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1. 发明授权

US09111972B2 Substrate processing apparatus and manufacturing method for a semiconductor device 有权
标题翻译：基板处理装置及半导体装置的制造方法
公开(公告)号：US09111972B2
公开(公告)日：2015-08-18
申请号：US10593282
申请日：2005-06-27
申请人： Mitsunori Takeshita , Tomoyuki Matsuda , Mitsuhiro Hirano , Akihiro Sato , Shinya Morita , Toshimitsu Miyata , Koji Shibata
发明人： Mitsunori Takeshita , Tomoyuki Matsuda , Mitsuhiro Hirano , Akihiro Sato , Shinya Morita , Toshimitsu Miyata , Koji Shibata
IPC分类号： C23C16/44 , H01L21/469 , H01L21/673 , H01L21/677 , C23C16/54 , H01L21/67
CPC分类号： H01L21/67303 , C23C16/4401 , C23C16/54 , H01L21/67196 , H01L21/67201 , H01L21/6773
摘要： The sizes required for maintenance are reduced and an occupying floor area is reduced. The substrate processing apparatus contains a load lock chamber 41 and a transfer chamber 24 respectively provided in order from the rear side within a case 11; and a processing chamber 53 provided above the load lock chamber 41 for processing wafers 1. An opening section 27A, and an opening and closing means 28A for opening and closing the opening section 27A are respectively provided in a location at the rear side of the transfer chamber 24 where the load lock chamber 41 is not arranged.
摘要翻译：维护所需的尺寸减少，占地面积减少。基板处理装置包括分别从壳体11内的后侧设置的负载锁定室41和传送室24; 以及设置在用于处理晶片1的负载锁定室41上方的处理室53.开口部分27A以及用于打开和关闭开口部分27A的打开和关闭装置28A分别设置在转印器后侧的位置不设置负载锁定室41的室24。

2. 发明申请

US20080236488A1 Substrate Processing Apparatus and Manufacturing Method for a Semiconductor Device 有权
标题翻译：基板处理装置及半导体装置的制造方法
公开(公告)号：US20080236488A1
公开(公告)日：2008-10-02
申请号：US10593282
申请日：2005-06-27
申请人： Mitsunori Takeshita , Tomoyuki Matsuda , Mitsuhiro Hirano , Akihiro Sato , Shinya Morita , Toshimitsu Miyata , Koji Shibata
发明人： Mitsunori Takeshita , Tomoyuki Matsuda , Mitsuhiro Hirano , Akihiro Sato , Shinya Morita , Toshimitsu Miyata , Koji Shibata
IPC分类号： C23C16/44 , H01L21/469
CPC分类号： H01L21/67303 , C23C16/4401 , C23C16/54 , H01L21/67196 , H01L21/67201 , H01L21/6773
摘要： The sizes required for maintenance are reduced and an occupying floor area is reduced. The substrate processing apparatus contains a load lock chamber 41 and a transfer chamber 24 respectively provided in order from the rear side within a case 11; and a processing chamber 53 provided above the load lock chamber 41 for processing wafers 1. An opening section 27A, and an opening and closing means 28A for opening and closing the opening section 27A are respectively provided in a location at the rear side of the transfer chamber 24 where the load lock chamber 41 is not arranged.
摘要翻译：维护所需的尺寸减少，占地面积减少。基板处理装置包括分别从壳体11内的后侧设置的负载锁定室41和传送室24; 以及设置在加载锁定室41上方的用于处理晶片1的处理室53。开口部分27A和用于打开和关闭开口部分27A的打开和关闭装置28A分别设置在不设置负载锁定室41的传送室24的后侧的位置。

3. 发明申请

US20110139070A1 SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 有权
标题翻译：基板加工装置及制造半导体装置的方法
公开(公告)号：US20110139070A1
公开(公告)日：2011-06-16
申请号：US12964921
申请日：2010-12-10
申请人： Kazuya NABETA , Naoki UKAE , Mitsunori TAKESHITA
发明人： Kazuya NABETA , Naoki UKAE , Mitsunori TAKESHITA
IPC分类号： C23C16/52 , C23C16/458 , C23C16/46 , C23C16/455
CPC分类号： C23C16/46 , C23C16/458 , C23C16/4586 , C23C16/52 , H01J37/32082 , H01J37/3266 , H01L21/67109 , H01L21/68785 , H01L21/68792
摘要： A stable and highly reliable device for detecting damage or contact failures of respective parts is provided. The device includes a processing chamber for processing a substrate; a heater for heating the substrate; a substrate support accommodating the heater and installed inside the processing chamber; a shaft for supporting the substrate support; a wire inserted through the shaft; a supporting unit for holding the wire; and a temperature detector connected to the supporting unit.
摘要翻译：提供了一种用于检测各部件的损坏或接触故障的稳定且高可靠性的装置。该装置包括用于处理基板的处理室; 用于加热基板的加热器; 容纳加热器并安装在处理室内的基板支撑件; 用于支撑所述基板支撑件的轴; 通过轴插入的电线; 用于保持电线的支撑单元; 以及连接到支撑单元的温度检测器。

4. 发明申请

US20060090849A1 Substrate processing apparatus 审中-公开
标题翻译：基板加工装置
公开(公告)号：US20060090849A1
公开(公告)日：2006-05-04
申请号：US11293257
申请日：2005-12-05
申请人： Kazuyuki Toyoda , Atsuhiko Suda , Issei Makiguchi , Tsutomu Tanaka , Sadayuki Suzuki , Shinichi Nomura , Mitsunori Takeshita
发明人： Kazuyuki Toyoda , Atsuhiko Suda , Issei Makiguchi , Tsutomu Tanaka , Sadayuki Suzuki , Shinichi Nomura , Mitsunori Takeshita
IPC分类号： C23F1/00
CPC分类号： H01L21/67178 , C23C16/54 , H01L21/67766 , H01L21/67781
摘要： A substrate processing apparatus comprises a substrate transfer section, a plurality of modules and a first substrate transfer robot provided in the substrate transfer section and capable of transferring substrates to the plurality of modules. The plurality of modules are piled up, separately from one another, in a vertical direction. Each of the plurality of modules are detachably mounted to the substrate transfer section and includes a substrate processing chamber, an intermediate chamber, a first gate valve disposed between the substrate processing chamber and the intermediate chamber, a second gate valve disposed between the intermediate chamber and the substrate transfer section, and a second substrate transfer robot disposed in the intermediate chamber. Preferably, the substrate processing chamber further comprises a second intermediate chamber having a substrate holder therein and disposed between the intermediate chamber and the substrate transfer section, and a third gate valve disposed between the second intermediate chamber and the substrate transfer section.
摘要翻译：基板处理装置包括基板转印部，多个模块和设置在基板转印部中并能够将基板传送到多个模块的第一基板传送机械手。多个模块在垂直方向彼此分开堆叠。多个模块中的每一个可拆卸地安装到基板传送部分，并且包括基板处理室，中间室，设置在基板处理室和中间室之间的第一闸阀，设置在中间室和第二闸阀之间的第二闸阀基板传送部分和设置在中间室中的第二基板传送机器人。优选地，衬底处理室还包括第二中间室，其中具有衬底保持器，并设置在中间室和衬底转移部之间，以及设置在第二中间室和衬底转移部之间的第三闸阀。

5. 发明授权

US09305820B2 Substrate processing apparatus and method of manufacturing semiconductor device 有权
标题翻译：基板处理装置及半导体装置的制造方法
公开(公告)号：US09305820B2
公开(公告)日：2016-04-05
申请号：US12964921
申请日：2010-12-10
申请人： Kazuya Nabeta , Naoki Ukae , Mitsunori Takeshita
发明人： Kazuya Nabeta , Naoki Ukae , Mitsunori Takeshita
IPC分类号： C23C16/458 , H01L21/67 , H01L21/687 , H01J37/32
CPC分类号： C23C16/46 , C23C16/458 , C23C16/4586 , C23C16/52 , H01J37/32082 , H01J37/3266 , H01L21/67109 , H01L21/68785 , H01L21/68792
摘要： A stable and highly reliable device for detecting damage or contact failures of respective parts is provided. The device includes a processing chamber for processing a substrate; a heater for heating the substrate; a substrate support accommodating the heater and installed inside the processing chamber; a shaft for supporting the substrate support; a wire inserted through the shaft; a supporting unit for holding the wire; and a temperature detector connected to the supporting unit.
摘要翻译：提供了一种用于检测各部件的损坏或接触故障的稳定且高可靠性的装置。该装置包括用于处理基板的处理室; 用于加热基板的加热器; 容纳加热器并安装在处理室内的基板支撑件; 用于支撑所述基板支撑件的轴; 通过轴插入的电线; 用于保持电线的支撑单元; 以及连接到支撑单元的温度检测器。

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