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1. 发明授权

US08502397B2 Heat-resistant adhesive sheet for semiconductor device fabrication, adhesive used for the sheet, and method for fabricating semiconductor device using the sheet 失效
标题翻译：用于半导体器件制造的耐热粘合片，用于片材的粘合剂，以及使用该片材制造半导体器件的方法
公开(公告)号：US08502397B2
公开(公告)日：2013-08-06
申请号：US12970282
申请日：2010-12-16
申请人： Yuichiro Yanagi , Kazuyuki Kiuchi , Shinji Hoshino
发明人： Yuichiro Yanagi , Kazuyuki Kiuchi , Shinji Hoshino
IPC分类号： H01L23/28
CPC分类号： H01L21/568 , C09J7/20 , C09J2203/326 , C09J2421/00 , C09J2463/00 , H01L23/3107 , H01L23/3114 , H01L23/5389 , H01L24/24 , H01L24/96 , H01L2224/24137 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01051 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/181 , Y10T428/287 , H01L2924/00
摘要： The present invention provides a heat-resistant adhesive sheet for semiconductor device fabrication that is attached to a substrateless semiconductor chip when the chip is encapsulated with resin. The adhesive sheet includes a base material layer and an adhesive layer. The adhesive layer contains a rubber component and an epoxy resin component. The proportion of the rubber component in an organic substance in the adhesive is in the range of 20 to 60 wt %.
摘要翻译：本发明提供了一种用于半导体器件制造的耐热粘合片，当芯片被树脂封装时，该耐热粘合片被附着到无基底半导体芯片上。粘合片包括基材层和粘合剂层。粘合层含有橡胶成分和环氧树脂成分。粘合剂中的有机物质中的橡胶成分的比例为20〜60重量％。

2. 发明申请

US20110151625A1 HEAT-RESISTANT ADHESIVE SHEET FOR SUBSTRATELESS SEMICONDUCTOR PACKAGE FABRICATION AND METHOD FOR FABRICATING SUBSTRATELESS SEMICONDUCTOR PACKAGE USING THE ADHESIVE SHEET 失效
标题翻译：用于无基板半导体封装的耐热粘合片材制造和使用粘合片材制造无基板半导体封装的方法
公开(公告)号：US20110151625A1
公开(公告)日：2011-06-23
申请号：US12974620
申请日：2010-12-21
申请人： Shinji HOSHINO , Yukio ARIMITSU , Kazuyuki KIUCHI , Akihisa MURATA
发明人： Shinji HOSHINO , Yukio ARIMITSU , Kazuyuki KIUCHI , Akihisa MURATA
IPC分类号： H01L21/50 , B32B7/12
CPC分类号： H01L21/568 , H01L23/3107 , H01L23/3114 , H01L23/5389 , H01L24/24 , H01L24/96 , H01L2224/24137 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01051 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/181 , Y10T428/28 , Y10T428/287 , H01L2924/00
摘要： The present invention is intended to solve the following problems with a method for fabricating a substrateless semiconductor package using an adhesive sheet as a temporary fixing supporter. A chip can be displaced from a specified position by pressure during resin encapsulation because the chip is not properly held by the adhesive sheet. If such displacement occurs, the relative positional relationship between the chip and an interconnect to be connected to a specified position in a subsequent wiring step also changes by the displacement of the chip from the specified position. Another problem is that if adhesive deposits occur during peeling of the adhesive sheet and the surface of a package is contaminated with the adhesive deposits, adhesive components left on the surface of the chip can inhibit connection between the interconnect and the chip in a subsequent wiring step. To solve these problems, the present invention provides an adhesive sheet for semiconductor device fabrication that is attached to a substrateless semiconductor chip when the chip is encapsulated with resin. The adhesive sheet includes a base material layer and an adhesive layer. The adhesive layer has a specific adhesion strength and peel strength.
摘要翻译：本发明旨在解决使用粘合片作为临时固定支撑件制造无基底半导体封装的方法的以下问题。由于芯片没有被粘合片正确地夹持，所以在树脂封装期间，芯片可以通过压力从指定位置移位。如果发生这种位移，则芯片与在后续布线步骤中连接到指定位置的互连件之间的相对位置关系也随着芯片从指定位置的位移而改变。另一个问题是如果在粘合片剥离期间发生粘合剂沉积，并且包装表面被粘合剂沉积物污染，残留在芯片表面上的粘合剂组分可以在随后的布线步骤中阻止互连和芯片之间的连接。为了解决这些问题，本发明提供了一种用于半导体器件制造的粘合片，其在芯片被树脂封装时附接到无基底半导体芯片。粘合片包括基材层和粘合剂层。粘合剂层具有特定的粘合强度和剥离强度。

3. 发明申请

US20110067808A1 PRESSURE-SENSITIVE ADHESIVE SHEET, METHOD OF PROCESSING ADHEREND WITH THE PRESSURE-SENSITIVE ADHESIVE SHEET, AND APPARATUS FOR STRIPPING PRESSURE-SENSITIVE ADHESIVE SHEET 失效
标题翻译：压敏粘合片，压敏胶粘剂加工方法及剥离感应胶粘剂的设备
公开(公告)号：US20110067808A1
公开(公告)日：2011-03-24
申请号：US12736804
申请日：2009-05-01
申请人： Akinori Nishio , Kazuyuki Kiuchi
发明人： Akinori Nishio , Kazuyuki Kiuchi
IPC分类号： B32B38/10 , C09J7/02 , B32B27/30
CPC分类号： C09J133/10 , C09J7/29 , C09J2433/00 , H01L21/6835 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2221/68386 , Y10T156/1142 , Y10T156/1158 , Y10T156/1917 , Y10T428/2495
摘要： To provide a pressure-sensitive adhesive sheet which protects a ground, thin, fragile adherend from “warping” and which can be removed from the fragile adherend after the completion of backgrinding without damaging and contaminating the fragile adherend.The pressure-sensitive adhesive sheet 5 includes a base layer A, a pressure-sensitive adhesive layer A, a base layer B, and a pressure-sensitive adhesive layer B arranged in this order, in which: the base layer A has a product of its Young's modulus at 25° C. and its thickness of 1.0×105 to 4.0×105 N/m and a product of its Young's modulus at 80° C. and its thickness of 2.8×105 N/m or less; the pressure-sensitive adhesive layer A has a shear modulus at 80° C. of 0.2 MPa or less; the base layer B has a product of its Young's modulus at 25° C. and its thickness of smaller than that of the base layer A and has, upon 80° C. heating, a shrink percentage in MD and a shrink percentage in TD of each 20% or more; and the pressure-sensitive adhesive layer B has a Young's modulus at 80° C. of 10 MPa or more and an adhesive strength to a silicon wafer (180-degree peel at a tensile speed of 300 mm/min) of 0.2 N/10 mm or less.
摘要翻译：提供一种保护地面，薄而脆弱的被粘物从“翘曲”的压敏粘合片，并且可以在完成背面研磨之后从脆弱的被粘物上去除而不损坏和污染易碎的被粘物。粘合片5包括依次布置的基底层A，粘合剂层A，基底层B和压敏粘合剂层B，其中：基底层A具有在25℃下的杨氏模量，其厚度为1.0×10 5〜4.0×10 5 N / m，其杨氏模量为80℃，其厚度为2.8×10 5 N / m以下的乘积。压敏粘合剂层A在80℃下的剪切模量为0.2MPa以下; 基层B的杨氏模量为25℃，其厚度小于基底层A的厚度，并且在80℃加热下，MD的收缩率和TD的收缩百分比每个20％以上; 并且压敏粘合剂层B在80℃下的杨氏模量为10MPa以上，对硅晶片的粘合强度（拉伸速度为300mm / min的180度剥离）为0.2N / 10 mm以下。

4. 发明授权

US07514143B2 Re-peelable pressure-sensitive adhesive sheet 失效
标题翻译：可再剥离的压敏粘合片
公开(公告)号：US07514143B2
公开(公告)日：2009-04-07
申请号：US10912615
申请日：2004-08-05
申请人： Takeshi Matsumura , Kouji Akazawa , Kazuyuki Kiuchi , Tomokazu Takahashi
发明人： Takeshi Matsumura , Kouji Akazawa , Kazuyuki Kiuchi , Tomokazu Takahashi
IPC分类号： B32B7/12 , B05D5/10
CPC分类号： C09J7/29 , C09J2201/162 , C09J2203/326 , Y10T156/1052 , Y10T428/1471 , Y10T428/1476 , Y10T428/28 , Y10T428/2848
摘要： The re-peelable pressure-sensitive adhesive sheet of the invention is a re-peelable pressure-sensitive adhesive sheet, which comprises an adhesive layer formed over a base film, and which further comprises at least one intermediate layer between the base film and the adhesive layer, the intermediate layer having a storage elastic modulus (G′) of 3.0×104 to 1.0×108 Pa at 23° C. and a storage elastic modulus (G′) of 1.0×103 to 8.0×104 Pa at 200° C.
摘要翻译：本发明的可再剥离粘合片是一种可再剥离的压敏粘合片，其包括在基膜上形成的粘合层，并且还包括在基膜和粘合剂之间的至少一个中间层层，中间层在23℃下的储能弹性模量（G'）为3.0×10 4〜1.0×10 8 Pa，在200℃下的储能弹性模量（G'）为1.0×10 3〜8.0×10 4 Pa。

5. 发明申请

US20070111392A1 Method for thermally releasing chip cut piece from thermal release type pressure sensitive adhesive sheet, electronic component and circuit board 审中-公开
标题翻译：热释放型压敏粘合片，电子部件和电路板热切芯片切片的方法
公开(公告)号：US20070111392A1
公开(公告)日：2007-05-17
申请号：US11650449
申请日：2007-01-08
申请人： Akihisa Murata , Toshiyuki Oshima , Yukio Arimitsu , Kazuyuki Kiuchi , Masaaki Sato , Michirou Kawanishi
发明人： Akihisa Murata , Toshiyuki Oshima , Yukio Arimitsu , Kazuyuki Kiuchi , Masaaki Sato , Michirou Kawanishi
IPC分类号： H01L21/00
CPC分类号： H01L21/6836 , C09J7/22 , C09J7/38 , C09J2203/326 , C09J2205/11 , H01L2221/68327 , H01L2924/19041 , Y10T428/28
摘要： A method of overheating and releasing a chip cut piece from a thermal release type pressure sensitive adhesive sheet is a method by which a chip cut piece stuck onto a thermal release type pressure sensitive adhesive sheet having a base material, and a thermally expandable microsphere-containing thermally expandable pressure sensitive adhesive layer provided on a surface of the base material is thermally released from the thermal release type pressure sensitive adhesive sheet and which is characterized by including the step of overheating while restraining the overheat and release type pressure sensitive adhesive sheet to thereby release the chip cut piece. A means for restraining the thermal release type pressure sensitive adhesive sheet may be an absorption means using suction or may be a bonding means using an adhesive agent. In this manner, the chip cut piece can be thermally released from the overheat and release type pressure sensitive adhesive sheet while position displacement in a horizontal direction can be prevented.
摘要翻译：从热脱模型压敏粘合片过热释放切屑的方法是将切屑粘贴到具有基材的热释放型压敏粘合片和含有热膨胀性微球的热释放型微球的方法设置在基材表面上的可热膨胀的压敏粘合剂层从热释放型压敏粘合片热释放，其特征在于包括过热的步骤，同时限制过热和释放型压敏粘合片从而释放切片切片。用于抑制热释放型压敏粘合片的装置可以是使用吸附的吸收装置，或者可以是使用粘合剂的粘合装置。以这种方式，切屑切片可以从过热和释放型压敏粘合片热释放，同时可以防止在水平方向上的位置偏移。

6. 发明授权

US06998175B2 Heat-peelable pressure-sensitive adhesive sheet 失效
标题翻译：热剥离性粘合片
公开(公告)号：US06998175B2
公开(公告)日：2006-02-14
申请号：US09853787
申请日：2001-05-14
申请人： Akihisa Murata , Toshiyuki Oshima , Yukio Arimitsu , Kazuyuki Kiuchi
发明人： Akihisa Murata , Toshiyuki Oshima , Yukio Arimitsu , Kazuyuki Kiuchi
IPC分类号： C09J7/02 , B32B27/00
CPC分类号： C09J7/22 , C09J7/38 , C09J2205/11 , Y10S428/922 , Y10T428/14 , Y10T428/28 , Y10T428/2813 , Y10T428/2848 , Y10T428/2852 , Y10T428/2857 , Y10T428/2878 , Y10T428/2891
摘要： A heat-peelable pressure-sensitive adhesive sheet which, even when used for temporarily fixing electronic parts having poor resistance to static electricity, such as magnetic heads, is effective in preventing the yield of such electronic parts from being reduced by electrostatic breakage, while ensuring its functions of adhesiveness before heating and peelability after heating. The heat-peelable pressure-sensitive adhesive sheet comprises a substrate and formed on at least one side thereof a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres, wherein the heat-expandable pressure-sensitive adhesive layer has a surface resistivity of 1012 Ω/□ or lower. In this heat-peelable pressure-sensitive adhesive sheet, the heat-expandable pressure-sensitive adhesive layer before heating may have a center line average surface roughness of 2 μm or less and a maximum surface roughness of 5 μm or less. The adhesive sheet may have a rubber-like organic elastic layer interposed between the substrate and the heat-expandable pressure-sensitive adhesive layer.
摘要翻译：即使用于临时固定耐静电性差的电子部件（例如磁头）的热剥离性粘合片也能有效地防止这种电子部件的收率因静电破坏而减少，同时确保其加热前的粘合性和加热后的剥离性的功能。热剥离性粘合片包括基材，在其至少一面形成有含有热膨胀性微球的热膨胀性压敏粘合剂层，其中，热膨胀性压敏粘合剂层的表面电阻率 10 12Ω/□以下。在该热剥离性粘合片中，加热前的热膨胀性压敏粘合剂层的中心线平均表面粗糙度可以为2μm以下，最大表面粗糙度为5μm以下。粘合片可以具有插入在基板和热膨胀性压敏粘合剂层之间的橡胶状有机弹性层。

7. 发明授权

US06488803B2 Radiation-curable heat-peelable pressure-sensitive adhesive sheet and process for producing cut pieces with the same 失效
标题翻译：可辐射固化的可热剥离的压敏粘合片及其制造方法
公开(公告)号：US06488803B2
公开(公告)日：2002-12-03
申请号：US09782037
申请日：2001-02-14
申请人： Kazuyuki Kiuchi , Toshiyuki Oshima , Akihisa Murata , Yukio Arimitsu
发明人： Kazuyuki Kiuchi , Toshiyuki Oshima , Akihisa Murata , Yukio Arimitsu
IPC分类号： B32B712
CPC分类号： H01L21/6836 , C09J7/22 , C09J7/38 , C09J2203/326 , C09J2205/11 , C09J2433/00 , H01L2221/68327 , H01L2924/19041 , Y10T428/28 , Y10T428/2809 , Y10T428/2839 , Y10T428/2848 , Y10T428/2852 , Y10T428/2887
摘要： A radiation-curable heat-peelable pressure-sensitive adhesive sheet is disclosed which has tackiness enabling adherends to withstand transportation and other steps, with which cutting can be conducted without flinging up an adhesive waste or causing chipping, and from which the cut pieces can be easily separated and recovered. The radiation-curable heat-peelable pressure-sensitive adhesive sheet comprises a substrate and, formed on at least one side thereof, a pressure-sensitive adhesive layer containing heat-expandable microspheres and a radiation-curable compound. A work to be cut is placed on the surface of the pressure-sensitive adhesive layer of the radiation-curable heat-peelable pressure-sensitive adhesive sheet, and the pressure-sensitive adhesive layer is irradiated with a radiation to cure the adhesive layer. The work is cut into pieces and the pressure-sensitive adhesive layer is then thermally foamed, before the cut pieces are separated and recovered from the adhesive sheet. Thus, cut pieces can be efficiently produced without arousing troubles in processing steps.
摘要翻译：公开了一种可辐射固化的可热剥离的压敏粘合片，其具有使被粘物能够承受运输等步骤的粘性，通过该步骤可以进行切割，而不会使粘合剂废料卷起或引起碎裂，并且切割片可以从其容易分离和回收。可辐射固化的可热剥离的压敏粘合片包括基底，并且在其至少一个侧面上形成含有热膨胀性微球体和可辐射固化化合物的压敏粘合剂层。将待切割的工件放置在可辐射固化的可热剥离的压敏粘合片的压敏粘合剂层的表面上，并用辐射照射粘合剂层以固化粘合剂层。在将切割片从粘合片分离并回收之前，将工件切成块，然后将压敏粘合剂层热发泡。因此，可以有效地生产切片，而不会在加工步骤中引起麻烦。

8. 发明申请

US20130240141A1 HEAT-RESISTANT PRESSURE-SENSITIVE ADHESIVE TAPE FOR PRODUCTION OF SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING THE TAPE 审中-公开
标题翻译：用于生产半导体器件的耐热压敏粘合带和使用带生产半导体器件的方法
公开(公告)号：US20130240141A1
公开(公告)日：2013-09-19
申请号：US13418751
申请日：2012-03-13
申请人： Kazuki SOEJIMA , Shinji HOSHINO , Takamasa HIRAYAMA , Kazuyuki KIUCHI
发明人： Kazuki SOEJIMA , Shinji HOSHINO , Takamasa HIRAYAMA , Kazuyuki KIUCHI
IPC分类号： C09J5/00
CPC分类号： H01L21/568 , C09J5/06 , C09J7/38 , C09J2201/134 , C09J2203/326 , C09J2205/11 , C09J2205/302 , C09J2483/00 , H01L21/6836 , H01L24/19 , H01L24/96 , H01L2221/68327 , H01L2224/24137 , H01L2924/181 , H01L2924/00
摘要： The present invention provides a heat-resistant pressure-sensitive adhesive tape for the production of a semiconductor device, including a base material layer and a pressure-sensitive adhesive layer formed on each side of the base material layer, in which at least the pressure-sensitive adhesive layer at a side on which a semiconductor chip is to be encapsulated with a resin contains a silicone pressure-sensitive adhesive. The heat-resistant pressure-sensitive adhesive tape is used for temporarily fixing a chip in a method for producing a substrateless semiconductor package which does not use a metal lead frame.
摘要翻译：本发明提供一种用于制造半导体器件的耐热粘合带，其包括在基材层的每一侧上形成的基材层和压敏粘合剂层，其中，在其上用树脂封装半导体芯片的一侧的粘合剂层包含硅氧烷压敏粘合剂。耐热粘合带用于在不使用金属引线框架的无基板半导体封装的制造方法中临时固定芯片。

9. 发明授权

US08337656B2 Pressure-sensitive adhesive sheet, method of processing adherend with the pressure-sensitive adhesive sheet, and apparatus for stripping pressure-sensitive adhesive sheet 失效
标题翻译：压敏粘合片，用粘合片加工被粘物的方法，剥离压敏粘合片的装置
公开(公告)号：US08337656B2
公开(公告)日：2012-12-25
申请号：US12736804
申请日：2009-05-01
申请人： Akinori Nishio , Kazuyuki Kiuchi
发明人： Akinori Nishio , Kazuyuki Kiuchi
IPC分类号： B32B38/10
CPC分类号： C09J133/10 , C09J7/29 , C09J2433/00 , H01L21/6835 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2221/68386 , Y10T156/1142 , Y10T156/1158 , Y10T156/1917 , Y10T428/2495
摘要： To provide a pressure-sensitive adhesive sheet which protects a ground, thin, fragile adherend from “warping” and which can be removed from the fragile adherend after the completion of backgrinding without damaging and contaminating the fragile adherend. The pressure-sensitive adhesive sheet 5 includes a base layer A, a pressure-sensitive adhesive layer A, a base layer B, and a pressure-sensitive adhesive layer B arranged in this order, in which: the base layer A has a product of its Young's modulus at 25° C. and its thickness of 1.0×105 to 4.0×105 N/m and a product of its Young's modulus at 80° C. and its thickness of 2.8×105 N/m or less; the pressure-sensitive adhesive layer A has a shear modulus at 80° C. of 0.2 MPa or less; the base layer B has a product of its Young's modulus at 25° C. and its thickness of smaller than that of the base layer A and has, upon 80° C. heating, a shrink percentage in MD and a shrink percentage in TD of each 20% or more; and the pressure-sensitive adhesive layer B has a Young's modulus at 80° C. of 10 MPa or more and an adhesive strength to a silicon wafer (180-degree peel at a tensile speed of 300 mm/min) of 0.2 N/10 mm or less.
摘要翻译：提供一种保护地面，薄而易碎的被粘物翘曲的压敏粘合片，并且可以在完成背面研磨之后从脆弱的被粘物上除去，而不损坏和污染易碎的被粘物。粘合片5包括依次布置的基底层A，压敏粘合剂层A，基底层B和粘合剂层B，其中：基底层A具有在25℃下的杨氏模量，其厚度为1.0×10 5〜4.0×10 5 N / m，其杨氏模量为80℃，其厚度为2.8×10 5 N / m以下的乘积。压敏粘合剂层A在80℃下的剪切模量为0.2MPa以下; 基层B的杨氏模量为25℃，其厚度小于基底层A的厚度，并且在80℃加热下，MD的收缩率和TD的收缩百分比每个20％以上; 并且压敏粘合剂层B在80℃下的杨氏模量为10MPa以上，对硅晶片的粘合强度（拉伸速度为300mm / min的180度剥离）为0.2N / 10 mm以下。

10. 发明申请

US20120205030A1 SPONTANEOUSLY ROLLING ADHESIVE SHEET AND METHOD OF MANUFACTURING CUT PIECE 审中-公开
标题翻译：自动滚压胶片及其制造方法
公开(公告)号：US20120205030A1
公开(公告)日：2012-08-16
申请号：US13369886
申请日：2012-02-09
申请人： Kazuyuki KIUCHI , Akinori NISHIO
发明人： Kazuyuki KIUCHI , Akinori NISHIO
IPC分类号： B32B38/10 , B32B7/12
CPC分类号： H01L21/6836 , C09J7/29 , C09J2201/12 , C09J2203/326 , C09J2475/003 , H01L2221/68327 , Y10T428/2848
摘要： A spontaneously rolling adhesive sheet that can spontaneously roll from one end in one direction, or two opposed ends towards the center as a result of thermal stimulus to thereby form one or two cylindrical rolled bodies includes: a spontaneously rolling laminated sheet configured by lamination in the order of a shrinkable film layer which has a principal shrinking characteristic in one predetermined axial direction, a bonding adhesive layer and a rigid film layer, an adhesive layer laminated onto the rigid film layer side of the spontaneously rolling laminated sheet, and an organic coating layer disposed between the rigid film layer and the adhesive layer.
摘要翻译：一种自发滚动的粘合片，其可以从一个方向的一端自发地滚动，或者由于热刺激而从两个相对的端部向中心旋转，从而形成一个或两个圆柱形卷筒体，包括：自动卷绕层叠片，在一个预定轴向上具有主要收缩特性的可收缩膜层的顺序，粘结粘合剂层和刚性膜层，层压在自发层压片的刚性膜层侧上的粘合剂层和有机涂层设置在刚性膜层和粘合剂层之间。

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