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1. 发明申请

US20050236107A1 Method of thermal adherend release and apparatus for thermal adherend release 审中-公开
标题翻译：热粘合剂释放方法和热粘贴层释放装置
公开(公告)号：US20050236107A1
公开(公告)日：2005-10-27
申请号：US11108778
申请日：2005-04-19
申请人： Tomoko Doi , Masakazu Tanimoto , Yukio Arimitsu , Daisuke Shimokawa , Michirou Kawanishi
发明人： Tomoko Doi , Masakazu Tanimoto , Yukio Arimitsu , Daisuke Shimokawa , Michirou Kawanishi
IPC分类号： C09J5/00 , C09J7/02 , C09J11/00 , H01L21/00 , H01L21/301 , H01L21/52 , H01L21/68 , B32B1/00
CPC分类号： H01L21/6835 , C09J7/22 , C09J7/38 , C09J2203/326 , C09J2205/11 , C09J2205/302 , H01L21/6836 , H01L2221/68322 , H01L2221/68327 , H01L2221/68336 , H01L2221/68381 , H01L2924/19041 , Y10T156/1147 , Y10T156/1153 , Y10T156/1911
摘要： The present invention intends to provide a method of thermal adherend release by which, when part of adherends on a heat-peelable pressure-sensitive adhesive sheet are desired to be thermally released therefrom, the desired part only can be easily and speedily released. A method of thermal adherend release, wherein part of adherends adherent to a heat-peelable pressure-sensitive adhesive sheet having a heat-expandable layer containing a foaming agent are selectively released from the pressure-sensitive adhesive sheet, wherein the method comprises partly heating the heat-peelable pressure-sensitive adhesive sheet in an atmosphere having a temperature of 50° C. or higher at which the heat-expandable layer does not expand to thereby selectively release the adherends.
摘要翻译：本发明旨在提供一种热粘贴层剥离方法，当热可剥离粘合片上的被粘物的一部分期望被热释放时，所需的部分只能容易且快速地释放。一种热粘贴层剥离方法，其特征在于，粘贴于具有含有发泡剂的热膨胀层的热剥离性粘合片的被粘物部分从所述压敏粘合片中选择性地释放，其特征在于，在可膨胀层不膨胀的温度为50℃以上的气氛中，热剥离性粘合片选择性地剥离被粘物。

2. 发明申请

US20100116807A1 DISASSEMBLABLE STRUCTURE, ELECTRIC EQUIPMENT AND NON-ELECTRIC EQUIPMENT HAVING DISASSEMBLABLE STRUCTURE, AND DISASSEMBLING METHOD 有权
标题翻译：可拆卸结构，具有可拆卸结构的电气设备和非电气设备，以及拆除方法
公开(公告)号：US20100116807A1
公开(公告)日：2010-05-13
申请号：US12615299
申请日：2009-11-10
申请人： Eiji YAMANAKA , Michirou KAWANISHI , Masahiko ANDO , Yasuyuki TOKUNAGA , Tooru NAKASHIMA
发明人： Eiji YAMANAKA , Michirou KAWANISHI , Masahiko ANDO , Yasuyuki TOKUNAGA , Tooru NAKASHIMA
IPC分类号： H05B1/00 , B32B7/12 , B32B15/04 , B23P19/00
CPC分类号： H05B6/105 , B32B5/18 , B32B7/12 , B32B15/02 , B32B15/08 , B32B27/065 , B32B27/14 , B32B27/306 , B32B27/36 , B32B2250/40 , B32B2264/105 , B32B2264/108 , B32B2307/202 , B32B2457/20 , B32B2509/10 , H05B6/14 , Y10T29/49815 , Y10T428/2804
摘要： The present invention relates to a disassemblable structure including: a double-coated pressure-sensitive adhesive tape or a double-coated pressure sensitive adhesive sheet including a substrate and pressure-sensitive adhesive layers formed on both surfaces of the substrate, at least one of the pressure-sensitive adhesive layers being a thermal foaming agent-containing pressure-sensitive adhesive layer; a heating element which foams the thermal foaming agent-containing pressure-sensitive adhesive layer by heating; and a pair of adherends joined to each other through the pressure-sensitive adhesive tape or sheet and the heating element.
摘要翻译：本发明涉及一种可拆卸结构，包括：双面压敏粘合带或双面压敏粘合片，其包括形成在基板的两个表面上的基板和压敏粘合剂层，至少一个压敏粘合剂层是含热发泡剂的压敏粘合剂层; 通过加热使含热发泡剂的压敏粘合剂层发泡的加热元件; 以及通过压敏粘合带或片和加热元件彼此接合的一对被粘物。

3. 发明授权

US4966282A Electronic component carrier 失效
标题翻译：电子元件载体
公开(公告)号：US4966282A
公开(公告)日：1990-10-30
申请号：US393173
申请日：1989-08-14
申请人： Michirou Kawanishi , Kaoru Aizawa , Tatsuo Kurono
发明人： Michirou Kawanishi , Kaoru Aizawa , Tatsuo Kurono
IPC分类号： B65D73/02
CPC分类号： B65D73/02
摘要： An electronic component carrier includes a carrier tape having a series of through holes formed therethrough and spaced from one another at a predetermined interval along the length of the casrrier tape. An adhesive tape having an adhesive layer is bonded to one side of the carrier tape by the adhesive layer. The adhesive layer partially covers each of the through holes. A plurality of electronic components are received respectively in the series of through holes and are bonded to that portion of the adhesive layer partially covering the through holes, thereby holding the electronic components on the carrier tape. An area of adhesive contact between the adhesive tape and the carrier tape and an area of adhesive contact between the adhesive tape and the electronic component can be isolated from each other at least in the direction of the width of the carrier tape.
摘要翻译：电子部件载体包括载带，该载带具有穿过其形成的一系列通孔，并且沿着该胶带的长度以预定的间隔彼此隔开。具有粘合剂层的胶带通过粘合剂层粘合到载带的一侧。粘合剂层部分地覆盖每个通孔。多个电子部件被分别接收在一系列通孔中，并且粘合到部分地覆盖通孔的粘合剂层的那部分上，从而将电子部件保持在载带上。粘合带和载带之间的粘合区域和粘合带和电子部件之间的粘合区域可以至少沿着载带宽度的方向彼此隔离。

4. 发明授权

US4966281A Electronic component carrier 失效
标题翻译：电子元件载体
公开(公告)号：US4966281A
公开(公告)日：1990-10-30
申请号：US393177
申请日：1989-08-14
申请人： Michirou Kawanishi , Kaoru Aizawa , Kyoichi Araki , Kiyohiro Kamei , Kunio Nagasaki
发明人： Michirou Kawanishi , Kaoru Aizawa , Kyoichi Araki , Kiyohiro Kamei , Kunio Nagasaki
IPC分类号： B65D73/02 , H05K13/00
CPC分类号： H05K13/0038 , B65D73/02
摘要： An electronic component carrier includes an elongated substrate having a series of electronic component-setting portions spaced from one another at a predetermined interval along the length of the substrate. The substrate has push bar-insertion holes formed therethrough and disposed respectively at the electronic component-setting portions. Adhesive layers are formed respectively on surfaces of the electronic component-setting portions. The electronic components are adapted to be bonded respectively to the electronic component-setting portions through the adhesive layers. A push bar is adapted to be inserted into the push bar-insertion hole so as to be engaged with the electronic component to release the same from the adhesive layer.
摘要翻译：电子部件载体包括细长基板，其具有沿着基板的长度以预定间隔彼此隔开的一系列电子部件设置部。基板具有穿过其形成的推杆插入孔，分别设置在电子部件设置部。分别在电子部件设置部分的表面上形成粘合剂层。电子部件适于通过粘合剂层分别结合到电子部件设置部分。推杆适于插入到推杆插入孔中，以与电子部件接合以将其从粘合剂层释放。

5. 发明申请

US20120270036A1 PRESSURE-SENSITIVE ADHESIVE TAPE FOR ELECTROCHEMICAL DEVICE 审中-公开
标题翻译：用于电化学设备的压敏胶带
公开(公告)号：US20120270036A1
公开(公告)日：2012-10-25
申请号：US13267255
申请日：2011-10-06
申请人： Kazuyuki KIUCHI , Hiroomi HANAI , Shigeki KAWABE , Michirou KAWANISHI
发明人： Kazuyuki KIUCHI , Hiroomi HANAI , Shigeki KAWABE , Michirou KAWANISHI
IPC分类号： B32B27/04 , B32B7/10
CPC分类号： C09J133/066 , C09J7/22 , C09J7/38 , C09J7/385 , C09J133/08 , C09J2201/622 , C09J2203/33 , C09J2423/006 , C09J2433/00 , C09J2467/006 , H01M2/0275 , H01M2/0287 , H01M10/0468 , Y10T428/265 , Y10T428/2891
摘要： To provide a pressure-sensitive adhesive tape for an electrochemical device that has an extremely low water content, that is unlikely to lead to “adhesive protrusion”, and that is not removed even when it is in contact with an electrolytic solution. The pressure-sensitive adhesive tape for an electrochemical device of the present invention includes a pressure-sensitive adhesive layer composed of an acrylic pressure-sensitive adhesive on at least one side of a plastic base, and is characterized by including the pressure-sensitive adhesive layer having a gel content of 60% or more and a thickness of 1 to 15 μm, and by having a water absorption rate of 0.2% or less after immersion in water at 23° C. for 24 hours.
摘要翻译：为了提供一种具有极低含水率的电化学装置的压敏粘合带，这不太可能导致粘合剂突出，并且即使当它与电解液接触时也不会被去除。本发明的电化学装置用粘合带包括在塑料基材的至少一面上由丙烯酸类压敏粘合剂构成的粘合剂层，其特征在于，包括粘合剂层凝胶含量为60％以上，厚度为1〜15μm，在23℃下浸渍24小时后的吸水率为0.2％以下。

6. 发明申请

US20080008831A1 Heat-peelable pressure-sensitive adhesive sheet 审中-公开
标题翻译：热剥离性粘合片
公开(公告)号：US20080008831A1
公开(公告)日：2008-01-10
申请号：US11822206
申请日：2007-07-03
申请人： Tomoko Kishimoto , Masakazu Tanimoto , Yukio Arimitsu , Michirou Kawanishi
发明人： Tomoko Kishimoto , Masakazu Tanimoto , Yukio Arimitsu , Michirou Kawanishi
IPC分类号： B05D5/10
CPC分类号： B32B37/12 , B32B27/00 , B32B2307/748 , B32B2405/00 , C09J7/38 , C09J2203/326 , C09J2205/11 , H01L21/6836 , H01L2221/68327 , Y10T428/28
摘要： A heat-peelable pressure-sensitive adhesive sheet, which comprises a substrate, a heat-expandable adhesive layer formed on at least one surface thereof, and a surfactant, wherein the surfactant is contained in the heat-expandable adhesive layer as an adhesive surface.
摘要翻译：一种可热剥离的压敏粘合片，其包含基材，在其至少一个表面上形成的热膨胀性粘合剂层和表面活性剂，其中所述表面活性剂作为粘合剂表面包含在所述热膨胀性粘合剂层中。

7. 发明授权

US5466325A Resist removing method, and curable pressure-sensitive adhesive, adhesive sheets and apparatus used for the method 失效
标题翻译：抗蚀剂除去方法和可固化的压敏粘合剂，用于该方法的粘合片和设备
公开(公告)号：US5466325A
公开(公告)日：1995-11-14
申请号：US288988
申请日：1994-08-11
申请人： Fumio Mizuno , Noboru Moriuchi , Seiichiro Shirai , Yutaka Moroishi , Makoto Sunakawa , Michirou Kawanishi
发明人： Fumio Mizuno , Noboru Moriuchi , Seiichiro Shirai , Yutaka Moroishi , Makoto Sunakawa , Michirou Kawanishi
IPC分类号： B29C63/00 , G03F7/34 , G03F7/42 , B32B7/10 , B32B31/00
CPC分类号： B29C63/0013 , G03F7/343 , G03F7/42 , Y10S156/922 , Y10T156/11 , Y10T156/1189
摘要： A method for removing a resist pattern formed on a semiconductor wafer, and a curable pressure-sensitive adhesive, adhesive sheets and an apparatus used for the method. The resist-removing method comprising adhering an adhesive tape on an upper surface of a resist pattern formed on an article and peeling off the resist pattern together with the adhesive tape; the curable pressure-sensitive adhesive constituting the adhesive tape, comprising a pressure-sensitive adhesive polymer containing a non-volatile compound having at least one unsaturated double bond in the molecule and having a good affinity with a resist material to be removed; the adhesive sheet comprising a film substrate having formed thereon the curable pressure-sensitive adhesive; and the resist-removing apparatus comprising a means for press-adhering the adhesive tape, a tape-peeling means, and a substrate-washing means.
摘要翻译：一种用于去除形成在半导体晶片上的抗蚀剂图案的方法，以及用于该方法的可固化压敏粘合剂，粘合片和设备。抗蚀剂去除方法包括将粘合带粘附在形成在制品上的抗蚀剂图案的上表面上并与粘合带一起剥离抗蚀剂图案; 构成粘合带的可固化压敏粘合剂包括在分子中含有至少一个不饱和双键的非挥发性化合物并且与要去除的抗蚀剂材料具有良好亲和性的压敏粘合剂聚合物; 所述粘合片包括其上形成有所述可固化压敏粘合剂的膜基材; 并且抗蚀剂去除装置包括用于压粘粘合带的装置，带剥离装置和基板清洗装置。

8. 发明申请

US20140158300A1 PROTECTIVE SHEET FOR GLASS ETCHING 审中-公开
标题翻译：玻璃蚀刻保护片
公开(公告)号：US20140158300A1
公开(公告)日：2014-06-12
申请号：US14233633
申请日：2012-06-08
申请人： Maiko Hayata , Michirou Kawanishi , Yu-Han Yuan , Jen-Chun Fang
发明人： Maiko Hayata , Michirou Kawanishi , Yu-Han Yuan , Jen-Chun Fang
IPC分类号： C03B19/00
CPC分类号： C03B19/00 , C08K5/0025 , C08K5/1515 , C08K5/29 , C09J7/385 , C09J133/08 , C09J2201/122 , C09J2201/622 , C09J2205/102 , C09J2433/00 , C08F2220/1858 , C08F218/08 , C08F220/06
摘要： This invention provides a protective sheet for glass etching, having excellent etching solution penetration resistance, non-contaminating property and peeling efficiency. The protective sheet comprises a substrate and a PSA layer provided on one face of the substrate, such that, when the protective sheet is adhered to a non-etching area when etching glass, it protects the non-etching area from an etching solution. The PSA layer is constituted with a PSA having a gel fraction of 60% or higher. The PSA is an acrylic PSA comprising an acrylic polymer as a primary component. The acrylic polymer is synthesized by polymerizing starting monomers comprising, as a primary monomer, a monomer represented by a formula: CH2═CR1COOR2 (R1 is a hydrogen atom or a methyl group, and R2 is an alkyl group). The primary monomer comprises as a primary component a monomer with R2 being an alkyl group having 6 or more carbons.
摘要翻译：本发明提供了一种玻璃蚀刻保护片，具有优异的蚀刻溶液渗透阻力，无污染性和剥离效率。保护片包括基板和设置在基板的一个表面上的粘合层，使得当蚀刻玻璃时保护片粘附到非蚀刻区域时，其保护非蚀刻区域免受蚀刻溶液的影响。 PSA层由凝胶分数为60％以上的PSA构成。 PSA是包含丙烯酸类聚合物作为主要成分的丙烯酸PSA。通过聚合起始单体合成丙烯酸类聚合物，所述起始单体包含作为主要单体的由下式表示的单体：CH 2 = CR 1 COOR 2（R 1是氢原子或甲基，R 2是烷基）。主要单体包括作为主要组分的单体，其中R 2是具有6个或更多个碳的烷基。

9. 发明申请

US20080073034A1 Method for thermally releasing adherend and apparatus for thermally releasing adherend 审中-公开
标题翻译：粘合剂热释放方法和用于热脱模粘合体的装置
公开(公告)号：US20080073034A1
公开(公告)日：2008-03-27
申请号：US11984362
申请日：2007-11-16
申请人： Seiji Izutani , Michirou Kawanishi , Yukio Arimitsu
发明人： Seiji Izutani , Michirou Kawanishi , Yukio Arimitsu
IPC分类号： B32B38/10
CPC分类号： H01L21/6835 , C09J7/38 , C09J2201/36 , C09J2205/11 , H01L21/67132 , H01L21/6836 , H01L2221/68322 , H01L2221/68327 , H01L2924/19041 , Y10T156/1147 , Y10T156/1153 , Y10T156/1184 , Y10T156/1911 , Y10T156/1967
摘要： The invention provides a method for thermally releasing an adherend, which comprises selectively releasing one or some of a plurality of substances adhered on a thermally releasable pressure-sensitive adhesive sheet having a thermally expandable layer containing therein thermo-expandable microspheres, by partly heating the pressure-sensitive adhesive sheet using a heating unit capable of partly heating the pressure-sensitive adhesive sheet. This thermally releasing method may further involve a step of cutting the substance adhered to the pressure-sensitive adhesive sheet. In this occasion, the heating unit has a heating portion of a shape in conformity with the shape of the adherend to be released, and may be provided on at lease one of the side to which the adherend is adhered and the opposite side thereto of the pressure-sensitive adhesive sheet.
摘要翻译：本发明提供了一种用于热释放被粘物的方法，其包括通过部分加热压力来选择性地释放粘附在具有热可膨胀层的热可释放压敏粘合片上的多种物质中的一种或一种，其中包含热可膨胀微球使用能够部分加热压敏粘合片的加热单元的敏感性粘合片。该热释放方法还可以包括切割附着在压敏粘合片上的物质的步骤。在这种情况下，加热单元具有与待被剥离的被粘物的形状一致的加热部，并且可以设置在被粘物侧的至少一侧和与被粘物相反的一侧压敏粘合片。

10. 发明授权

US07332219B2 Tape-shaped insulating material, insulated product and aqueous dispersion type acrylic pressure-sensitive adhesive for insulating material 失效
标题翻译：胶带绝缘材料，绝缘产品和水分散型丙烯酸类压敏粘合剂用于绝缘材料
公开(公告)号：US07332219B2
公开(公告)日：2008-02-19
申请号：US10485019
申请日：2002-07-25
申请人： Mitsuyoshi Shirai , Natsuko Okumura , Michirou Kawanishi
发明人： Mitsuyoshi Shirai , Natsuko Okumura , Michirou Kawanishi
IPC分类号： B32B7/12
CPC分类号： H01B3/30 , C08L2666/02 , C09J7/22 , C09J7/38 , C09J7/385 , C09J133/06 , C09J133/12 , C09J2201/606 , C09J2203/302 , C09J2433/00 , H01B3/44 , Y10T428/28 , Y10T428/2878 , Y10T428/2891
摘要： A tape-shaped insulating material comprises an insulating substrate and a pressure-sensitive adhesive layer provided on one side or both sides of the substrate, wherein the pressure-sensitive adhesive layer is made of an aqueous dispersion type acrylic pressure-sensitive adhesive containing a polymer emulsion that is a product of emulsion polymerization of a monomer mainly composed of C4 to C12 alkyl(meth)acrylate ester in the presence of an emulsifying agent. The tape-shaped insulating material has an electrolytic corrosion coefficient according to JIS C-2338 of 0.98 or more, and the pressure-sensitive adhesive layer has good insulating characteristics.
摘要翻译：带状绝缘材料包括绝缘基板和设置在基板的一侧或两侧的压敏粘合剂层，其中压敏粘合剂层由含有聚合物的水分散型丙烯酸类压敏粘合剂制成乳液，其是在乳化剂存在下主要由C 4〜C 12烷基（甲基）丙烯酸烷基酯组成的单体的乳液聚合的产物。带状绝缘材料具有根据JIS C-2338的电解腐蚀系数为0.98以上，并且粘合剂层具有良好的绝缘特性。

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