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    • 7. 发明授权
    • Workpiece carrier with adjustable pressure zones and barriers
    • 工件载体具有可调的压力区和屏障
    • US06390905B1
    • 2002-05-21
    • US09540476
    • 2000-03-31
    • Nikolay N. KorovinStephen C. SchultzJohn D. HerbJames L. Farmer
    • Nikolay N. KorovinStephen C. SchultzJohn D. HerbJames L. Farmer
    • B24B2900
    • B24B37/30B24B37/32B24B49/16
    • An apparatus and method are disclosed for planarizing a wafer in a carrier with adjustable pressure zones and adjustable barriers between zones. The carrier has an independently controlled central zone and concentric surrounding zones for distributing the pressure on the backside of a wafer while the wafer is being pressed against an abrasive surface in a chemical-mechanical polishing tool. The pressure zones may be created by mounting an elastic web diaphragm to a carrier housing that has a plurality of recesses. A corresponding plurality of elastic ring shaped ribs may extend from the web diaphragm opposite the recesses. The plurality of ring shaped ribs thereby defines a central zone surrounded by one or more concentric surrounding zones. The zones and barriers may be individually pressurized by utilizing corresponding fluid communication paths during the planarization process. A method for practicing the present invention starts by selecting a carrier with adjustable pressure zones that correspond to the number and locations of the bulges and troughs on the wafer. Zones that correspond to high regions receive greater pressure than zones that correspond to low regions on the wafer. The pressure on the barriers between zones may be optimized to prevent leakage between zones or to smooth the pressure distribution between neighboring zones on the back surface of the wafer.
    • 公开了一种用于在载体中平坦化晶片的装置和方法,其具有可调节的压力区域和区域之间的可调节的屏障。 载体具有独立控制的中心区域和同心的周围区域,用于在晶片在化学机械抛光工具中被压靠在磨料表面上时分配晶片背面的压力。 可以通过将弹性腹板隔膜安装到具有多个凹部的托架壳体上来产生压力区域。 相应的多个弹性环形肋可以从腹板隔膜相对于凹部延伸。 因此,多个环形肋限定了由一个或多个同心周围区域包围的中心区域。 通过在平坦化过程中利用相应的流体连通路径可以单独加压区域和障碍物。一种用于实施本发明的方法开始于选择具有可调压力区域的载体,其对应于晶片上的凸起和凹槽的数量和位置 。 对应于高区域的区域比对应于晶片上的低区域的区域承受更大的压力。 可以优化区域之间的屏障上的压力,以防止区域之间的泄漏或者平滑晶片背表面上的相邻区域之间的压力分布。