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1. 发明授权

US09597770B2 Method of fabricating a polishing 有权
公开(公告)号：US09597770B2
公开(公告)日：2017-03-21
申请号：US14550129
申请日：2014-11-21
申请人： NexPlanar Corporation
发明人： William C. Allison , Diane Scott , Rajeev Bajaj
IPC分类号： B24D18/00 , B24B37/20 , B24B37/22 , B24B37/26 , B24B37/005 , B24B49/12
CPC分类号： B24B37/205 , B24B37/005 , B24B37/22 , B24B37/26 , B24B49/12 , B24D18/0009
摘要： Polishing pads with apertures are described. Methods of fabricating polishing pads with apertures are also described.

2. 发明申请

US20160229025A1 CUSTOMIZED POLISHING PADS FOR CMP AND METHODS OF FABRICATION AND USE THEREOF 审中-公开
标题翻译：用于CMP的定制抛光垫及其制造方法及其使用方法
公开(公告)号：US20160229025A1
公开(公告)日：2016-08-11
申请号：US15042777
申请日：2016-02-12
申请人： NexPlanar Corporation
发明人： Pradip K. ROY , Manish DEOPURA , Sudhanshu MISRA
IPC分类号： B24B37/26
CPC分类号： B24B37/26 , B24D7/14 , B24D11/04
摘要： The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior thermo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads. In addition, these pads can be designed to tune the coefficient of friction by surface engineering, through the addition of solid lubricants, and creating low shear integral pads having multiple layers of polymeric material which form an interface parallel to the polishing surface. The pads can also have controlled porosity, embedded abrasive, novel grooves on the polishing surface, for slurry transport, which are produced in situ, and a transparent region for endpoint detection.
摘要翻译：本申请涉及用于基板的化学机械平面化（CMP）的抛光垫及其制造和使用方法。本发明中描述的焊盘定制为抛光规格，其中规格包括（但不限于）被抛光材料，芯片设计和结构，芯片密度和图案密度，设备平台和使用的浆料类型。这些垫可以设计成具有长或短范围顺序的专门的聚合物纳米结构，其允许分子水平调节实现优异的热机械特性。更具体地，可以设计和制造焊盘，使得焊盘内的化学和物理性质均匀和不均匀的空间分布。此外，这些垫可以被设计成通过表面工程，通过添加固体润滑剂来调节摩擦系数，并且产生具有形成与抛光表面平行的界面的多层聚合材料的低剪切整体垫。焊盘还可以具有受控的孔隙率，嵌入式研磨剂，抛光表面上的新型凹槽，用于原位生产的浆料输送，以及用于端点检测的透明区域。

3. 发明申请

US20140273777A1 POLISHING PAD HAVING POLISHING SURFACE WITH CONTINUOUS PROTRUSIONS HAVING TAPERED SIDEWALLS 审中-公开
标题翻译：具有抛光表面的抛光垫与带有切割面的连续抛光
公开(公告)号：US20140273777A1
公开(公告)日：2014-09-18
申请号：US13829990
申请日：2013-03-14
申请人： NexPlanar Corporation
发明人： Paul Andre Lefevre , William C. Allison , Alexander William Simpson , Diane Scott , Ping Huang , Leslie M. Charns , James Richard Rinehart , Robert Kerprich
IPC分类号： B24B37/26
CPC分类号： B24B37/26
摘要： Polishing pads having a polishing surface with continuous protrusions having tapered sidewalls are described. Methods of fabricating polishing pads having a polishing surface with continuous protrusions having tapered sidewalls are also described.
摘要翻译：描述具有具有锥形侧壁的连续突起的抛光表面的抛光垫。还描述了制造具有具有具有锥形侧壁的连续突起的抛光表面的抛光垫的方法。

4. 发明授权

US09597777B2 Homogeneous polishing pad for eddy current end-point detection 有权
公开(公告)号：US09597777B2
公开(公告)日：2017-03-21
申请号：US14152792
申请日：2014-01-10
申请人： NexPlanar Corporation
发明人： William C. Allison , Diane Scott , Ping Huang , Richard Frentzel , Alexander William Simpson
IPC分类号： B24D11/00 , B24B37/013 , B24B37/20
CPC分类号： B24D11/003 , B24B37/013 , B24B37/205
摘要： Homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.

5. 发明授权

US09278424B2 Customized polishing pads for CMP and methods of fabrication and use thereof 有权
公开(公告)号：US09278424B2
公开(公告)日：2016-03-08
申请号：US14489177
申请日：2014-09-17
申请人： NexPlanar Corporation
发明人： Pradip K Roy , Manish Deopura , Sudhanshu Misra
IPC分类号： B24D3/02 , B24D3/00 , B24D11/00 , B24D18/00 , C09K3/14 , B24B37/26 , B24D7/14 , B24D11/04
CPC分类号： B24B37/26 , B24D7/14 , B24D11/04
摘要： The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior themo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads. In addition, these pads can be designed to tune the coefficient of friction by surface engineering, through the addition of solid lubricants, and creating low shear integral pads having multiple layers of polymeric material which form an interface parallel to the polishing surface. The pads can also have controlled porosity, embedded abrasive, novel grooves on the polishing surface, for slurry transport, which are produced in situ, and a transparent region for endpoint detection.

6. 发明申请

US20140123563A1 HOMOGENEOUS POLISHING PAD FOR EDDY CURRENT END-POINT DETECTION 有权
标题翻译：用于EDDY电流端点检测的均匀抛光垫
公开(公告)号：US20140123563A1
公开(公告)日：2014-05-08
申请号：US14152792
申请日：2014-01-10
申请人： NexPlanar Corporation
发明人： William C. Allison , Diane Scott , Ping Huang , Richard Frentzel , Alexander William Simpson
IPC分类号： B24D11/00
CPC分类号： B24D11/003 , B24B37/013 , B24B37/205
摘要： Homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.
摘要翻译：描述了使用涡流端点检测来研磨半导体衬底的均匀抛光垫。还描述了使用涡流端点检测来制造用于抛光半导体衬底的均匀抛光垫的方法。

7. 发明授权

US10946495B2 Low density polishing pad 有权
公开(公告)号：US10946495B2
公开(公告)日：2021-03-16
申请号：US14611064
申请日：2015-01-30
申请人： NexPlanar Corporation
发明人： Ping Huang , William C. Allison , Richard Frentzel , Paul Andre Lefevre , Robert Kerprich , Diane Scott
IPC分类号： B24B37/24 , B24B37/20 , B24B37/26 , C08J9/00 , C08J9/228
摘要： Low density polishing pads and methods of fabricating low density polishing pads are described. In an example, a polishing pad for polishing a substrate includes a polishing body having a density approximately in the range of 0.4-0.55 g/cc. The polishing body includes a thermoset polyurethane material and a plurality of closed cell pores dispersed in the thermoset polyurethane material. Each of the plurality of closed cell pores has a shell composed of an acrylic co-polymer.

8. 发明授权

US10220487B2 Customized polishing pads for CMP and methods of fabrication and use thereof 有权
公开(公告)号：US10220487B2
公开(公告)日：2019-03-05
申请号：US15042777
申请日：2016-02-12
申请人： NexPlanar Corporation
发明人： Pradip K. Roy , Manish Deopura , Sudhanshu Misra
IPC分类号： C09K3/14 , B24B37/26 , B24D7/14 , B24D11/04 , B24D3/00 , B24D11/00 , B24D18/00
摘要： The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior thermo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads. In addition, these pads can be designed to tune the coefficient of friction by surface engineering, through the addition of solid lubricants, and creating low shear integral pads having multiple layers of polymeric material which form an interface parallel to the polishing surface. The pads can also have controlled porosity, embedded abrasive, novel grooves on the polishing surface, for slurry transport, which are produced in situ, and a transparent region for endpoint detection.

9. 发明授权

US10160092B2 Polishing pad having polishing surface with continuous protrusions having tapered sidewalls 有权
公开(公告)号：US10160092B2
公开(公告)日：2018-12-25
申请号：US13829990
申请日：2013-03-14
申请人： NexPlanar Corporation
发明人： Paul Andre Lefevre , William C. Allison , Alexander William Simpson , Diane Scott , Ping Huang , Leslie M. Charns , James Richard Rinehart , Robert Kerprich
IPC分类号： B24B37/24 , B24B37/26
摘要： Polishing pads having a polishing surface with continuous protrusions having tapered sidewalls are described. Methods of fabricating polishing pads having a polishing surface with continuous protrusions having tapered sidewalls are also described.

10. 发明授权

US09931729B2 Polishing pad with grooved foundation layer and polishing surface layer 有权
公开(公告)号：US09931729B2
公开(公告)日：2018-04-03
申请号：US14727586
申请日：2015-06-01
申请人： NexPlanar Corporation
发明人： Paul Andre Lefevre , William C. Allison , Diane Scott , James P. LaCasse
IPC分类号： B24B37/26 , B24B37/16 , B24B37/24 , B24B37/20 , B24B37/22 , B24D18/00
CPC分类号： B24B37/26 , B24B37/16 , B24B37/205 , B24B37/22 , B24B37/24 , B24D18/00
摘要： Polishing pads with grooved foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a pattern of grooves disposed therein. A continuous polishing surface layer is attached to the pattern of grooves of the foundation layer. In another example, a polishing pad for polishing a substrate includes a foundation layer with a surface having a pattern of protrusions disposed thereon. Each protrusion has a top surface and sidewalls. A non-continuous polishing surface layer is attached to the foundation layer and includes discrete portions. Each discrete portion is attached to the top surface of a corresponding one of the protrusions of the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a grooved foundation layer are also described.

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