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    • 4. 发明授权
    • Contact for semiconductor and display devices
    • 半导体和显示设备接触
    • US07580088B2
    • 2009-08-25
    • US11854059
    • 2007-09-12
    • Jang-Soo KimHyang-Shik KongMin-Wook ParkSang-Jin Jeon
    • Jang-Soo KimHyang-Shik KongMin-Wook ParkSang-Jin Jeon
    • G02F1/136H01L21/4763
    • G02F1/13458G02F1/136227G02F1/136286G02F2001/136236H01L27/124H01L27/1244H01L27/1288H01L29/66765
    • A device and corresponding method of fabrication thereof are disclosed, where the device provides a contact for semiconductor and display devices, the device including a substrate, a first wiring line assembly formed on the substrate, an under-layer formed on the first wiring line assembly, an organic insulating layer formed on the under-layer such that the organic insulating layer covers the under-layer, a pattern on the organic insulating layer for contact holes to expose the under-layer, etched contact holes formed in the under-layer in correspondence with the pattern such that the underlying first wiring line assembly is exposed to the outside, a cured organic insulating layer formed on the under-layer, and a second wiring line assembly formed on the organic insulating layer such that the second wiring line assembly is connected to the first wiring line assembly through the etched contact holes, and the corresponding method of fabrication including forming a first wiring line assembly on a substrate, forming an under-layer on the first wiring line assembly, forming an organic insulating layer such that the organic insulating layer covers the under-layer patterning the organic insulating layer to thereby form contact holes exposing the under-layer, etching the under-layer exposed through the contact holes such that the underlying first wiring line assembly is exposed to the outside, curing the organic insulating layer, and forming a second wiring line assembly on the organic insulating layer such that the second wiring line assembly is connected to the first wiring line assembly through the contact holes.
    • 公开了一种器件及其相应的制造方法,其中器件为半导体和显示器件提供接触,该器件包括衬底,形成在衬底上的第一布线组件,形成在第一布线组件上的底层 形成在下层上的有机绝缘层,使得有机绝缘层覆盖下层,在有机绝缘层上形成用于接触孔的图案,以暴露下层中形成的下层的蚀刻接触孔, 与图案对应,使得下面的第一布线组件暴露于外部,形成在下层上的固化的有机绝缘层和形成在有机绝缘层上的第二布线组件,使得第二布线组件是 通过蚀刻的接触孔连接到第一布线组件,以及相应的制造方法,包括形成第一布线组件 在第一布线组件上形成底层,形成有机绝缘层,使得有机绝缘层覆盖图案化有机绝缘层的下层,从而形成暴露下层,蚀刻的接触孔 所述下层通过所述接触孔暴露,使得所述下面的第一布线组件暴露于外部,固化所述有机绝缘层,以及在所述有机绝缘层上形成第二布线组合件,使得所述第二布线组件被连接 通过接触孔到第一布线组件。
    • 5. 发明申请
    • LIQUID CRYSTAL DISPLAY AND METHOD THEREOF
    • 液晶显示及其方法
    • US20080079885A1
    • 2008-04-03
    • US11862567
    • 2007-09-27
    • Jeong-Ho LeeMin-Wook Park
    • Jeong-Ho LeeMin-Wook Park
    • G02F1/1335
    • G02F1/133707G02F1/1343G02F2201/122
    • A liquid crystal display (“LCD”) includes a first substrate, a second substrate, and a liquid crystal layer interposed between the first and second substrates. A pixel electrode is formed on the first substrate and provided with a first domain divider. A common electrode is formed on the second substrate and provided with a second domain divider. The second domain divider extends in a first direction and a second direction symmetric with the first direction in order to have a curved portion of the second domain divider. The common electrode has a concavo-convex portion in a saw-toothed shape in a plan view of the common electrode, and the concavo-convex portion is positioned in a region where the curved portion is formed.
    • 液晶显示器(“LCD”)包括第一基板,第二基板和介于第一和第二基板之间的液晶层。 像素电极形成在第一基板上并且设置有第一畴分隔器。 公共电极形成在第二基板上并且设置有第二畴分隔器。 第二畴分隔器沿第一方向延伸,第二方向与第一方向对称,以便具有第二畴分隔器的弯曲部分。 公共电极在公共电极的平面图中具有锯齿状的凹凸部,凹凸部位于形成有弯曲部的区域。
    • 6. 发明授权
    • Contact for semiconductor and display devices
    • 半导体和显示设备接触
    • US07271867B2
    • 2007-09-18
    • US10273073
    • 2002-10-17
    • Jang-Soo KimHyang-Shik KongMin-Wook ParkSang-Jin Jeon
    • Jang-Soo KimHyang-Shik KongMin-Wook ParkSang-Jin Jeon
    • G02F1/1333G02F1/136
    • G02F1/13458G02F1/136227G02F1/136286G02F2001/136236H01L27/124H01L27/1244H01L27/1288H01L29/66765
    • A device and corresponding method of fabrication thereof are disclosed, where the device provides a contact for semiconductor and display devices, the device including a substrate, a first wiring line assembly formed on the substrate, an under-layer formed on the first wiring line assembly, an organic insulating layer formed on the under-layer such that the organic insulating layer covers the under-layer, a pattern on the organic insulating layer for contact holes to expose the under-layer, etched contact holes formed in the under-layer in correspondence with the pattern such that the underlying first wiring line assembly is exposed to the outside, a cured organic insulating layer formed on the under-layer, and a second wiring line assembly formed on the organic insulating layer such that the second wiring line assembly is connected to the first wiring line assembly through the etched contact holes; and the corresponding method of fabrication including forming a first wiring line assembly on a substrate, forming an under-layer on the first wiring line assembly, forming an organic insulating layer such that the organic insulating layer covers the under-layer, patterning the organic insulating layer to thereby form contact holes exposing the under-layer, etching the under-layer exposed through the contact holes such that the underlying first wiring line assembly is exposed to the outside, curing the organic insulating layer, and forming a second wiring line assembly on the organic insulating layer such that the second wiring line assembly is connected to the first wiring line assembly through the contact holes.
    • 公开了一种器件及其相应的制造方法,其中器件为半导体和显示器件提供接触,该器件包括衬底,形成在衬底上的第一布线组件,形成在第一布线组件上的底层 形成在下层上的有机绝缘层,使得有机绝缘层覆盖下层,在有机绝缘层上形成用于接触孔的图案,以暴露下层中形成的下层的蚀刻接触孔, 与图案对应,使得下面的第一布线组件暴露于外部,形成在下层上的固化的有机绝缘层和形成在有机绝缘层上的第二布线组件,使得第二布线组件是 通过蚀刻的接触孔连接到第一布线组件; 以及相应的制造方法,包括在基板上形成第一布线线组件,在第一布线线路组件上形成底层,形成有机绝缘层,以使有机绝缘层覆盖下层,图案化有机绝缘层 从而形成暴露下层的接触孔,蚀刻通过接触孔暴露的下层,使得下面的第一布线线组件暴露于外部,固化有机绝缘层,并形成第二布线组件 所述有机绝缘层使得所述第二布线组合体通过所述接触孔连接到所述第一布线线组件。