专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20110116971A1 AGITATING DEVICE 有权
标题翻译：激活设备
公开(公告)号：US20110116971A1
公开(公告)日：2011-05-19
申请号：US12974999
申请日：2010-12-21
申请人： Takaaki Nagai , Mitsuo Yamasaki
发明人： Takaaki Nagai , Mitsuo Yamasaki
IPC分类号： G01N33/48 , B01F11/00
CPC分类号： G01N35/10 , B01F11/0008 , B01F11/0017 , B01F11/0037 , G01N2035/00524 , Y10T436/2575
摘要： An agitating device for agitating a blood sample in a sample container is disclosed. The agitating device includes a base comprising a horizontally-supported shaft, a container holder including a first hand and a second hand, the first hand having a first hole at one end and a first hold portion at other end, the second hand having a second hole at one end and a second hold portion at other end, the first and second holes through which the shaft is inserted, the first and second hands being rotatable relative to the shaft and the first and second hold portions faced each other, and an agitation drive unit including a contact member for contacting the container holder and a drive source for reciprocating the contact member contacting the container holder between a lower position and an upper position.
摘要翻译：公开了一种用于搅拌样品容器中的血样的搅拌装置。搅拌装置包括一个底座，它包括一个水平支撑的轴，一个包括一只手和一只二手的容器保持架，第一只手在一端具有一个第一孔，另一端具有一个第一保持部分，一端的孔，另一端的第二保持部，第一和第二孔，轴被插入，第一和第二手相对于轴可旋转，第一和第二保持部分彼此面对，并且搅动驱动单元，其包括用于接触容器保持器的接触构件和用于使接触构件与下部位置和上部位置之间的容器保持器接触的驱动源。

2. 发明授权

US07387914B2 Semiconductor device and process for fabrication thereof 失效
标题翻译：半导体器件及其制造方法
公开(公告)号：US07387914B2
公开(公告)日：2008-06-17
申请号：US11379921
申请日：2006-04-24
申请人： Shinji Takeda , Takashi Masuko , Masami Yusa , Tooru Kikuchi , Yasuo Miyadera , Iwao Maekawa , Mitsuo Yamasaki , Akira Kageyama , Aizou Kaneda
发明人： Shinji Takeda , Takashi Masuko , Masami Yusa , Tooru Kikuchi , Yasuo Miyadera , Iwao Maekawa , Mitsuo Yamasaki , Akira Kageyama , Aizou Kaneda
IPC分类号： H01L21/48 , H01L21/50
CPC分类号： H01L24/27 , H01L23/49513 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/743 , H01L24/83 , H01L24/97 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83101 , H01L2224/83192 , H01L2224/83805 , H01L2224/8385 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/12044 , H01L2924/181 , Y10T428/28 , H01L2924/00 , H01L2924/01014 , H01L2224/83 , H01L2224/85 , H01L2924/3512 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
摘要翻译：将半导体芯片与吸水率为1.5体积％以下的薄膜状有机芯片接合材料贴合在引线框架上; 具有1.0体积％以下的饱和吸湿性，在250℃的温度下具有不大于3.0重量％的残留挥发组分，弹性模量为10MPa以下。半导体装置这样获得的半导体器件的封装的回流焊接期间不会发生回流裂纹。

3. 发明申请

US20120064638A1 SAMPLE PROCESSING APPARATUS AND SAMPLE PROCESSING METHOD 有权
标题翻译：样品加工设备和样品加工方法
公开(公告)号：US20120064638A1
公开(公告)日：2012-03-15
申请号：US13230407
申请日：2011-09-12
申请人： Hiromi ONOMICHI , Mitsuo YAMASAKI
发明人： Hiromi ONOMICHI , Mitsuo YAMASAKI
IPC分类号： G01N33/566
CPC分类号： G01N35/0092 , G01N2035/00643 , G01N2035/00891
摘要： A sample processing apparatus for performing a process including a plurality of steps on a sample, the sample processing apparatus sequentially processing a plurality of samples, is disclosed. The apparatus comprises a plurality of units corresponding to the respective steps in the process; a transfer section which transfers a sample to the units according to a flow of the steps; and a controller. Specifically, when an operation was not performed successfully, the controller interrupts the process for a sample that had not reached the location where the unsuccessful operation was performed while continuing the process for a sample that had already passed the location, retries the operation that was not performed successfully, and resumes the interrupted process when the retried operation has been performed successfully.
摘要翻译：公开了一种用于在样本上执行包括多个步骤的处理的样本处理装置，所述样本处理设备顺次处理多个样本。该装置包括对应于该过程中各个步骤的多个单元; 转移部分，根据步骤的流程将样品转移到所述单元; 和控制器。具体来说，当没有成功执行操作时，控制器中断未到达执行不成功的位置的样本的处理，同时继续对已经通过位置的样本的处理，重试不是的操作执行成功，并且在重试操作成功执行时恢复中断的进程。

4. 发明授权

US07879292B2 Agitating device 有权
标题翻译：搅拌装置
公开(公告)号：US07879292B2
公开(公告)日：2011-02-01
申请号：US11599842
申请日：2006-11-15
申请人： Takaaki Nagai , Mitsuo Yamasaki
发明人： Takaaki Nagai , Mitsuo Yamasaki
IPC分类号： B01L3/00
CPC分类号： G01N35/10 , B01F11/0008 , B01F11/0017 , B01F11/0037 , G01N2035/00524 , Y10T436/2575
摘要： An agitating device is described, a representative one of which includes: an agitating device for agitating a sample within a sample container, comprising: a base; a container holder for holding a sample container, which is provided so as to be movable relative to the base; and an agitation drive unit, which is provided on the base, for providing an agitation drive force to the container holder so as to cause the container holder to perform a agitating operation.
摘要翻译：描述了一种搅拌装置，其代表性的装置包括：用于搅拌样品容器内的样品的搅拌装置，包括：基座; 用于保持样品容器的容器保持器，其被设置成可相对于基座移动; 以及设置在基座上的用于向容器保持器提供搅拌驱动力以使容器保持器进行搅拌操作的搅拌驱动单元。

5. 发明申请

US20080290529A1 SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATION THEREOF 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20080290529A1
公开(公告)日：2008-11-27
申请号：US12138637
申请日：2008-06-13
申请人： Shinji TAKEDA , Takashi Masuko , Masami Yusa , Tooru Kikuchi , Yasuo Miyadera , Iwao Maekawa , Mitsuo Yamasaki , Akira Kageyama , Aizou Kaneda
发明人： Shinji TAKEDA , Takashi Masuko , Masami Yusa , Tooru Kikuchi , Yasuo Miyadera , Iwao Maekawa , Mitsuo Yamasaki , Akira Kageyama , Aizou Kaneda
IPC分类号： H01L23/18 , H01L21/58
CPC分类号： H01L24/27 , H01L23/49513 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/743 , H01L24/83 , H01L24/97 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83101 , H01L2224/83192 , H01L2224/83805 , H01L2224/8385 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/12044 , H01L2924/181 , Y10T428/28 , H01L2924/00 , H01L2924/01014 , H01L2224/83 , H01L2224/85 , H01L2924/3512 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250 ° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
摘要翻译：将半导体芯片与吸水率为1.5体积％以下的薄膜状有机芯片接合材料贴合在引线框架上; 具有1.0体积％以下的饱和吸湿性，在250℃的温度下具有不大于3.0重量％的残留挥发组分，弹性模量为10MPa以下。半导体装置这样获得的半导体器件的封装的回流焊接期间不会发生回流裂纹。

6. 发明申请

US20070110617A1 Sample analyzer and sample container supplying apparatus 有权
标题翻译：样品分析仪和样品容器供应装置
公开(公告)号：US20070110617A1
公开(公告)日：2007-05-17
申请号：US11599790
申请日：2006-11-15
申请人： Takaaki Nagai , Mitsuo Yamasaki
发明人： Takaaki Nagai , Mitsuo Yamasaki
IPC分类号： G01N35/00
CPC分类号： G01N35/026 , G01N2035/041 , Y10T436/11 , Y10T436/113332 , Y10T436/114165 , Y10T436/114998
摘要： A sample analyzer for analyzing a sample comprising: a sample container receiver capable of receiving either one of a manually supplied sample container and an automatically supplied; a container holder receiver for receiving a container holder holding at least one sample container; a sample container supplier automatically for supplying, to the sample container receiver, a sample container held by the container holder received by the container holder receiver; an aspirator for aspirating a sample within a sample container received by the sample container receiver; and an analyzing part for analyzing the sample aspirated by the aspirator.
摘要翻译：一种用于分析样品的样品分析器，包括：样品容器接收器，其能够接收手动提供的样品容器和自动提供的样品容器; 容器保持器接收器，用于容纳保持至少一个样品容器的容器保持器; 一个样本容器供应商，自动地向样品容器接收器供应由容器保持器接收器容纳的容器保持器容纳的样本容器; 用于抽吸由样品容器接收器接收的样品容器内的样品的抽吸器; 以及用于分析吸气器抽吸的样品的分析部件。

7. 发明授权

US07012320B2 Semiconductor device and process for fabrication thereof 失效
公开(公告)号：US07012320B2
公开(公告)日：2006-03-14
申请号：US09785486
申请日：2001-02-20
申请人： Shinji Takeda , Takashi Masuko , Masami Yusa , Tooru Kikuchi , Yasuo Miyadera , Iwao Maekawa , Mitsuo Yamasaki , Akira Kageyama , Aizou Kaneda
发明人： Shinji Takeda , Takashi Masuko , Masami Yusa , Tooru Kikuchi , Yasuo Miyadera , Iwao Maekawa , Mitsuo Yamasaki , Akira Kageyama , Aizou Kaneda
IPC分类号： H01L23/495
CPC分类号： H01L24/27 , H01L23/49513 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/743 , H01L24/83 , H01L2224/05599 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83101 , H01L2224/83192 , H01L2224/83805 , H01L2224/8385 , H01L2224/85399 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2924/01014 , H01L2924/01026 , H01L2924/01028 , H01L2924/3512 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

8. 发明授权

US06855579B2 Semiconductor device and process for fabrication thereof 失效
标题翻译：半导体器件及其制造方法
公开(公告)号：US06855579B2
公开(公告)日：2005-02-15
申请号：US09785436
申请日：2001-02-20
申请人： Shinji Takeda , Takashi Masuko , Masami Yusa , Tooru Kikuchi , Yasuo Miyadera , Iwao Maekawa , Mitsuo Yamasaki , Akira Kageyama , Aizou Kaneda
发明人： Shinji Takeda , Takashi Masuko , Masami Yusa , Tooru Kikuchi , Yasuo Miyadera , Iwao Maekawa , Mitsuo Yamasaki , Akira Kageyama , Aizou Kaneda
IPC分类号： H01L21/52 , H01L21/58 , H01L23/495 , H01L21/48
CPC分类号： H01L24/27 , H01L23/49513 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/743 , H01L24/83 , H01L24/97 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83101 , H01L2224/83192 , H01L2224/83805 , H01L2224/8385 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/12044 , H01L2924/181 , Y10T428/28 , H01L2924/00 , H01L2924/01014 , H01L2224/83 , H01L2224/85 , H01L2924/3512 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
摘要翻译：将半导体芯片与吸水率为1.5体积％以下的薄膜状有机芯片接合材料贴合在引线框架上; 具有1.0体积％以下的饱和吸湿性，在250℃的温度下具有不大于3.0重量％的残留挥发组分，弹性模量为10MPa以下。半导体装置这样获得的半导体器件的封装的回流焊接期间不会发生回流裂纹。

9. 发明授权

US09250165B2 Smear staining apparatus, smear preparing apparatus, smear processing system, and method for determining staining condition 有权
标题翻译：涂片染色装置，涂片制备装置，涂片处理系统和染色条件的测定方法
公开(公告)号：US09250165B2
公开(公告)日：2016-02-02
申请号：US13044145
申请日：2011-03-09
申请人： Kazuhiro Yamada , Mitsuo Yamasaki
发明人： Kazuhiro Yamada , Mitsuo Yamasaki
IPC分类号： G06F19/00 , G06K9/36 , G01N1/31 , G01N35/10
CPC分类号： G01N1/312 , G01N35/1016
摘要： A smear staining apparatus comprising: a staining section which stains a smear sample with a quantity of stain fluid; and a controller, wherein the controller: receives information regarding a stain state on a smear sample which is stained according to a first staining condition by the staining section; and determines a second staining condition on the basis of the information and a target value which defines a targeted stain state, is disclosed. A smear preparing apparatus, a smear processing system and method for determining staining condition are also disclosed.
摘要翻译：一种涂片染色装置，其特征在于，包括：染色部，其用一定量的染色液污染涂片样品; 以及控制器，其中所述控制器：接收关于通过所述染色部分根据第一染色条件染色的涂片样品上的染色状态的信息; 并且基于该信息和定义目标污点状态的目标值确定第二染色条件。还公开了涂片制备装置，涂片处理系统和染色条件的测定方法。

10. 发明授权

US08778266B2 Slide processing apparatus 有权
标题翻译：幻灯片处理装置
公开(公告)号：US08778266B2
公开(公告)日：2014-07-15
申请号：US13362514
申请日：2012-01-31
申请人： Mitsuo Yamasaki
发明人： Mitsuo Yamasaki
IPC分类号： G01N21/00
CPC分类号： G01N35/00029 , G01N1/312
摘要： A slide processing apparatus is disclosed. The apparatus comprise a liquid transporter for transporting a staining liquid reserved in a first liquid container and a washing liquid reserved in a second liquid container; a first instruction receiver for receiving a first instruction that instructs to initiate preparation of a slide stained with the staining liquid; a second instruction receiver for receiving a second instruction that instructs to initiate washing of a housing element which accommodates therein a slide to be stained; and a controller. When receiving the first instruction, the controller performs staining of the slide accommodated in the housing element by causing the liquid transporter to transport the staining liquid into the housing element. When receiving the second instruction, the controller performs washing of the housing element by causing the liquid transport to transport the washing liquid into the housing element.
摘要翻译：公开了一种滑动处理装置。该装置包括用于输送预定在第一液体容器中的染色液体的液体输送器和预留在第二液体容器中的洗涤液体; 第一指令接收器，用于接收指示开始准备染色液体染色的载玻片的第一指令; 第二指令接收器，用于接收指示开始清洗容纳元件的第二指令，其中容纳要被染色的幻灯片; 和控制器。当接收到第一指示时，控制器通过使液体输送器将染色液体输送到壳体元件中来进行容纳在壳体元件中的滑块的染色。当接收到第二指令时，控制器通过使液体输送将洗涤液输送到壳体元件中来进行壳体元件的洗涤。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式