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    • 1. 发明授权
    • Visual wear confirmation polishing pad
    • 视觉磨损确认抛光垫
    • US07442113B2
    • 2008-10-28
    • US10421421
    • 2003-04-23
    • Michael J. BermanMatthew R. Trattles
    • Michael J. BermanMatthew R. Trattles
    • B24B7/22
    • B24B37/22B24B53/017
    • A polishing pad having an upper layer with a first visual characteristic. The upper layer is adapted to erode against a pad conditioner at a uniform rate during a pad conditioning process. At least one lower layer with at least a second visual characteristic is disposed beneath the upper layer. The first visual characteristic is visually distinguishable from the second visual characteristic. The at least one lower layer is adapted to polish a substrate, where the visual distinguishability between the upper layer and the at least one lower layer provides a visual indication of whether the pad conditioning process has been accomplished in a uniform manner.
    • 一种抛光垫,具有具有第一视觉特性的上层。 在衬垫调节过程中,上层适于以均匀的速率侵蚀衬垫调节器。 具有至少第二视觉特征的至少一个下层设置在上层下方。 第一视觉特征在视觉上与第二视觉特征不同。 所述至少一个下层适于抛光基底,其中所述上层和所述至少一个下层之间的视觉可辨别性提供了以均匀方式完成所述垫调节过程的视觉指示。
    • 2. 发明授权
    • Method to monitor pad wear in CMP processing
    • 在CMP处理中监测焊盘磨损的方法
    • US07198546B2
    • 2007-04-03
    • US10879629
    • 2004-06-29
    • Michael BermanSteven RederMatthew R. Trattles
    • Michael BermanSteven RederMatthew R. Trattles
    • B24B49/00
    • B24B55/00B24B37/04B24B49/10B24B49/12
    • A pad groove analyzer and associated method configured to assess the grooves on the pad and determine how worn the pad is. The pad groove analyzer may be configured to monitor the grooves via a contact or no-contact process. In a contact process, the pad groove analyzer may include a stylus which physically contacts and moves along the pad. As the stylus falls into the grooves in the pad as the stylus moves along the pad, signals are created, and a stylus monitor uses the signals to determine to what extent the pad is worn. The stylus monitor can be configured to communicate with the general tool controller. In a no-contact process, the pad groove analyzer may take several different forms.
    • 衬垫槽分析器和相关联的方法被配置为评估衬垫上的凹槽并确定衬垫的磨损程度。 垫槽分析器可以被配置为通过接触或非接触过程来监测凹槽。 在接触处理中,垫槽分析器可以包括物理接触并沿着垫移动的触笔。 当触控笔沿着焊盘移动时,触针落入焊盘中的凹槽中,产生信号,并且触针监视器使用信号来确定焊盘在多大程度上被磨损。 触控笔监视器可以配置为与通用工具控制器进行通信。 在无接触过程中,焊盘槽分析仪可以采取几种不同的形式。
    • 3. 发明授权
    • Residual oxygen reduction system
    • 残余氧还原系统
    • US06635116B1
    • 2003-10-21
    • US09650164
    • 2000-08-29
    • Mark I. MayedaSteven E. RederRichard GimmiMatthew R. Trattles
    • Mark I. MayedaSteven E. RederRichard GimmiMatthew R. Trattles
    • C23C1600
    • C23C16/4408C23C16/4401H01L21/67017
    • An apparatus for reducing residual oxygen content from a processing chamber of an atmospheric reactor after the processing chamber of the atmospheric reactor has been exposed to an oxygen environment. The processing chamber of the atmospheric reactor has an inert gas purge, including an inert gas source, for reducing a residual oxygen level within the processing chamber of the atmospheric reactor at a rate of reduction. A venturi vacuum system is enabled by the inert gas source. The venturi vacuum system draws a vacuum on the processing chamber of the atmospheric reactor and supplements the inert gas purge, thereby accelerating the rate at which the residual oxygen level is reduced within the processing chamber of the atmospheric reactor. In this manner, the vacuum created by the venturi vacuum system increases the efficiency of the inert gas purge by reducing by some moderate degree the pressure within the processing chamber of the atmospheric reactor. This provides additional gas flow within the processing chamber to physically remove the residual oxygen from the processing chamber. However, the vacuum provided by the venturi vacuum system is not high enough to cause damage to the components of the atmospheric reactor, which are not designed to withstand the forces that are created by a relatively high vacuum.
    • 在大气反应堆的处理室之后已经暴露于氧气环境中的用于减少大气压反应器的处理室中的残留氧含量的装置。 大气反应器的处理室具有惰性气体吹扫,包括惰性气体源,用于以降低的速率降低大气反应堆的处理室内的残余氧水平。 文丘里真空系统由惰性气体源启用。 文丘里真空系统在大气反应器的处理室中抽真空,并补充惰性气体吹扫,从而加速在大气反应器的处理室内残余氧含量降低的速率。 以这种方式,由文氏管真空系统产生的真空度通过在大气反应器的处理室内的一定程度上的压力降低来提高惰性气体吹扫的效率。 这在处理室内提供额外的气流,以物理地从处理室去除残留的氧气。 然而,由文丘里真空系统提供的真空度不够高,不会对大气反应堆的组件造成损害,这些组件不是设计成能承受由较高真空产生的力。