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    • 1. 发明授权
    • Encapsulation of electronic components
    • 封装电子元件
    • US4719250A
    • 1988-01-12
    • US872009
    • 1986-06-09
    • Nancy C. EickmanCharles E. McChesneyGary E. WilliamsHyun-Nam Yoon
    • Nancy C. EickmanCharles E. McChesneyGary E. WilliamsHyun-Nam Yoon
    • C08G63/60C08K3/36C08L77/12H01B3/42H01L23/29C08K3/34
    • H01L23/293C08G63/605C08K3/36C08L77/12H01B3/42H01L2924/0002
    • An improved thermoplastic molding composition is provided which is particularly suited for use in the impervious void-free encapsulation on a relatively expeditious basis of an electronic component wherein the preformed electronic component is positioned in a mold cavity prior to the introduction of the molding composition via injection molding. The molding composition comprises a melt processable thermotropic liquid crystalline polymer which is of a relatively low weight average molecular weight of approximately 4,000 to 25,000 (e.g. approximately 4,000 to 10,000) and which is substantially incapable of further chain growth upon heating. Uniformly dispersed within the liquid crystalline polymer is approximately 40 to 80 percent by weight (e.g. approximately 50 to 75 percent by weight) of a particulate inorganic material (preferably of silicon dioxide) which serves to advantageously decrease its volumetric coefficient of thermal expansion and to advantageously increase its thermal conductivity. In a preferred embodiment the electronic component which is encapsulated is a semiconductor device, such a relatively delicate quad or dual-in-line integrated circuit device which is assembled onto a flat prestamped lead frame or other conductive device having a plurality of leads which extend outside the area which is encapsulated. The resulting encapsulated electronic component is well protected in spite of the relatively low molecular weight of the liquid crystalline polymer and is capable of satisfactory service for an extended period of time even if adverse environmental conditions are encountered. A rugged commonly nonburning and relatively inexpensive package is provided.
    • 提供了一种改进的热塑性模塑组合物,其特别适合于在电子部件的相对快速的基础上用于不透水的无空隙的封装,其中在通过注射引入模塑组合物之前将预成型的电子部件定位在模腔中 成型。 模塑组合物包含熔体加工的热致液晶聚合物,其具有约4,000至25,000(例如约4,000至10,000)的相对低的重均分子量,并且其在加热时基本上不能进一步链生长。 均匀分散在液晶聚合物内的颗粒无机材料(优选为二氧化硅)为约40至80重量%(例如约50至75重量%),其用于有利地降低其体积热膨胀系数并且有利地 增加其导热性。 在优选实施例中,封装的电子部件是半导体器件,这种相对精密的四线或双列直插集成电路器件被组装到扁平预压引线框架或其它导电器件上,该器件具有多个引线, 被封装的区域。 尽管液晶聚合物的分子量相对较低,但是所得到的封装的电子部件被很好地保护,并且即使遇到不利的环境条件,也能够长时间地满足服务。 提供了坚固的通常不燃烧和相对便宜的包装。
    • 2. 发明授权
    • Encapsulation of electronic components with anisotropic thermoplastic
polymers
    • 用各向异性热塑性聚合物封装电子部件
    • US4632798A
    • 1986-12-30
    • US619608
    • 1984-06-18
    • Nancy C. EickmanCharles E. McChesneyGary E. WilliamsHyun-Nam Yoon
    • Nancy C. EickmanCharles E. McChesneyGary E. WilliamsHyun-Nam Yoon
    • C08G63/60C08K3/36C08L77/12H01B3/42H01L23/29B29C45/14
    • H01L23/293C08G63/605C08K3/36C08L77/12H01B3/42H01L2924/0002Y10T428/239
    • An improved thermoplastic molding composition is provided which is particularly suited for use in the impervious void-free encapsulation on a relatively expeditious basis of an electronic component wherein the preformed electronic component is positioned in a mold cavity prior to the introduction of the molding composition via injection molding. The molding composition comprises a melt processable thermotropic liquid crystalline polymer which is of a relatively low weight average molecular weight of approximately 4,000 to 25,000 (e.g. approximately 4,000 to 10,000) and which is substantially incapable of further chain growth upon heating. Uniformly dispersed within the liquid crystalline polymer is approximately 40 to 80 percent by weight (e.g. approximately 50 to 75 percent by weight) of a particulate inorganic material (preferably of silicon dioxide) which serves to advantageously decrease its volumetric coefficient of thermal expansion and to advantageously increase its thermal conductivity. In a preferred embodiment the electronic component which is encapsulated is a semiconductor device, such as relatively delicate quad or dual-in-line integrated circuit device which is assembled onto a flat prestamped lead frame or other conductive device having a plurality of leads which extend outside the area which is encapsulated. The resulting encapsulated electronic component is well protected in spite of the relatively low molecular weight of the liquid crystalline polymer and is capable of satisfactory service for an extended period of time even if adverse environmental conditions are encountered. A rugged commonly non-burning and relatively inexpensive package is provided.
    • 提供了一种改进的热塑性模塑组合物,其特别适合于在电子部件的相对快速的基础上用于不透水的无空隙的封装,其中在通过注射引入模塑组合物之前将预成型的电子部件定位在模腔中 成型。 模塑组合物包含熔体加工的热致液晶聚合物,其具有约4,000至25,000(例如约4,000至10,000)的相对低的重均分子量,并且其在加热时基本上不能进一步链生长。 均匀分散在液晶聚合物内的颗粒无机材料(优选为二氧化硅)为约40至80重量%(例如约50至75重量%),其用于有利地降低其体积热膨胀系数并且有利地 增加其导热性。 在优选实施例中,被封装的电子部件是半导体器件,例如相对精密的四线或双列直插集成电路器件,其被组装到扁平预压引线框架或其它导电器件上,该器件具有多个引线, 被封装的区域。 尽管液晶聚合物的分子量相对较低,但是所得到的封装的电子部件被很好地保护,并且即使遇到不利的环境条件,也能够长时间地满足服务。 提供坚固的通常不燃烧和相对便宜的包装。
    • 3. 发明授权
    • Electronic component encapsulated with a composition comprising a
polymer which is capable of forming an anisotropic melt phase and
substantially incapable of further chain growth upon heating
    • 封装有包含能够形成各向异性熔融相并且在加热时基本上不能进一步链增长的聚合物的组合物的电子部件
    • US4720424A
    • 1988-01-19
    • US872007
    • 1986-06-09
    • Nancy C. EickmanCharles E. McChesneyGary E. WilliamsHyun-Nam Yoon
    • Nancy C. EickmanCharles E. McChesneyGary E. WilliamsHyun-Nam Yoon
    • C08G63/60C08K3/36C08L77/12H01B3/42H01L23/29B32B5/16B32B27/06B32B27/34B32B27/36
    • H01L23/293C08G63/605C08K3/36C08L77/12H01B3/42H01L2924/0002Y10T428/239Y10T428/25Y10T428/259Y10T428/31725Y10T428/31786
    • An improved thermoplastic molding composition is provided which is particularly suited for use in the impervious void-free encapsulation on a relatively expeditious basis of an electronic component wherein the preformed electronic component is positioned in a mold cavity prior to the introduction of the molding composition via injection molding. The molding composition comprises a melt processable thermotropic liquid crystalline polymer which is of a relatively low weight average molecular weight of approximately 4,000 to 25,000 (e.g. approximately 4,000 to 10,000) and which is substantially incapable of further chain growth upon heating. Uniformly dispersed within the liquid crystalline polymer is approximately 40 to 80 percent by weight (e.g. approximately 50 to 75 percent by weight) of a particulate inorganic material (preferably of silicon dioxide) which serves to advantageously decrease its volumetric coefficient of thermal expansion and to advantageously increase its thermal conductivity. In a preferred embodiment the electronic component which is encapsulated is a semiconductor device, such a relatively delicate quad or dual-in-line integrated circuit device which is assembled onto a flat prestamped lead frame or other conductive device having a plurality of leads which extend outside the area which is encapsulated. The resulting encapsulated electronic component is well protected in spite of the relatively low molecular weight of the liquid crystalline polymer and is capable of satisfactory service for an extended period of time even if adverse environmental conditions are encountered. A rugged commonly nonburning and relatively inexpensive package is provided.
    • 提供了一种改进的热塑性模塑组合物,其特别适合于在电子部件的相对快速的基础上用于不透水的无空隙的封装,其中在通过注射引入模塑组合物之前将预成型的电子部件定位在模腔中 成型。 模塑组合物包含熔体加工的热致液晶聚合物,其具有约4,000至25,000(例如约4,000至10,000)的相对低的重均分子量,并且其在加热时基本上不能进一步链生长。 均匀分散在液晶聚合物内的颗粒无机材料(优选为二氧化硅)为约40至80重量%(例如约50至75重量%),其用于有利地降低其体积热膨胀系数并且有利地 增加其导热性。 在优选实施例中,封装的电子部件是半导体器件,这种相对精密的四线或双列直插集成电路器件被组装到扁平预压引线框架或其它导电器件上,该器件具有多个引线, 被封装的区域。 尽管液晶聚合物的分子量相对较低,但是所得到的封装的电子部件被很好地保护,并且即使遇到不利的环境条件,也能够长时间地满足服务。 提供了坚固的通常不燃烧和相对便宜的包装。
    • 6. 发明授权
    • Decorative multi-level embossed surface covering
    • 装饰多层压花表面覆盖
    • US4207368A
    • 1980-06-10
    • US9289
    • 1979-02-05
    • Donald E. SchneiderGeorge A. TudorGary E. Williams
    • Donald E. SchneiderGeorge A. TudorGary E. Williams
    • B41M1/12B41M1/14B41M7/00B44C1/20D06N7/00B32B3/30
    • D06N7/0039B41M1/12B41M1/14B41M7/0027B44C1/205Y10T428/24612Y10T428/24876Y10T428/24901
    • The process for making a surface covering having an embossed wear surface, including embossed design portions which differ in elevation and shading, by depositing a liquid resinous base coating onto a backing, depositing a layer of resinous dryblend onto the liquid resinous coating while it is still wet, heating to sinter the dryblend and at least partially set the base coating, producing a design on the sintered layer by applying settable resinous ink to at least a portion thereof in sufficient amounts and viscosity to permit penetration of the ink into the dryblend layer to a depth of about 10 mils (0.254 mm) at the points of application, at least a portion of the design being formed by applying the ink in minute separate but closely spaced deposits, and heating the composite structure for final fusion to form a non-porous sheet wherein the design areas containing the closely spaced ink deposits may differ in shading and elevation in their ink-containing and non-ink-containing portions. These design areas may also differ in shading and elevation from the other ink-containing and non-ink-containing areas of the sheet. The resulting sheet may then be passed around a smooth (or textured) roll with the face of the sheet in contact therewith to provide any smoothing or texturing effect desired. Optionally, an overall resinous top coat may be applied.
    • 通过将液体树脂基底涂层沉积到背衬上,使其具有压花磨损表面的方法,其包括不同高度和阴影的压花设计部分,同时在液体树脂涂层上静置一层树脂干粉末 湿,加热以烧结干燥混合物并且至少部分地固化基底涂层,通过将可固化树脂油墨以足够的量和粘度施加到其至少一部分上,从而在烧结层上产生设计,以允许将油墨渗透到干混料层中 在施加点为约10密耳(0.254mm)的深度,至少一部分设计通过在微小分开但紧密间隔的沉积物中施加油墨而形成,并且加热该复合结构以进行最终融合, 多孔片,其中包含密集间隔的油墨沉积物的设计区域在其含油墨和不含油墨的口腔中的阴影和高度可能不同 ns。 这些设计区域也可能与片材的其它含油墨和非含油墨区域的阴影和高度不同。 然后可以将所得到的片材围绕平滑(或织构化的)卷绕,其中片材的面与其接触以提供所需的任何平滑或纹理效果。 任选地,可以施加整体树脂面涂层。
    • 7. 发明授权
    • Organic-inorganic hybrid pigment compositions
    • 有机 - 无机混合颜料组合物
    • US08409343B2
    • 2013-04-02
    • US12863558
    • 2009-01-21
    • Lori A. NiewoldRobyn TorresGary E. Williams
    • Lori A. NiewoldRobyn TorresGary E. Williams
    • C09B67/22C04B14/10C04B14/38C09B67/00C09B67/02
    • C09C1/42C01P2002/82C01P2002/88C01P2006/60C09C1/0006C09C1/3669C09C1/3684
    • An organic-inorganic hybrid pigment composition is provided comprising an organic pigment, an inorganic pigment, and a fibrous clay. The fibrous clay can be selected from palygorskite, sepiolite, or a combination thereof. The inorganic pigment is selected from rutile pigments, spinel pigments, bismuth vanadate pigments, cerium sulfide pigments, and combinations thereof. The organic pigment is selected from anthraquinone pigments, anthrathrone pigments, anthrapyrimidine pigments, azo pigments, azomethine pigments, quinacridone pigments, quinophthalone pigments, diketopyrrolopyrrol pigments, inanthrone pigments, isoindoline pigments, metal complex pigments, perinone pigments, perylene pigments, phthalocyanine pigments, pyranthrone pigments, pyrazolo-quinazolone pigments, thioindigo pigments, and combinations thereof.
    • 提供了一种有机 - 无机混合颜料组合物,其包含有机颜料,无机颜料和纤维状粘土。 纤维状粘土可以选自坡缕石,海泡石或其组合。 无机颜料选自金红石颜料,尖晶石颜料,钒酸铋颜料,硫化铈颜料及其组合。 有机颜料选自蒽醌颜料,蒽酮颜料,蒽嘧啶颜料,偶氮颜料,偶氮甲碱颜料,喹吖啶酮颜料,喹酞酮颜料,二酮吡咯并吡咯颜料,阴丹酮颜料,异吲哚啉颜料,金属络合物颜料,紫罗兰酮颜料,苝颜料,酞菁颜料,吡喃酮 颜料,吡唑并喹唑酮颜料,硫靛颜料及其组合。
    • 9. 发明授权
    • Programmable additive controller
    • 可编程添加剂控制器
    • US5271526A
    • 1993-12-21
    • US884937
    • 1992-05-18
    • Gary E. Williams
    • Gary E. Williams
    • B67D7/74G05D11/13B67D5/30
    • B67D7/744G05D11/132B67D2007/748Y10T137/86405
    • Programmable additive controllers control flow of fluid additives from a fluid supply line. A flowmeter is connected to the solenoid control valve for measuring flow of fluid. A controller opens and closes the control valve. The control valve is positioned downstream from the flowmeter, leaving the meter full upon shut off. A settable input controls cyclic operation of the controller. The controller further incorporates an input for required quantities of additive to be added on each cycle. A comparator in the controller compares a required quantity with signal output indicating flow through the flowmeter. The difference, if any, between actual flow and target flow is continuously sent, and the target flow is continuously adjusted up or down when necessary to compensate for the previous difference. The comparator connects to a closing control for closing the control valve and preventing further flow of additive when the cumulative flowmeter output signal approaches the requirement. Condition specific alarms signal the user and controller during operation if over or under injections are detected. Over injections relayed by the alarm to the controller cause a closing of the valve. A secondary alarm is provided for signalling if the apparatus continuously injects for over a given time period. A three-way valve connects to the flowmeter for selectively flowing fluid additive to a test and to an outlet for ejection into a mixing tank. The controller has an input for local panel factor and reads out mixing ratio volume per cycle and total volume of additive.
    • 可编程添加剂控制器控制来自流体供应管线的流体添加剂的流动。 流量计连接到电磁控制阀,用于测量流体的流量。 控制器打开和关闭控制阀。 控制阀位于流量计的下游,关闭后将仪表充满。 可设置的输入控制控制器的循环运行。 控制器还包括在每个循环中添加所需量的添加剂的输入。 控制器中的比较器将所需数量与指示通过流量计的流量的信号输出进行比较。 连续发送实际流量和目标流量之间的差异(如果有的话),并且必要时连续调整目标流量以补偿以前的差异。 当累积流量计输出信号接近要求时,比较器连接到关闭控制阀以关闭控制阀并阻止添加剂的进一步流动。 如果检测到超过或不足的注射,条件特定的报警在操作期间向用户和控制器发出信号。 通过报警传递给控制器​​的过度喷射导致阀门关闭。 如果设备在给定的时间段内持续喷射,则提供辅助报警器用于发信号。 三通阀连接到流量计,用于选择性地将流体添加剂流动到测试和出口以喷射到混合罐中。 控制器具有用于局部面板因子的输入,并读出每个循环的混合比体积和添加剂的总体积。