED STRUCTURE FOR SUBSTRATE LIFT-OFF 有权
标题翻译：用于底板提升的坚固的LED结构
公开(公告)号：US20090101929A1
公开(公告)日：2009-04-23
申请号：US11876404
申请日：2007-10-22
申请人： Qingwei Mo , Arnold Daguio
发明人： Qingwei Mo , Arnold Daguio
IPC分类号： H01L33/00
CPC分类号： H01L33/0079 , H01L33/0095 , H01L33/505 , H01L33/58 , H01L33/62 , H01L2224/13 , H01L2224/73204 , H01L2933/0041
摘要： An etching step is performed on an LED/substrate wafer to etch through the LED epitaxial layers entirely around each LED on the substrate wafer to form a gap between each LED on the wafer. The substrate is not etched. When the LEDs/substrates are singulated, edges of each substrate extend beyond edges of the LED die. The LEDs are flip-chips and are mounted on a submount with the LED die between the submount and the substrate. An insulating underfill material is injected under the LED die and also covers the sides of the LED die and “enlarged” substrate. The substrate is then removed by laser lift-off. The raised walls of the underfill that were along the edges of the enlarged substrate are laterally spaced from the edges of the LED die so that a phosphor plate can be easily positioned on top to the LED die with a relaxed positioning tolerance.
摘要翻译：在LED /衬底晶片上执行蚀刻步骤，以在衬底晶片上的每个LED上整个围绕LED外延层蚀刻，以在晶片上的每个LED之间形成间隙。衬底不被蚀刻。当LED /衬底被分割时，每个衬底的边缘延伸超过LED管芯的边缘。 LED是倒装芯片，并且安装在基座上，LED管芯位于基座和基板之间。在LED管芯下方注入绝缘底层填充材料，并且还覆盖LED管芯的侧面和“扩大的”基板。然后通过激光剥离去除衬底。沿着放大的基板的边缘的底部填充物的隆起的壁与LED模具的边缘横向间隔开，使得荧光体板可以容易地放置在LED模具的顶部，具有放松的定位公差。

8. 发明申请

US20060126144A1 Optical microscanning system and method with embedded scannable photo-pumped light source 审中-公开
标题翻译：具有嵌入式可扫描光泵浦光源的光学显微系统和方法
公开(公告)号：US20060126144A1
公开(公告)日：2006-06-15
申请号：US11008077
申请日：2004-12-09
申请人： Qingwei Mo
发明人： Qingwei Mo
IPC分类号： G02B26/08
CPC分类号： G02B26/0833 , G02B26/101 , G02B26/105
摘要： An optical microscanning system for selectively emitting a highly coherent, collimated, and monochromatic beam of light (122) in a desired trajectory and selectively redirecting the trajectory within a scan field. The system includes a fixed light source (112) of substantially coherent, collimated, and monochromatic light (118) and an optically pumped light source (120) of highly coherent, collimated, and monochromatic light (122). The optically pumped light source (120) is optically pumped by the fixed light source (112). The optically pumped light source (120) can selectively redirect its light output (122). Also, a method of manufacturing such an optical microscanning system. A cavity is etched (156) in a base substrate. Two electrodes are provided (158) at the cavity floor. A second layer is provided (160) over the mouth of the cavity. A mirror layer is bonded (162) onto the second layer. Spacers are etched (164) through the mirror layer and second layer to define a substrate section (165). The mirror layer is etched to define a mirror (166).
摘要翻译：一种光学显微系统，用于以期望的轨迹选择性地发射高度相干，准直和单色光束（122），并选择性地重定向扫描场内的轨迹。该系统包括基本相干，准直和单色光（118）的固定光源（112）和高度相干，准直和单色光（122）的光泵浦光源（120）。光泵浦光源（120）由固定光源（112）光泵浦。光泵浦光源（120）可以选择性地重定向其光输出（122）。另外，制造这种光学显微镜系统的方法。在基底衬底中刻蚀空腔（156）。在空腔底部设有两个电极（158）。在空腔的口部上设置有第二层（160）。将镜层（162）结合到第二层上。通过镜层和第二层蚀刻间隔物（164）以限定衬底部分（165）。蚀刻镜层以限定反射镜（166）。

9. 发明授权

US08324652B1 Highly reflective mounting arrangement for LEDs 有权
标题翻译： LED的高反射安装方式
公开(公告)号：US08324652B1
公开(公告)日：2012-12-04
申请号：US12610261
申请日：2009-10-30
申请人： Steven D. Lester , Frank Shum , Chao-Kun Lin , William So , Qingwei Mo
发明人： Steven D. Lester , Frank Shum , Chao-Kun Lin , William So , Qingwei Mo
IPC分类号： H01L33/00
CPC分类号： H01L33/387 , H01L33/46
摘要： A semiconductor device emitting light about a predetermined wavelength comprising a structure comprising a plurality of layers, sometimes referred to as a stack, providing low resistance, high reflectivity and ohmic contacts to at least one semiconductor material.
摘要翻译：发射围绕预定波长的光的半导体器件包括包括多个层的结构，有时被称为堆叠，向至少一个半导体材料提供低电阻，高反射率和欧姆接触。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式