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1. 发明授权

US06736952B2 Method and apparatus for electrochemical planarization of a workpiece 有权
标题翻译：工件电化学平面化的方法和装置
公开(公告)号：US06736952B2
公开(公告)日：2004-05-18
申请号：US09781593
申请日：2001-02-12
申请人： Ismail Emesh , Saket Chadda , Nikolay N. Korovin , Brian L. Mueller
发明人： Ismail Emesh , Saket Chadda , Nikolay N. Korovin , Brian L. Mueller
IPC分类号： B23H508
CPC分类号： B24B37/20 , B23H5/08 , B24B37/12 , C25F3/02 , C25F7/00 , H01L21/32125 , H01L21/7684
摘要： An electrochemical planarization apparatus for planarizing a metallized surface on a workpiece includes a polishing pad and a platen. The platen is formed of conductive material, is disposed proximate to the polishing pad and is configured to have a negative charge during at least a portion of a planarization process. At least one electrical conductor is positioned within the platen. The electrical conductor has a first end connected to a power source. A workpiece carrier is configured to carry a workpiece and press the workpiece against the polishing pad. The power source applies a positive charge to the workpiece via the electrical conductor so that an electric potential difference between the metallized surface of the workpiece and the platen is created to remove at least a portion of the metallized surface from the workpiece.
摘要翻译：用于平坦化工件上的金属化表面的电化学平面化装置包括抛光垫和压板。压板由导电材料形成，靠近抛光垫设置并且被配置为在平坦化处理的至少一部分期间具有负电荷。至少一个电导体位于压板内。电导体具有连接到电源的第一端。工件载体构造成承载工件并将工件压靠在抛光垫上。电源通过电导体向工件施加正电荷，使得产生工件的金属化表面和压板之间的电位差以从工件移除金属化表面的至少一部分。

2. 发明授权

US06582277B2 Method for controlling a process in a multi-zonal apparatus 有权
标题翻译：用于控制多区域设备中的过程的方法
公开(公告)号：US06582277B2
公开(公告)日：2003-06-24
申请号：US09846965
申请日：2001-05-01
申请人： Nikolay N. Korovin
发明人： Nikolay N. Korovin
IPC分类号： B24B4900
CPC分类号： B24B37/042 , B24B41/061 , B24B49/16
摘要： A method for controlling a process in a multi-zonal processing apparatus and specifically for determining the optimum values to set for processing parameters J(Zi) in each of the zones of that apparatus includes processing a test work piece in the apparatus with initial values Jl(Zi) of the parameters in each zone i to achieve a process result Ql(x). Then a process result Qf(x) to be expected from incremental changes in the parameters to values Jf(x) is calculated. The expected process results Qf(x) are related to the initial process results Ql(x) by the relationship: Qf(x)=Ql(x)*Jf(x)/Jl(x). After determining optimum values of J(Zi) to reduce the difference between the expected process result and a target process result, a work piece is processed through the process apparatus using those optimum values of J(Zi).
摘要翻译：一种用于控制多区域处理设备中的处理并且具体地用于确定为该设备的每个区域中的处理参数J（Zi）设置的最佳值的方法，包括：在设备中处理具有初始值J1的测试工件（Zi），以获得处理结果Q1（x）。然后计算从参数的增量变化到值Jf（x）的期望的处理结果Qf（x）。预期过程结果Qf（x）通过以下关系与初始过程结果Q1（x）相关：确定J（Zi）的最优值以减少预期过程结果与目标过程结果之间的差异，工件通过使用J（Zi）的最佳值的处理装置进行处理。

3. 发明授权

US07140956B1 Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece 有权
公开(公告)号：US07140956B1
公开(公告)日：2006-11-28
申请号：US11324038
申请日：2005-12-29
申请人： Nikolay N. Korovin , Stephen C. Schultz , John D. Herb , James L. Farmer
发明人： Nikolay N. Korovin , Stephen C. Schultz , John D. Herb , James L. Farmer
IPC分类号： B24B20/00
CPC分类号： B24B37/30 , B24B41/061
摘要： An apparatus for planarizing a work piece includes an easily assembled work carrier. The carrier includes a carrier insert having a work piece bladder clamped to a carrier backing plate with a plurality of clamps to form a plurality of web plenums. The outer edge of the bladder is supported by a rib that is coupled to a carrier plenum. By adjusting the pressure in the carrier plenum, the pressure exerted on the edge of a work piece during a planarization operation can be adjusted. The carrier also includes a floating wear ring that surrounds the work piece bladder and a work piece mounted on that bladder. By adjusting the force exerted by the wear ring on a polishing pad, independently of the pressure exerted by the rib at the edge of the bladder, the material removal rate near the edge of the work piece can be controlled.

4. 发明授权

US06974525B2 Method and apparatus for electrochemical planarization of a workpiece 有权
标题翻译：工件电化学平面化的方法和装置
公开(公告)号：US06974525B2
公开(公告)日：2005-12-13
申请号：US10709598
申请日：2004-05-17
申请人： Ismail Emesh , Saket Chadda , Nikolay N. Korovin , Brian L. Mueller
发明人： Ismail Emesh , Saket Chadda , Nikolay N. Korovin , Brian L. Mueller
IPC分类号： B23H5/08 , B24B37/12 , B24B37/20 , H01L21/321 , C25F3/02
CPC分类号： B24B37/20 , B23H5/08 , B24B37/12 , C25F3/02 , C25F7/00 , H01L21/32125 , H01L21/7684
摘要： An electrochemical planarization apparatus for planarizing a metallized surface on a workpiece includes a polishing pad and a platen. The platen is formed of conductive material, is disposed proximate to the polishing pad and is configured to have a negative charge during at least a portion of a planarization process. At least one electrical conductor is positioned within the platen. The electrical conductor has a first end connected to a power source. A workpiece carrier is configured to carry a workpiece and press the workpiece against the polishing pad. The power source applies a positive charge to the workpiece via the electrical conductor so that an electric potential difference between the metallized surface of the workpiece and the platen is created to remove at least a portion of the metallized surface from the workpiece.
摘要翻译：用于平坦化工件上的金属化表面的电化学平面化装置包括抛光垫和压板。压板由导电材料形成，靠近抛光垫设置并且被配置为在平坦化处理的至少一部分期间具有负电荷。至少一个电导体位于压板内。电导体具有连接到电源的第一端。工件载体构造成承载工件并将工件压靠在抛光垫上。电源通过电导体向工件施加正电荷，使得产生工件的金属化表面和压板之间的电位差以从工件移除金属化表面的至少一部分。

5. 发明授权

US06659850B2 Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece 有权
公开(公告)号：US06659850B2
公开(公告)日：2003-12-09
申请号：US10120600
申请日：2002-04-11
申请人： Nikolay N. Korovin , Stephen C. Schultz , John D. Herb , James L. Farmer
发明人： Nikolay N. Korovin , Stephen C. Schultz , John D. Herb , James L. Farmer
IPC分类号： B24B2900
CPC分类号： B24B37/30 , B24B37/32 , B24B49/16
摘要： An apparatus for planarizing a work piece includes an easily assembled work carrier. The carrier includes a carrier insert having a work piece bladder clamped to a carrier backing plate with a plurality of clamps to form a plurality of web plenums. The outer edge of the bladder is supported by a rib that is coupled to a carrier plenum. By adjusting the pressure in the carrier plenum, the pressure exerted on the edge of a work piece during a planarization operation can be adjusted. The carrier also includes a floating wear ring that surrounds the work piece bladder and a work piece mounted on that bladder. By adjusting the force exerted by the wear ring on a polishing pad, independently of the pressure exerted by the rib at the edge of the bladder, the material removal rate near the edge of the work piece can be controlled.

6. 发明授权

US08268135B2 Method and apparatus for electrochemical planarization of a workpiece 有权
标题翻译：工件电化学平面化的方法和装置
公开(公告)号：US08268135B2
公开(公告)日：2012-09-18
申请号：US11164270
申请日：2005-11-16
申请人： Ismail Emesh , Saket Chadda , Nikolay N Korovin , Brian L Mueller
发明人： Ismail Emesh , Saket Chadda , Nikolay N Korovin , Brian L Mueller
IPC分类号： C25F3/16 , C25F3/30
CPC分类号： B24B37/20 , B23H5/08 , B24B37/12 , C25F3/02 , C25F7/00 , H01L21/32125 , H01L21/7684
摘要： An electrochemical planarization apparatus for planarizing a metallized surface on a workpiece includes a polishing pad and a platen. The platen is formed of conductive material, is disposed proximate to the polishing pad and is configured to have a negative charge during at least a portion of a planarization process. At least one electrical conductor is positioned within the platen. The electrical conductor has a first end connected to a power source. A workpiece carrier is configured to carry a workpiece and press the workpiece against the polishing pad. The power source applies a positive charge to the workpiece via the electrical conductor so that an electric potential difference between the metallized surface of the workpiece and the platen is created to remove at least a portion of the metallized surface from the workpiece.
摘要翻译：用于平坦化工件上的金属化表面的电化学平面化装置包括抛光垫和压板。压板由导电材料形成，靠近抛光垫设置并且被配置为在平坦化处理的至少一部分期间具有负电荷。至少一个电导体位于压板内。电导体具有连接到电源的第一端。工件载体构造成承载工件并将工件压靠在抛光垫上。电源通过电导体向工件施加正电荷，使得产生工件的金属化表面和压板之间的电位差以从工件移除金属化表面的至少一部分。

7. 发明授权

US06390905B1 Workpiece carrier with adjustable pressure zones and barriers 有权
标题翻译：工件载体具有可调的压力区和屏障
公开(公告)号：US06390905B1
公开(公告)日：2002-05-21
申请号：US09540476
申请日：2000-03-31
申请人： Nikolay N. Korovin , Stephen C. Schultz , John D. Herb , James L. Farmer
发明人： Nikolay N. Korovin , Stephen C. Schultz , John D. Herb , James L. Farmer
IPC分类号： B24B2900
CPC分类号： B24B37/30 , B24B37/32 , B24B49/16
摘要： An apparatus and method are disclosed for planarizing a wafer in a carrier with adjustable pressure zones and adjustable barriers between zones. The carrier has an independently controlled central zone and concentric surrounding zones for distributing the pressure on the backside of a wafer while the wafer is being pressed against an abrasive surface in a chemical-mechanical polishing tool. The pressure zones may be created by mounting an elastic web diaphragm to a carrier housing that has a plurality of recesses. A corresponding plurality of elastic ring shaped ribs may extend from the web diaphragm opposite the recesses. The plurality of ring shaped ribs thereby defines a central zone surrounded by one or more concentric surrounding zones. The zones and barriers may be individually pressurized by utilizing corresponding fluid communication paths during the planarization process. A method for practicing the present invention starts by selecting a carrier with adjustable pressure zones that correspond to the number and locations of the bulges and troughs on the wafer. Zones that correspond to high regions receive greater pressure than zones that correspond to low regions on the wafer. The pressure on the barriers between zones may be optimized to prevent leakage between zones or to smooth the pressure distribution between neighboring zones on the back surface of the wafer.
摘要翻译：公开了一种用于在载体中平坦化晶片的装置和方法，其具有可调节的压力区域和区域之间的可调节的屏障。载体具有独立控制的中心区域和同心的周围区域，用于在晶片在化学机械抛光工具中被压靠在磨料表面上时分配晶片背面的压力。可以通过将弹性腹板隔膜安装到具有多个凹部的托架壳体上来产生压力区域。相应的多个弹性环形肋可以从腹板隔膜相对于凹部延伸。因此，多个环形肋限定了由一个或多个同心周围区域包围的中心区域。通过在平坦化过程中利用相应的流体连通路径可以单独加压区域和障碍物。一种用于实施本发明的方法开始于选择具有可调压力区域的载体，其对应于晶片上的凸起和凹槽的数量和位置。对应于高区域的区域比对应于晶片上的低区域的区域承受更大的压力。可以优化区域之间的屏障上的压力，以防止区域之间的泄漏或者平滑晶片背表面上的相邻区域之间的压力分布。

8. 发明授权

US06336853B1 Carrier having pistons for distributing a pressing force on the back surface of a workpiece 失效
标题翻译：载体具有用于在工件的后表面上分布按压力的活塞
公开(公告)号：US06336853B1
公开(公告)日：2002-01-08
申请号：US09541414
申请日：2000-03-31
申请人： Stephen C. Schultz , John D. Herb , Nikolay N. Korovin
发明人： Stephen C. Schultz , John D. Herb , Nikolay N. Korovin
IPC分类号： B24B500
CPC分类号： B24B37/30
摘要： An apparatus and method are disclosed for a carrier that is able to create independently controllable pressure zones on the back surface of a wafer while the front surface of the wafer is being planarizing against an abrasive surface. The carrier has a central disk shaped recess surrounded by a plurality of concentric ring shaped recesses. The recesses are covered by a diaphragm thereby creating a central disk shaped plenum and a plurality of surrounding ring shaped plenums. A central disk shaped piston and a plurality of surrounding ring shaped pistons are suspended on the diaphragm so that a portion of each piston may move in and out of their corresponding plenum in the carrier. An independently controllable fluid communication path is placed in fluid communication with each plenum thereby allowing the pressure exerted on each piston to be independently controllable.
摘要翻译：公开了一种用于载体的装置和方法，其能够在晶片的背面上创建独立可控的压力区，同时晶片的前表面正对着研磨表面进行平面化。载体具有由多个同心环形凹部包围的中心盘状凹部。凹槽由隔膜覆盖，从而形成中央盘形集气室和多个周围的环形气室。中心圆盘形活塞和多个周围的环形活塞悬挂在隔膜上，使得每个活塞的一部分可以在载体中进出其相应的气室。独立可控的流体连通路径被放置成与每个通风室流体连通，从而允许施加在每个活塞上的压力是独立可控的。

9. 发明授权

US07025664B2 Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece 有权
公开(公告)号：US07025664B2
公开(公告)日：2006-04-11
申请号：US10830412
申请日：2004-04-21
申请人： Nikolay N. Korovin , Stephen C. Schultz , John D. Herb , James L. Farmer
发明人： Nikolay N. Korovin , Stephen C. Schultz , John D. Herb , James L. Farmer
IPC分类号： B24B29/00
CPC分类号： B24B37/30 , B24B37/32 , B24B49/16
摘要： An apparatus for planarizing a work piece includes an easily assembled work carrier. The carrier includes a carrier insert having a work piece bladder clamped to a carrier backing plate with a plurality of clamps to form a plurality of web plenums. The outer edge of the bladder is supported by a rib that is coupled to a carrier plenum. By adjusting the pressure in the carrier plenum, the pressure exerted on the edge of a work piece during a planarization operation can be adjusted. The carrier also includes a floating wear ring that surrounds the work piece bladder and a work piece mounted on that bladder. By adjusting the force exerted by the wear ring on a polishing pad, independently of the pressure exerted by the rib at the edge of the bladder, the material removal rate near the edge of the work piece can be controlled.

10. 发明授权

US07014541B2 Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece 有权
公开(公告)号：US07014541B2
公开(公告)日：2006-03-21
申请号：US10672017
申请日：2003-09-26
申请人： Nikolay N. Korovin , Stephen C. Schultz , John D. Herb , James L. Farmer
发明人： Nikolay N. Korovin , Stephen C. Schultz , John D. Herb , James L. Farmer
IPC分类号： B24B1/00
CPC分类号： B24B37/30 , B24B37/32 , B24B49/16
摘要： An apparatus for planarizing a work piece includes an easily assembled work carrier. The carrier includes a carrier insert having a work piece bladder clamped to a carrier backing plate with a plurality of clamps to form a plurality of web plenums. The outer edge of the bladder is supported by a rib that is coupled to a carrier plenum. By adjusting the pressure in the carrier plenum, the pressure exerted on the edge of a work piece during a planarization operation can be adjusted. The carrier also includes a floating wear ring that surrounds the work piece bladder and a work piece mounted on that bladder. By adjusting the force exerted by the wear ring on a polishing pad, independently of the pressure exerted by the rib at the edge of the bladder, the material removal rate near the edge of the work piece can be controlled.

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