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1. 发明授权

US07469457B2 Method of removing integrated circuit chip package and detachment jig therefor 有权
标题翻译：去除集成电路芯片封装和拆卸夹具的方法
公开(公告)号：US07469457B2
公开(公告)日：2008-12-30
申请号：US11061471
申请日：2005-02-22
申请人： Tetsuji Ishikawa , Osamu Saitou , Masakazu Kobayashi , Hideaki Terauchi
发明人： Tetsuji Ishikawa , Osamu Saitou , Masakazu Kobayashi , Hideaki Terauchi
IPC分类号： B23P19/00
CPC分类号： H05K13/0491 , H01L24/81 , H01L2224/16 , H01L2224/81801 , H01L2924/00011 , H01L2924/00014 , H01L2924/14 , Y10T29/49821 , Y10T29/49822 , Y10T29/53274 , Y10T29/53283 , H01L2924/00 , H01L2224/0401
摘要： A detachment jig is placed on a printed circuit board. Advancement of an inclined surface of the detachment jig is received on a solder bump of solid state disposed between the printed circuit board and an integrated circuit chip package. The solder bump melts to remove restraint to the advancement of the inclined surface, so that the inclined surface advances into a space between the printed circuit board and the chip package in response to the melt of the solder bump. A force to lift the chip package in the direction perpendicular to the surface of the printed circuit board acts on the chip package after the solder bump has completely melted down. Detachment of an electrically conductive pad is thus reliably prevented on the printed circuit board. The chip package can solely be removed without inducing detachment of the electrically conductive pad on the printed circuit board.
摘要翻译：分离夹具放置在印刷电路板上。在布置在印刷电路板和集成电路芯片封装之间的固态焊锡凸块上接纳有分离夹具倾斜表面的前进。焊料凸块熔化以消除对倾斜表面的推进的限制，使得倾斜表面响应于焊料凸块的熔化而前进到印刷电路板和芯片封装之间的空间。在焊料凸块完全熔化之后，沿与印刷电路板表面垂直的方向提升芯片封装的力作用在芯片封装上。因此，可以在印刷电路板上可靠地防止导电垫的分离。芯片封装可以单独去除，而不会导致印刷电路板上的导电焊盘脱落。

2. 发明授权

US06853788B2 Resin composition for a coating for an optical fiber, and coated optical fiber and optical fiber unit using the same 失效
标题翻译：用于光纤的涂层的树脂组合物，以及使用其的包覆光纤和光纤单元
公开(公告)号：US06853788B2
公开(公告)日：2005-02-08
申请号：US10429027
申请日：2003-05-05
申请人： Atsushi Oshio , Osamu Saitou
发明人： Atsushi Oshio , Osamu Saitou
IPC分类号： C08G18/48 , C08G18/67 , C09D175/16 , G02B6/02
CPC分类号： C09D175/16 , C08G18/4854 , C08G18/672 , C08G18/48
摘要： A resin composition for a coating for an optical fiber which comprises a radical polymerizable oligomer (A) and a radical polymerizable monomer (B), wherein (A) comprises a radical polymerizable oligomer (A1) with Mn of 600 to 1600 formed by reacting compounds (1) to (3) below: (1) an aliphatic polyol compound with Mn of 50 to 600, (2) a polyisocyanate compound with a ring structure, and (3) a compound with a hydroxyl group and a radical polymerizable unsaturated group; and a radical polymerizable oligomer (A2) formed by reacting compounds (4) to (6) below: (4) an aliphatic polyol compound with Mn of 800 to 10,000, (5) a polyisocyanate compound, and (6) a compound with a hydroxyl group and a radical polymerizable unsaturated group; a mass ratio (A1)/(A2) is 20/80 to 80/20, and a concentration of urethane linkages within the resin composition is 1.85 to 3.00 mol/kg.
摘要翻译：一种光纤用涂料用树脂组合物，其特征在于，含有可自由基聚合的低聚物（A）和自由基聚合性单体（B），其中，（A）包含Mn为600〜1600的自由基聚合性低聚物（A1）（1）〜（3）中，（1）Mn为50〜600的脂肪族多元醇化合物，（2）具有环结构的多异氰酸酯化合物，（3）具有羟基和自由基聚合性不饱和基团的化合物 ; 和由下述化合物（4）〜（6）反应形成的自由基聚合性低聚物（A2）：（4）Mn为800〜10000的脂族多元醇化合物，（5）多异氰酸酯化合物，（6）羟基和自由基聚合的不饱和基团; 质量比（A1）/（A2）为20/80〜80/20，树脂组合物中的氨基甲酸酯键的浓度为1.85〜3.00mol / kg。

3. 发明申请

US20090056839A1 Method for Improving Residual Stress of Structure Member 审中-公开
标题翻译：改善结构件残余应力的方法
公开(公告)号：US20090056839A1
公开(公告)日：2009-03-05
申请号：US12193791
申请日：2008-08-19
申请人： Satoru Aoike , Fuminori Iwamatsu , Yuka Fukuda , Osamu Saitou
发明人： Satoru Aoike , Fuminori Iwamatsu , Yuka Fukuda , Osamu Saitou
IPC分类号： C21D9/08 , F16L55/10
CPC分类号： F16L55/103 , C21D1/62 , C21D6/02 , C21D6/04 , C21D9/08 , C21D9/085 , C21D9/50 , C21D2211/001 , F16L13/06
摘要： A method for improving residual stress of a structure member, comprising steps of:disposing coolant vessels around a pipe being the structure member at an upstream position and a downstream position of a welded portion of the pipe;wrapping a heat insulation member around an outer periphery of the pipe at a center portion in an axial direction of the pipe in each of the coolant vessels;forming the ice plug in the pipe at each position disposing the coolant vessels by cooling an outer surface of the pipe wrapping the heat insulation member in the coolant vessels; andfreezing water between the ice plugs in the pipe by cooling the outer surface of the pipe between the ice plugs.
摘要翻译：一种改善结构构件的残余应力的方法，包括以下步骤：在管的焊接部分的上游位置和下游位置处将冷却剂容器设置在作为结构构件的管道周围; 在每个冷却剂容器中在管的轴向方向的中心部分处围绕管的外周缠绕绝热构件; 通过冷却将隔热构件包裹在冷却剂容器中的管的外表面，在布置冷却剂容器的每个位置处在管中形成冰塞; 以及通过在冰塞之间冷却管道的外表面来在管道中的冰塞之间的冷冻水。

4. 发明授权

US06381512B1 Molding-condition recovery device in injection molding machine 失效
标题翻译：注塑机成型条件回收装置
公开(公告)号：US06381512B1
公开(公告)日：2002-04-30
申请号：US09321355
申请日：1999-05-27
申请人： Osamu Saitou , Kazuo Kubota
发明人： Osamu Saitou , Kazuo Kubota
IPC分类号： B29C4500
CPC分类号： B29C45/766 , B29C45/76 , B29C2945/76163 , B29C2945/76551 , B29C2945/76939
摘要： There is provided a molding-condition recovery device which may easily recover the molding condition having been applied in the past, and also permits the storage of the past molding conditions in a memory having small capacity. A reduction in required memory capacity of the modification history storage file is permitted by storing only data of a component subjected to setting modification, among the components of the molding condition, in a modification history storage file. The recovery of the past molding condition is made by replacing all the set values of the presently-applied molding condition or the data in a temporary file stored with all the set values of the first molding condition with data in the modification history storage file in sequence.
摘要翻译：提供了一种成型条件回收装置，其可以容易地恢复已经施加的成型条件，并且还允许将过去的成型条件存储在具有小容量的存储器中。修改历史记录存储文件的所需存储容量的减少是通过在成型条件的组成部分中仅存储经过设置修改的部件的数据而被修改的。通过用修改历史存储文件中的数据依次替换存储有第一成型条件的所有设定值的临时文件中的所有设定值，将当前施加的成型条件的所有设定值或修改历史存储文件中的数据替换。

5. 发明授权

US06701800B2 Pedal support structure for vehicle 失效
标题翻译：车辆踏板支撑结构
公开(公告)号：US06701800B2
公开(公告)日：2004-03-09
申请号：US10162569
申请日：2002-06-06
申请人： Osamu Saitou , Hitoshi Harashima , Masashi Ishida , Yasunori Sugita , Hirokazu Chosho , Tatsuya Okuno , Masafumi Kotani , Hiroaki Maruyama , Nozomu Sutou
发明人： Osamu Saitou , Hitoshi Harashima , Masashi Ishida , Yasunori Sugita , Hirokazu Chosho , Tatsuya Okuno , Masafumi Kotani , Hiroaki Maruyama , Nozomu Sutou
IPC分类号： G05G114
CPC分类号： G05G1/327 , B60R21/09 , B60T7/065 , Y10T74/20528
摘要： A pedal support structure for use in a vehicle contains a toe board, a steering support beam, a master cylinder, a pair of pedal support elements including pedal support portions, a supporting mechanism provided between the pedal support portions supporting a pedal lever, and a catcher bracket. When an impact is applied to the vehicle, the pedal support portions are spread apart so as to disconnect the pedal lever from the pedal supporting mechanism and the movement of the pedal lever in a direction toward an operator of the vehicle is restricted by the pedal lever contacting the catcher bracket.
摘要翻译：用于车辆的踏板支撑结构包括脚趾板，转向支撑梁，主缸，包括踏板支撑部分的一对踏板支撑元件，设置在支撑踏板杆的踏板支撑部分之间的支撑机构和捕手支架当对车辆施加冲击时，踏板支撑部分被分开以便将踏板杆与踏板支撑机构分离，并且踏板杆在朝向车辆操作者的方向上的移动被踏板杆限制联系捕手支架。

6. 发明申请

US20060107513A1 Method of removing integrated circuit chip package and detachment jig therefor 有权
标题翻译：去除集成电路芯片封装和拆卸夹具的方法
公开(公告)号：US20060107513A1
公开(公告)日：2006-05-25
申请号：US11061471
申请日：2005-02-22
申请人： Tetsuji Ishikawa , Osamu Saitou , Masakazu Kobayashi , Hideaki Terauchi
发明人： Tetsuji Ishikawa , Osamu Saitou , Masakazu Kobayashi , Hideaki Terauchi
IPC分类号： B23P19/00
CPC分类号： H05K13/0491 , H01L24/81 , H01L2224/16 , H01L2224/81801 , H01L2924/00011 , H01L2924/00014 , H01L2924/14 , Y10T29/49821 , Y10T29/49822 , Y10T29/53274 , Y10T29/53283 , H01L2924/00 , H01L2224/0401
摘要： A detachment jig is placed on a printed circuit board. Advancement of an inclined surface of the detachment jig is received on a solder bump of solid state disposed between the printed circuit board and an integrated circuit chip package. The solder bump melts to remove restraint to the advancement of the inclined surface, so that the inclined surface advances into a space between the printed circuit board and the chip package in response to the melt of the solder bump. A force to lift the chip package in the direction perpendicular to the surface of the printed circuit board acts on the chip package after the solder bump has completely melted down. Detachment of an electrically conductive pad is thus reliably prevented on the printed circuit board. The chip package can solely be removed without inducing detachment of the electrically conductive pad on the printed circuit board.
摘要翻译：分离夹具放置在印刷电路板上。在布置在印刷电路板和集成电路芯片封装之间的固态焊锡凸块上接纳有分离夹具倾斜表面的前进。焊料凸块熔化以消除对倾斜表面的推进的限制，使得倾斜表面响应于焊料凸块的熔化而前进到印刷电路板和芯片封装之间的空间。在焊料凸块完全熔化之后，沿与印刷电路板表面垂直的方向提升芯片封装的力作用在芯片封装上。因此，可以在印刷电路板上可靠地防止导电垫的分离。芯片封装可以单独去除，而不会导致印刷电路板上的导电焊盘脱落。

7. 发明授权

US06850682B2 Resin composition for coating optical fiber and coated optical fiber and optical fiber unit using the same 失效
标题翻译：用于涂覆光纤和涂覆光纤的树脂组合物和使用其的光纤单元
公开(公告)号：US06850682B2
公开(公告)日：2005-02-01
申请号：US10326384
申请日：2002-12-23
申请人： Kiyoshi Takemura , Akihiro Iwamoto , Osamu Saitou
发明人： Kiyoshi Takemura , Akihiro Iwamoto , Osamu Saitou
IPC分类号： C03C25/10 , C08F290/00 , C08F290/06 , C08G18/67 , C08G18/81 , C09D175/16 , G02B6/02 , G02B6/22
CPC分类号： C09D175/16 , C03C25/106 , C08F290/00 , C08F290/06 , C08G18/672 , C08G18/8175 , Y10T428/2904 , Y10T428/2913 , C08G18/48
摘要： A resin composition for an optical fiber is provided which can be sufficiently cured even in high-speed processing (at a low light energy dose) to obtain a cured article having a Young's modulus suitable for use for an optical fiber, and also causes neither increase in viscosity nor deposition of solids in storage for a long period or in storage at a high temperature and can be easily coated even after such storage. A coated fiber and an optical fiber unit, which use the resin composition are also provided. The composition contains a radical polymerizable compound (A); a photopolymerization initiator (B); a sulfide (C) represented by the formulas: R1—S—R1, R2OOCCH2CH2—S—CH2CH2COOR2, (R3—SCH2CH2COOCH2)4C, HOCH2CH2S—R4—SCH2CH2OH, R8—SCH2CH2COOR9; and an organic amine (D) represented by the formula:
摘要翻译：提供一种光纤用树脂组合物，即使在高速加工（低能量剂量）下也能够充分固化，得到适合于光纤的杨氏模量的固化物，也不会增加粘度或固体沉积长期储存或高温储存，即使在这种储存之后也可以容易地涂布。还提供了使用树脂组合物的涂布纤维和光纤单元。该组合物含有可自由基聚合的化合物（A）; 光聚合引发剂（B）; 由下式表示的硫化物（C）：R1-S-R1，R2OOCCH2CH2-S-CH2CH2COOR2，（R3-SCH2CH2COOCH2）4C，HOCH2CH2S-R4-SCH2CH2OH，R8-SCH2CH2COOR9; 和由下式表示的有机胺（D）：

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