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    • 1. 发明授权
    • Method for manufacturing semiconductor substrate and method for manufacturing semiconductor device
    • 半导体基板的制造方法及半导体装置的制造方法
    • US07842583B2
    • 2010-11-30
    • US12333650
    • 2008-12-12
    • Naoki TsukamotoAkihisa Shimomura
    • Naoki TsukamotoAkihisa Shimomura
    • H01L21/30
    • H01L21/76251B23K26/3576C30B33/04H01L21/02686H01L21/84H01L29/66772
    • A semiconductor substrate is manufactured in which a plurality of single crystal semiconductor layers is fixed to a base substrate having low heat resistance such as a glass substrate with a buffer layer interposed therebetween. A plurality of single crystal semiconductor substrates is prepared, each of which includes a buffer layer and a damaged region which is formed by adding hydrogen ions to each semiconductor substrate and contains a large amount of hydrogen. One or more of these single crystal semiconductor substrates is fixed to a base substrate and irradiated with an electromagnetic wave having a frequency of 300 MHz to 300 GHz, thereby being divided along the damaged region. Fixture of single crystal semiconductor substrates and electromagnetic wave irradiation are repeated to manufacture a semiconductor substrate where a required number of single crystal semiconductor substrates are fixed onto the base substrate.
    • 制造半导体衬底,其中多个单晶半导体层被固定到具有低耐热性的基底衬底,例如玻璃衬底,其间插入有缓冲层。 制备多个单晶半导体衬底,每个单晶半导体衬底包括缓冲层和通过向每个半导体衬底添加氢离子并含有大量氢而形成的损伤区域。 将这些单晶半导体基板中的一个或多个固定到基底基板上并用频率为300MHz至300GHz的电磁波照射,从而沿着损伤区域分割。 重复单晶半导体衬底的夹持和电磁波照射,制造半导体衬底,其中所需数量的单晶半导体衬底被固定到基底衬底上。
    • 3. 发明授权
    • Reactive sputtering method
    • 反应溅射法
    • US08070917B2
    • 2011-12-06
    • US12332808
    • 2008-12-11
    • Naoki Tsukamoto
    • Naoki Tsukamoto
    • C23C14/35C23C14/06C23C14/50C23C14/54
    • C23C14/562C23C14/0036C23C14/044C23C14/081C23C14/345C23C14/351H01J37/3277H01J37/3405
    • A reactive sputtering method for application of a bias voltage to a supporting substrate in formation of a film of a metal compound on the supporting substrate according to a bias sputtering method; wherein a supporting substrate conveyor unit and a cathode that includes a target facing the supporting substrate conveyor unit are provided; the supporting substrate is conveyed between the supporting substrate conveyor unit and the target for formation of a film of a metal compound on the supporting substrate; magnets are provided adjacent to the supporting substrate conveyor unit on a side thereof opposite to that of the supporting substrate, such that a magnetic field is closed and a continuing tunnel part of parallel or nearly parallel arched magnetic force lines forms an oval or a polygon on the supporting substrate, the magnets each having a first magnetic pole of an S pole or an N pole and a second magnetic pole opposite to the first magnetic pole, the second magnetic pole surrounding the first magnetic pole; and in film formation on the supporting substrate, the magnets are rotated inside a drum in an opposite direction to that in which the supporting substrate is conveyed outside of the drum, so as to secure uniform plasma application along the supporting substrate.
    • 根据偏置溅射法在支撑基板上形成金属化合物膜的反应溅射方法,用于在支撑基板上施加偏置电压; 其中,设置有支撑基板输送单元和包括面向所述支撑基板输送单元的目标的阴极; 支撑基板在支撑基板输送单元和用于在支撑基板上形成金属化合物膜的目标之间传送; 在支撑基板输送单元的与支撑基板的一侧相反的一侧设置磁体,使得磁场闭合,并且平行或几乎平行的拱形磁力线的连续通道部分形成椭圆形或多边形 所述支撑基板,所述磁体各自具有S极或N极的第一磁极和与所述第一磁极相对的第二磁极,所述第二磁极围绕所述第一磁极; 并且在支撑基板上的成膜中,磁体在鼓内沿与将支撑基板输送到滚筒外侧相反的方向旋转,以便沿着支撑基板确保均匀的等离子体施加。
    • 5. 发明申请
    • METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    • 制造半导体基板的方法和制造半导体器件的方法
    • US20090170286A1
    • 2009-07-02
    • US12333650
    • 2008-12-12
    • Naoki TSUKAMOTOAkihisa SHIMOMURA
    • Naoki TSUKAMOTOAkihisa SHIMOMURA
    • H01L21/762
    • H01L21/76251B23K26/3576C30B33/04H01L21/02686H01L21/84H01L29/66772
    • A semiconductor substrate is manufactured in which a plurality of single crystal semiconductor layers is fixed to a base substrate having low heat resistance such as a glass substrate with a buffer layer interposed therebetween. A plurality of single crystal semiconductor substrates is prepared, each of which includes a buffer layer and a damaged region which is formed by adding hydrogen ions to each semiconductor substrate and contains a large amount of hydrogen. One or more of these single crystal semiconductor substrates is fixed to a base substrate and irradiated with an electromagnetic wave having a frequency of 300 MHz to 300 GHz, thereby being divided along the damaged region. Fixture of single crystal semiconductor substrates and electromagnetic wave irradiation are repeated to manufacture a semiconductor substrate where a required number of single crystal semiconductor substrates are fixed onto the base substrate.
    • 制造半导体衬底,其中多个单晶半导体层被固定到具有低耐热性的基底衬底,例如玻璃衬底,其间插入有缓冲层。 制备多个单晶半导体衬底,每个单晶半导体衬底包括缓冲层和通过向每个半导体衬底添加氢离子并含有大量氢而形成的损伤区域。 将这些单晶半导体基板中的一个或多个固定到基底基板上并用频率为300MHz至300GHz的电磁波照射,从而沿着损伤区域分割。 重复单晶半导体衬底的夹持和电磁波照射,制造半导体衬底,其中所需数量的单晶半导体衬底被固定到基底衬底上。
    • 6. 发明申请
    • REACTIVE SPUTTERING APPARATUS AND REACTIVE SPUTTERING METHOD
    • 反应溅射装置和反应溅射方法
    • US20090159429A1
    • 2009-06-25
    • US12332808
    • 2008-12-11
    • Naoki TSUKAMOTO
    • Naoki TSUKAMOTO
    • C23C14/35
    • C23C14/562C23C14/0036C23C14/044C23C14/081C23C14/345C23C14/351H01J37/3277H01J37/3405
    • Disclosed is a A reactive sputtering apparatus for a bias sputtering method of applying a bias voltage to a supporting substrate in formation of a film of a metal compound on the supporting substrate according to a reactive sputtering method; which comprises a supporting substrate conveyor unit and a cathode that includes a target provided to face the supporting substrate conveyor unit, and wherein a supporting substrate is conveyed between the supporting substrate conveyor unit and the target for formation of a metal compound on the supporting substrate, magnets are provided adjacent to the supporting substrate conveyor unit on the side thereof opposite to the supporting substrate in such that the magnetic field is closed and the continuing tunnel part of parallel or nearly parallel arched magnetic force lines forms an oval or a polygon, on the supporting substrate, the magnets each having a first magnetic pole of an S pole or an N pole and a second magnetic pole opposite to the first magnetic pole, the second magnetic pole surrounding the first magnetic pole and, in film formation on the supporting substrate, the supporting substrate is conveyed on the same plane as that of the tunnel part and in the direction nearly perpendicular to the tunnel part.
    • 公开了一种用于偏置溅射方法的反应溅射装置,其中,根据反应溅射法,在支撑基板上形成金属化合物膜时,向支撑基板施加偏置电压; 其包括支撑基板输送单元和阴极,所述阴极包括设置成面向所述支撑基板输送单元的目标,并且其中支撑基板在所述支撑基板输送单元和所述目标之间输送以在所述支撑基板上形成金属化合物, 在支撑基板输送单元的与支撑基板相对的一侧设置磁体,使得磁场闭合,并且平行或几乎平行的拱形磁力线的连续通道部分形成椭圆形或多边形, 所述磁体各自具有S极或N极的第一磁极和与所述第一磁极相对的第二磁极,所述第二磁极围绕所述第一磁极,并且在所述支撑基板上的膜形成中, 支撑基板在与隧道部分的平面相同的平面上并且在几乎持续的方向上被传送 密封到隧道部分。
    • 9. 发明申请
    • LASER PROCESSING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE
    • 激光加工装置及制造半导体基板的方法
    • US20090181552A1
    • 2009-07-16
    • US12353384
    • 2009-01-14
    • Akihisa ShimomuraNaoki Tsukamoto
    • Akihisa ShimomuraNaoki Tsukamoto
    • H01L21/263H01L21/67
    • H01L21/268B23K26/08B23K26/123B23K26/14B23K26/702H01L21/02422H01L21/02532H01L21/02675H01L21/84H01L29/66772H01L29/78621
    • An SOI substrate having a single crystal semiconductor layer the surface of which has high planarity is manufactured. A semiconductor substrate is doped with hydrogen to form a damaged region containing a large amount of hydrogen. After a single crystal semiconductor substrate and a supporting substrate are bonded to each other, the semiconductor substrate is heated to separate the single crystal semiconductor substrate in the damaged region. While a heated high-purity nitrogen gas is sprayed on a separation surface of a single crystal semiconductor layer which is separated from the single crystal semiconductor substrate and irradiation with a microwave is performed from the back side of the supporting substrate, the separation surface is irradiated with a laser beam. The single crystal semiconductor layer is melted by irradiation with the laser beam, so that the surface of the single crystal semiconductor layer is planarized and re-single-crystallization thereof is performed. In addition, the length of the melting time is increased by irradiation with the nitrogen gas and the microwave; thus, the re-single-crystallization is performed more efficiently.
    • 制造具有表面具有高平坦度的单晶半导体层的SOI衬底。 掺杂氢的半导体衬底形成含有大量氢的损伤区域。 在单晶半导体衬底和支撑衬底彼此接合之后,加热半导体衬底以在损坏区域中分离单晶半导体衬底。 在从单晶半导体基板分离的单晶半导体层的分离面上喷射加热的高纯度氮气,从支撑基板的背面进行微波照射,分离面被照射 用激光束。 通过用激光束照射使单晶半导体层熔融,从而使单晶半导体层的表面平坦化并进行其单结晶化。 另外,通过用氮气和微波的照射来提高熔融时间的长度; 因此,更有效地进行再单晶化。