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1. 发明授权

US4732921A Flame retardant polybutylene terephthalate 失效
标题翻译：阻燃聚对苯二甲酸丁二醇酯
公开(公告)号：US4732921A
公开(公告)日：1988-03-22
申请号：US938198
申请日：1986-12-05
申请人： Arie Hochberg , Nancy C. Eickman , Frank Haimbach, IV
发明人： Arie Hochberg , Nancy C. Eickman , Frank Haimbach, IV
IPC分类号： C08L67/00 , C08G59/00 , C08G59/18 , C08G59/30 , C08L63/00 , C08L67/02 , C08L69/00 , C08K3/22
CPC分类号： C08L67/02
摘要： A flame-resistant polybutylene terephthalate molding composition has vastly improved fatigue strength and improved melt flow by incorporating therein a halogenated epoxy flame retardant represented by the general formula: ##STR1## wherein an n is the degree of polymerization and the halogenated epoxy resin has a molecular weight of at least about 20,000 to 40,000; X is a chlorine or bromine atom, and i is an integer of from 1-4.
摘要翻译：耐火聚对苯二甲酸丁二醇酯模塑组合物通过掺入由以下通式表示的卤代环氧阻燃剂，具有极大提高的疲劳强度和改善的熔体流动性：其中n为聚合度和卤化环氧树脂的分子量至少约为20,000〜40,000; X是氯或溴原子，i是1-4的整数。

2. 发明授权

US4719250A Encapsulation of electronic components 失效
标题翻译：封装电子元件
公开(公告)号：US4719250A
公开(公告)日：1988-01-12
申请号：US872009
申请日：1986-06-09
申请人： Nancy C. Eickman , Charles E. McChesney , Gary E. Williams , Hyun-Nam Yoon
发明人： Nancy C. Eickman , Charles E. McChesney , Gary E. Williams , Hyun-Nam Yoon
IPC分类号： C08G63/60 , C08K3/36 , C08L77/12 , H01B3/42 , H01L23/29 , C08K3/34
CPC分类号： H01L23/293 , C08G63/605 , C08K3/36 , C08L77/12 , H01B3/42 , H01L2924/0002
摘要： An improved thermoplastic molding composition is provided which is particularly suited for use in the impervious void-free encapsulation on a relatively expeditious basis of an electronic component wherein the preformed electronic component is positioned in a mold cavity prior to the introduction of the molding composition via injection molding. The molding composition comprises a melt processable thermotropic liquid crystalline polymer which is of a relatively low weight average molecular weight of approximately 4,000 to 25,000 (e.g. approximately 4,000 to 10,000) and which is substantially incapable of further chain growth upon heating. Uniformly dispersed within the liquid crystalline polymer is approximately 40 to 80 percent by weight (e.g. approximately 50 to 75 percent by weight) of a particulate inorganic material (preferably of silicon dioxide) which serves to advantageously decrease its volumetric coefficient of thermal expansion and to advantageously increase its thermal conductivity. In a preferred embodiment the electronic component which is encapsulated is a semiconductor device, such a relatively delicate quad or dual-in-line integrated circuit device which is assembled onto a flat prestamped lead frame or other conductive device having a plurality of leads which extend outside the area which is encapsulated. The resulting encapsulated electronic component is well protected in spite of the relatively low molecular weight of the liquid crystalline polymer and is capable of satisfactory service for an extended period of time even if adverse environmental conditions are encountered. A rugged commonly nonburning and relatively inexpensive package is provided.
摘要翻译：提供了一种改进的热塑性模塑组合物，其特别适合于在电子部件的相对快速的基础上用于不透水的无空隙的封装，其中在通过注射引入模塑组合物之前将预成型的电子部件定位在模腔中成型。模塑组合物包含熔体加工的热致液晶聚合物，其具有约4,000至25,000（例如约4,000至10,000）的相对低的重均分子量，并且其在加热时基本上不能进一步链生长。均匀分散在液晶聚合物内的颗粒无机材料（优选为二氧化硅）为约40至80重量％（例如约50至75重量％），其用于有利地降低其体积热膨胀系数并且有利地增加其导热性。在优选实施例中，封装的电子部件是半导体器件，这种相对精密的四线或双列直插集成电路器件被组装到扁平预压引线框架或其它导电器件上，该器件具有多个引线，被封装的区域。尽管液晶聚合物的分子量相对较低，但是所得到的封装的电子部件被很好地保护，并且即使遇到不利的环境条件，也能够长时间地满足服务。提供了坚固的通常不燃烧和相对便宜的包装。

3. 发明授权

US4632798A Encapsulation of electronic components with anisotropic thermoplastic polymers 失效
标题翻译：用各向异性热塑性聚合物封装电子部件
公开(公告)号：US4632798A
公开(公告)日：1986-12-30
申请号：US619608
申请日：1984-06-18
申请人： Nancy C. Eickman , Charles E. McChesney , Gary E. Williams , Hyun-Nam Yoon
发明人： Nancy C. Eickman , Charles E. McChesney , Gary E. Williams , Hyun-Nam Yoon
IPC分类号： C08G63/60 , C08K3/36 , C08L77/12 , H01B3/42 , H01L23/29 , B29C45/14
CPC分类号： H01L23/293 , C08G63/605 , C08K3/36 , C08L77/12 , H01B3/42 , H01L2924/0002 , Y10T428/239
摘要： An improved thermoplastic molding composition is provided which is particularly suited for use in the impervious void-free encapsulation on a relatively expeditious basis of an electronic component wherein the preformed electronic component is positioned in a mold cavity prior to the introduction of the molding composition via injection molding. The molding composition comprises a melt processable thermotropic liquid crystalline polymer which is of a relatively low weight average molecular weight of approximately 4,000 to 25,000 (e.g. approximately 4,000 to 10,000) and which is substantially incapable of further chain growth upon heating. Uniformly dispersed within the liquid crystalline polymer is approximately 40 to 80 percent by weight (e.g. approximately 50 to 75 percent by weight) of a particulate inorganic material (preferably of silicon dioxide) which serves to advantageously decrease its volumetric coefficient of thermal expansion and to advantageously increase its thermal conductivity. In a preferred embodiment the electronic component which is encapsulated is a semiconductor device, such as relatively delicate quad or dual-in-line integrated circuit device which is assembled onto a flat prestamped lead frame or other conductive device having a plurality of leads which extend outside the area which is encapsulated. The resulting encapsulated electronic component is well protected in spite of the relatively low molecular weight of the liquid crystalline polymer and is capable of satisfactory service for an extended period of time even if adverse environmental conditions are encountered. A rugged commonly non-burning and relatively inexpensive package is provided.
摘要翻译：提供了一种改进的热塑性模塑组合物，其特别适合于在电子部件的相对快速的基础上用于不透水的无空隙的封装，其中在通过注射引入模塑组合物之前将预成型的电子部件定位在模腔中成型。模塑组合物包含熔体加工的热致液晶聚合物，其具有约4,000至25,000（例如约4,000至10,000）的相对低的重均分子量，并且其在加热时基本上不能进一步链生长。均匀分散在液晶聚合物内的颗粒无机材料（优选为二氧化硅）为约40至80重量％（例如约50至75重量％），其用于有利地降低其体积热膨胀系数并且有利地增加其导热性。在优选实施例中，被封装的电子部件是半导体器件，例如相对精密的四线或双列直插集成电路器件，其被组装到扁平预压引线框架或其它导电器件上，该器件具有多个引线，被封装的区域。尽管液晶聚合物的分子量相对较低，但是所得到的封装的电子部件被很好地保护，并且即使遇到不利的环境条件，也能够长时间地满足服务。提供坚固的通常不燃烧和相对便宜的包装。

4. 发明授权

US4458039A Thermotropic liquid crystalline polymer blend with reduced surface abrasion 失效
标题翻译：具有降低表面磨损性的热致液晶聚合物共混物
公开(公告)号：US4458039A
公开(公告)日：1984-07-03
申请号：US464272
申请日：1983-02-07
申请人： Nancy C. Eickman
发明人： Nancy C. Eickman
IPC分类号： C08K3/00 , C08K3/34 , C08K7/00 , C08K7/10 , C08K9/04 , C08L67/00 , C08L69/00 , C08L77/00 , C08L77/12 , C08L79/00 , C08L101/00
CPC分类号： C08K3/34 , C08K7/10 , C08K9/04 , C08K2201/016
摘要： A thermotropic liquid crystalline polymer matrix having wollastonite fibers incorporated therein for reinforcement to prepare a molding compound. The wollastonite fibers have an average aspect ratio of greater than 3 to 1, and may be coated on their surface with a coupling agent to produce better bonding between the fibers and the thermotropic liquid crystalline polymer. The surface abrasion of an article produced from a blend of wollastonite with a thermotropic liquid crystalline polymer is reduced as compared to that of unfilled polymer.
摘要翻译：一种含有硅灰石纤维的热致液晶聚合物基体，用于加强以制备模塑料。硅灰石纤维的平均纵横比大于3比1，并且可以用偶联剂涂覆在其表面上，以在纤维和热致液晶聚合物之间产生更好的粘合。与未填充的聚合物相比，由硅灰石与热致变性液晶聚合物的共混物制成的制品的表面磨损降低。

5. 发明授权

US4720424A Electronic component encapsulated with a composition comprising a polymer which is capable of forming an anisotropic melt phase and substantially incapable of further chain growth upon heating 失效
标题翻译：封装有包含能够形成各向异性熔融相并且在加热时基本上不能进一步链增长的聚合物的组合物的电子部件
公开(公告)号：US4720424A
公开(公告)日：1988-01-19
申请号：US872007
申请日：1986-06-09
申请人： Nancy C. Eickman , Charles E. McChesney , Gary E. Williams , Hyun-Nam Yoon
发明人： Nancy C. Eickman , Charles E. McChesney , Gary E. Williams , Hyun-Nam Yoon
IPC分类号： C08G63/60 , C08K3/36 , C08L77/12 , H01B3/42 , H01L23/29 , B32B5/16 , B32B27/06 , B32B27/34 , B32B27/36
CPC分类号： H01L23/293 , C08G63/605 , C08K3/36 , C08L77/12 , H01B3/42 , H01L2924/0002 , Y10T428/239 , Y10T428/25 , Y10T428/259 , Y10T428/31725 , Y10T428/31786
摘要： An improved thermoplastic molding composition is provided which is particularly suited for use in the impervious void-free encapsulation on a relatively expeditious basis of an electronic component wherein the preformed electronic component is positioned in a mold cavity prior to the introduction of the molding composition via injection molding. The molding composition comprises a melt processable thermotropic liquid crystalline polymer which is of a relatively low weight average molecular weight of approximately 4,000 to 25,000 (e.g. approximately 4,000 to 10,000) and which is substantially incapable of further chain growth upon heating. Uniformly dispersed within the liquid crystalline polymer is approximately 40 to 80 percent by weight (e.g. approximately 50 to 75 percent by weight) of a particulate inorganic material (preferably of silicon dioxide) which serves to advantageously decrease its volumetric coefficient of thermal expansion and to advantageously increase its thermal conductivity. In a preferred embodiment the electronic component which is encapsulated is a semiconductor device, such a relatively delicate quad or dual-in-line integrated circuit device which is assembled onto a flat prestamped lead frame or other conductive device having a plurality of leads which extend outside the area which is encapsulated. The resulting encapsulated electronic component is well protected in spite of the relatively low molecular weight of the liquid crystalline polymer and is capable of satisfactory service for an extended period of time even if adverse environmental conditions are encountered. A rugged commonly nonburning and relatively inexpensive package is provided.
摘要翻译：提供了一种改进的热塑性模塑组合物，其特别适合于在电子部件的相对快速的基础上用于不透水的无空隙的封装，其中在通过注射引入模塑组合物之前将预成型的电子部件定位在模腔中成型。模塑组合物包含熔体加工的热致液晶聚合物，其具有约4,000至25,000（例如约4,000至10,000）的相对低的重均分子量，并且其在加热时基本上不能进一步链生长。均匀分散在液晶聚合物内的颗粒无机材料（优选为二氧化硅）为约40至80重量％（例如约50至75重量％），其用于有利地降低其体积热膨胀系数并且有利地增加其导热性。在优选实施例中，封装的电子部件是半导体器件，这种相对精密的四线或双列直插集成电路器件被组装到扁平预压引线框架或其它导电器件上，该器件具有多个引线，被封装的区域。尽管液晶聚合物的分子量相对较低，但是所得到的封装的电子部件被很好地保护，并且即使遇到不利的环境条件，也能够长时间地满足服务。提供了坚固的通常不燃烧和相对便宜的包装。

6. 发明授权

US4524101A High modulus polyethylene fiber bundles as reinforcement for brittle matrices 失效
标题翻译：高模量聚乙烯纤维束作为脆性基质的增强剂
公开(公告)号：US4524101A
公开(公告)日：1985-06-18
申请号：US635103
申请日：1984-07-27
申请人： Nancy C. Eickman , Walter Fabisiak , Robert Dix
发明人： Nancy C. Eickman , Walter Fabisiak , Robert Dix
IPC分类号： B29C43/00 , D01F6/04 , D01G1/04 , E04C5/07 , C04B31/34
CPC分类号： C04B16/0625 , C04B20/026 , D01F6/04 , D01G1/04 , E04C5/07 , B29C43/00 , B29K2023/06 , B29K2105/06 , Y10T428/249932 , Y10T428/2967
摘要： A process for producing bundles of high modulus polyethylene fibers for reinforcement in composites wherein the matrix is a brittle material such as cement, concrete, plaster of Paris or the like. The process involves passing high modulus polyethylene yarn through high pressure nip rolls to deform the individual filaments and to form a loosely adhering unitary mass or bundle of filaments which is then chopped into short lengths for use as fibrous reinforcement in composites. In a preferred embodiment, the yarn is twisted prior to being passed through the nip rolls.
摘要翻译：用于生产复合材料中用于增强的高模量聚乙烯纤维束的方法，其中所述基质是脆性材料，例如水泥，混凝土，巴黎石膏等。该方法包括使高模量聚乙烯纱线通过高压压辊使单根细丝变形并形成松散粘合的整体质量或细丝束，然后将其切成短长度以用作复合材料中的纤维增强材料。在优选实施例中，纱线在通过夹辊之前被扭曲。

7. 发明授权

US4483727A High modulus polyethylene fiber bundles as reinforcement for brittle matrices 失效
标题翻译：高模量聚乙烯纤维束作为脆性基质的增强剂
公开(公告)号：US4483727A
公开(公告)日：1984-11-20
申请号：US464269
申请日：1983-02-07
申请人： Nancy C. Eickman , Walter Fabisiak , Robert Dix
发明人： Nancy C. Eickman , Walter Fabisiak , Robert Dix
IPC分类号： B29C43/00 , D01F6/04 , D01G1/04 , E04C5/07
CPC分类号： D01G1/04 , D01F6/04 , E04C5/07 , B29C43/00 , B29K2023/06 , B29K2105/06 , Y10S83/913
摘要： A process for producing bundles of high modulus polyethylene fibers for reinforcement in composites wherein the matrix is a brittle material such as cement, concrete, plaster of Paris or the like. The process involves passing high modulus polyethylene yarn through high pressure nip rolls to deform the individual filaments and to form a loosely adhering unitary mass or bundle of filaments which is then chopped into short lengths for use as fibrous reinforcement in composites. In a preferred embodiment, the yarn is twisted prior to being passed through the nip rolls.
摘要翻译：用于生产复合材料中用于增强的高模量聚乙烯纤维束的方法，其中所述基质是脆性材料，例如水泥，混凝土，巴黎石膏等。该方法包括使高模量聚乙烯纱线通过高压压辊使单根细丝变形并形成松散粘合的整体质量或细丝束，然后将其切成短长度以用作复合材料中的纤维增强材料。在优选实施例中，纱线在通过夹辊之前被扭曲。

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