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    • 2. 发明授权
    • Method and device for manufacturing laminated plate
    • 层压板的制造方法和装置
    • US07101455B1
    • 2006-09-05
    • US10129037
    • 2000-10-30
    • Naoki HaseKosuke KataokaHiroyuki FurutaniYasuo Fushiki
    • Naoki HaseKosuke KataokaHiroyuki FurutaniYasuo Fushiki
    • B32B37/04B32B37/06B32B37/08B32B37/12B32B37/20B32B38/10
    • B32B37/0015B32B37/26B32B2309/02B32B2309/14H05K3/022
    • The present invention provides a method for producing a laminate suitable for a flexible circuit board which is free from visual defects such as wrinkles and curls that appear when a plurality of laminating materials containing a thermally fusible laminating material are formed by thermally laminating these materials each other using a thermal-press forming device, which comprises the steps of: arranging a heat resistant protective material between a pressing surface and the laminating materials, laminating the materials by thermal pressure at not lower than 200° C., wherein the bonded laminating materials are in contact with the protective material, cooling the bonded laminating materials, and peeling off the protective material from the bonded laminating materials, whereby the laminate with less nonuniformity in pressurization, a uniform surface, and a good inter-layer adhesion, and the method and device for producing the laminate can be provided, more particularly, the thermal pressure and forming is performed by a thermal-press forming device having at least a pair of metal rolls.
    • 本发明提供了一种适用于柔性电路板的层叠方法,该柔性电路板在没有视觉缺陷的情况下,例如当通过将这些材料彼此热层叠形成多个包含热熔性层压材料的层压材料时,出现褶皱和卷曲 使用热压成型装置,其包括以下步骤:在挤压表面和层压材料之间布置耐热保护材料,通过热压不低于200℃层压材料,其中粘合层压材料为 与保护材料接触,冷却接合的层压材料,并从保护层压材料剥离保护材料,由此加压不均匀性,均匀表面和良好的层间粘合性的层压体,以及该方法和 可以提供用于制造层压体的装置,更具体地,提供热压 通过具有至少一对金属辊的热压成形装置进行确定和成形。
    • 5. 发明授权
    • Benzene derivatives
    • 苯衍生物
    • US5808144A
    • 1998-09-15
    • US875284
    • 1997-07-23
    • Masaichi HasegawaTakumi TakeyasuNaoki TsuchiyaNaoki HaseKatsushi TakahashiTakashi Kamimura
    • Masaichi HasegawaTakumi TakeyasuNaoki TsuchiyaNaoki HaseKatsushi TakahashiTakashi Kamimura
    • C07C235/38C07C229/00C07C321/00
    • C07C235/38C07C2101/14
    • Novel benzene derivatives of the formula (I) shown below, pharmacological salts thereof, pharmacological solvates of the above-mentioned benzene derivatives and salts, pharmaceutical compositions including, as active ingredients, the above-mentioned compounds, and especially, prophylactic or therapeutic medicines for allergic diseases. ##STR1## wherein R.sup.1 =H, C.sub.1 -C.sub.12 cyclic or straight or branched chain alkyl group (which may be substituted by one or more C.sub.6 -C.sub.10 aryloxy groups), C.sub.7 -C.sub.12 aralkyl group (of which the aryl group may be substituted one or more of halogen, methyl and methoxy, or C.sub.3 -C.sub.10 alkenyl which may be substituted by one or more phenyl groups; A=O, S or CH.sub.2 group, B=CO or CZ.sub.2 CO group (Z=H or F), R.sup.2 =H or C.sub.1 -C.sub.4 alkyl group, X=halogen or methyl group, and Y=H, NO.sub.2 or CN group.
    • PCT No.PCT / JP96 / 03456 Sec。 371日期1997年7月23日 102(e)日期1997年7月23日PCT提交1995年11月27日PCT公布。 第WO97 / 19910号公报 日期:1997年5月6日下述式(I)的新型苯衍生物,其药理学盐,上述苯衍生物和盐的药理学溶剂化物,作为活性成分的上述化合物,特别是预防性 或用于过敏性疾病的治疗药物。 (I)其中R1 = H,C1-C12环状或直链或支链烷基(其可被一个或多个C 6 -C 10芳氧基取代),C 7 -C 12芳烷基(其芳基可以 取代一个或多个卤素,甲基和甲氧基,或可被一个或多个苯基取代的C 3 -C 10链烯基; A = O,S或CH 2基团,B = CO或CZ 2 CO基团(Z = H或F) ,R2 = H或C1-C4烷基,X =卤素或甲基,Y = H,NO2或CN基团。